Development of maskless electron-beam lithography using nc-Si electron-emitter array

Author(s):  
A. Kojima ◽  
N. Ikegami ◽  
T. Yoshida ◽  
H. Miyaguchi ◽  
M. Muroyama ◽  
...  
2014 ◽  
Vol 134 (6) ◽  
pp. 146-153 ◽  
Author(s):  
Hitoshi Nishino ◽  
Shinya Yoshida ◽  
Akira Kojima ◽  
Nokatsu Ikegami ◽  
Shuji Tanaka ◽  
...  

2012 ◽  
Author(s):  
N. Ikegami ◽  
T. Yoshida ◽  
A. Kojima ◽  
H. Ohyi ◽  
N. Koshida ◽  
...  

Author(s):  
L. D. Jackel

Most production electron beam lithography systems can pattern minimum features a few tenths of a micron across. Linewidth in these systems is usually limited by the quality of the exposing beam and by electron scattering in the resist and substrate. By using a smaller spot along with exposure techniques that minimize scattering and its effects, laboratory e-beam lithography systems can now make features hundredths of a micron wide on standard substrate material. This talk will outline sane of these high- resolution e-beam lithography techniques.We first consider parameters of the exposure process that limit resolution in organic resists. For concreteness suppose that we have a “positive” resist in which exposing electrons break bonds in the resist molecules thus increasing the exposed resist's solubility in a developer. Ihe attainable resolution is obviously limited by the overall width of the exposing beam, but the spatial distribution of the beam intensity, the beam “profile” , also contributes to the resolution. Depending on the local electron dose, more or less resist bonds are broken resulting in slower or faster dissolution in the developer.


2020 ◽  
Vol 59 (12) ◽  
pp. 126502
Author(s):  
Moataz Eissa ◽  
Takuya Mitarai ◽  
Tomohiro Amemiya ◽  
Yasuyuki Miyamoto ◽  
Nobuhiko Nishiyama

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