Thermal management and light extraction in multi-chip and high-voltage LEDs by cup-shaped copper heat spreader technology

2013 ◽  
Author(s):  
Ray-Hua Horng ◽  
Hung-Lieh Hu ◽  
Li-Shen Tang ◽  
Sin-Liang Ou
Keyword(s):  
Thermal Management ◽  
High Voltage ◽  
Light Extraction ◽  
Heat Spreader

scholarly journals A novel hybrid thermal management approach towards high-voltage battery pack for electric vehicles

2021 ◽  
Vol 247 ◽  
pp. 114676
Author(s):  
Lu Jin ◽  
Jun Tian ◽  
Shen Gao ◽  
Peng Xie ◽  
Mohsen Akbarzadeh ◽  
...  
Keyword(s):  
Thermal Management ◽  
Electric Vehicles ◽  
High Voltage ◽  
Battery Pack ◽  
Management Approach ◽  
High Voltage Battery

Efficient Thermal Management for High-voltage Batteries

2020 ◽  
Vol 15 (4) ◽  
pp. 50-53
Author(s):  
Stefan Deser ◽  
Martin Gall ◽  
Stefan Seidl ◽  
Jürgen Hofmann
Keyword(s):  
Thermal Management ◽  
High Voltage

Fundamental Study on Thermal Characteristics of Heat Spreaders

2011 ◽  
Author(s):  
Yasushi Koito ◽  
Yusaku Nonaka ◽  
Toshio Tomimura
Keyword(s):  
Thermal Management ◽  
Theoretical Study ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Design Parameters ◽  
Heat Spreader ◽  
Fundamental Study ◽  
Discharge Characteristics ◽  
Heat Spreaders ◽  
Large Heat

A heat spreader is one of the solutions for thermal management of electronic and photonic systems. By placing the heat spreader between a small heat source and a large heat sink, the heat flux is spread from the former to the latter, resulting in a lower thermal spreading resistance between them. There are many types of heat spreaders known today having different heat transfer modes, shapes and sizes. This paper describes the theoretical study to present the fundamental data for the rational use and thermal design of heat spreaders. Two-dimensional disk-shaped mathematical model of the heat spreader is constructed, and the dimensionless numerical analysis is performed to investigate the thermal spreading characteristics of the heat spreaders. From the numerical results, the temperature distribution and the heat flow inside the heat spreaders are visualized, and then the effects of design parameters are clarified. The discussion is also made on the discharge characteristics of the heat spreaders. Moreover, a simple equation is proposed to evaluate the heat spreaders.

Source-Sense Packages for HV MOSFETs

2013 ◽  
Vol 2013 (1) ◽  
pp. 000770-000775
Author(s):  
Anders Lind
Keyword(s):  
Thermal Management ◽  
High Voltage ◽  
Power Loss ◽  
Drain Current ◽  
Switching Loss ◽  
Power Mosfet ◽  
Switching Power ◽  
Transition Speed ◽  
Separate Source ◽  
Die Temperature

In traditional 3-pin High-Voltage (HV) power MOSFET (MOSFET) packages, the hard-switching transition speed is limited by the package source-inductance because the MOSFET drain current and gate current both share a path through the same package source inductance. The details of this mechanism are discussed and the resulting additional switching power loss caused by it is both measured and simulated. Proposed innovative “Source-Sense” packages split the two currents into separate paths by adding separate source-pin for Kelvin-type driver connection to gate-source on the chip, thus completely eliminating all switching loss incurred by the source inductance for improved efficiency and lower die temperature. Leadless SMD packages employing this method are explored for further addressing complications caused by package source inductance, such as common-mode noise and requirement for filtering. Advanced package concepts are discussed for future optimization and thermal management, and versatility of these advanced concepts as well as existing leadless SMD packages with “Source-Sense” is examined.

scholarly journals Low Thermal Expansion Metal Composite-Based Heat Spreader for High Temperature Thermal Management

2021 ◽  
pp. 109897
Author(s):  
Huanbei Chen ◽  
Feiyu Zheng ◽  
Weizheng Cheng ◽  
Peng Tao ◽  
Chengyi Song ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
High Temperature ◽  
Thermal Management ◽  
Metal Composite ◽  
Heat Spreader ◽  
Low Thermal Expansion
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