Parallax error correction techniques by image matching for ASTER/SWIR band-to-band registration

1995 ◽  
Author(s):  
Makoto Ono
Sensors ◽  
2020 ◽  
Vol 20 (19) ◽  
pp. 5676
Author(s):  
Jisung Kim ◽  
Youngdo Jeong ◽  
Hyojin Lee ◽  
Hongsik Yun

To prevent collapse accidents at construction sites, the marker-based displacement measurement method was developed. However, it has difficulty in obtaining accurate measurements at long distances (>50 m) in an outdoor environment because of camera movements. To overcome this problem, marker-based structural displacement measurement models using image matching and anomaly detection were designed in this study. Then, the performance of each model in terms of camera movement error correction was verified through comparison with that of a conventional model. The results show that the systematic errors due to camera movements (<1.7°) were corrected. The detection rate of markers with displacement reached 95%, and the probability that the error size would be less than 10 mm was ≥ 95% with a 95% confidence interval at a distance of more than 100 m. Moreover, the normalized mean square error was less than 0.1. The models developed in this study can measure the pure displacement of an object without the systematic errors caused by camera movements. Furthermore, these models can be used to measure the displacements of distant structures using closed-circuit television cameras and markers in an outdoor environment with high accuracy.


Author(s):  
A. Olsen ◽  
J.C.H. Spence ◽  
P. Petroff

Since the point resolution of the JEOL 200CX electron microscope is up = 2.6Å it is not possible to obtain a true structure image of any of the III-V or elemental semiconductors with this machine. Since the information resolution limit set by electronic instability (1) u0 = (2/πλΔ)½ = 1.4Å for Δ = 50Å, it is however possible to obtain, by choice of focus and thickness, clear lattice images both resembling (see figure 2(b)), and not resembling, the true crystal structure (see (2) for an example of a Fourier image which is structurally incorrect). The crucial difficulty in using the information between Up and u0 is the fractional accuracy with which Af and Cs must be determined, and these accuracies Δff/4Δf = (2λu2Δf)-1 and ΔCS/CS = (λ3u4Cs)-1 (for a π/4 phase change, Δff the Fourier image period) are strongly dependent on spatial frequency u. Note that ΔCs(up)/Cs ≈ 10%, independent of CS and λ. Note also that the number n of identical high contrast spurious Fourier images within the depth of field Δz = (αu)-1 (α beam divergence) decreases with increasing high voltage, since n = 2Δz/Δff = θ/α = λu/α (θ the scattering angle). Thus image matching becomes easier in semiconductors at higher voltage because there are fewer high contrast identical images in any focal series.


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