Fabrication and characterization of submicron gratings written in planar silica glass with a focused ion beam

1994 ◽  
Author(s):  
Jacques Albert ◽  
Bernard Malo ◽  
Francois Bilodeau ◽  
Derwyn C. Johnson ◽  
Kenneth O. Hill ◽  
...  
Keyword(s):  
Silica Glass ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Fabrication And Characterization ◽  
Submicron Gratings

scholarly journals Fabrication and characterization of high-TcYBa2Cu3O7−xnanoSQUIDs made by focused ion beam milling

2008 ◽  
Vol 19 (31) ◽  
pp. 315304 ◽  
Author(s):  
C H Wu ◽  
Y T Chou ◽  
W C Kuo ◽  
J H Chen ◽  
L M Wang ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Fabrication And Characterization ◽  
Focused Ion Beam Milling

Fabrication and characterization of focused-ion-beam trimmed write heads for perpendicular magnetic recording

2002 ◽  
Vol 91 (10) ◽  
pp. 6836 ◽  
Author(s):  
T. W. Clinton ◽  
P. A. A. van der Heijden ◽  
D. C. Karns ◽  
J. Yu ◽  
C. M. Park ◽  
...  
Keyword(s):  
Magnetic Recording ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Perpendicular Magnetic Recording ◽  
Write Heads ◽  
Fabrication And Characterization

Fabrication and Characterization of Micron-Sized Compression Samples using a Focused Ion Beam Microscope

2004 ◽  
Vol 10 (S02) ◽  
pp. 1126-1127 ◽  
Author(s):  
Michael D Uchic ◽  
Robert Wheeler IV ◽  
Michael J Seekely ◽  
Dennis M Dimiduk
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Fabrication And Characterization

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.

Fabrication and Characterization of NdBaCuO-Josephson Junctions on MgO-Substrates Damaged by a Focused Ion Beam

1996 ◽  
Vol 35 (Part 2, No. 1A) ◽  
pp. L15-L18 ◽  
Author(s):  
Yoshihiro Ishimaru ◽  
Yuuji Mizuno ◽  
Katsumi Suzuki ◽  
Youichi Enomoto
Keyword(s):  
Josephson Junctions ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Fabrication And Characterization

scholarly journals Fabrication and characterization of a focused ion beam milled lanthanum hexaboride based cold field electron emitter source

2018 ◽  
Vol 113 (9) ◽  
pp. 093101 ◽  
Author(s):  
Gopal Singh ◽  
Robert Bücker ◽  
Günther Kassier ◽  
Miriam Barthelmess ◽  
Fengshan Zheng ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Lanthanum Hexaboride ◽  
Electron Emitter ◽  
Field Electron ◽  
Fabrication And Characterization

Electrical Characterization of Different Failure Modes in Sub-100 nm Devices Using Nanoprobing Technique

2009 ◽  
Author(s):  
E. Hendarto ◽  
S.L. Toh ◽  
J. Sudijono ◽  
P.K. Tan ◽  
H. Tan ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Electrical Characterization ◽  
Nickel Silicide ◽  
Fault Isolation ◽  
Technology Nodes ◽  
Scanning Electron

Abstract The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.

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