Triple-level metal process for high-performance and high-density 0.6-μm/5-V application-specific integrated circuits

1993 ◽  
Author(s):  
Sharad Prasad ◽  
M. Bruner ◽  
Fusen E. Chen ◽  
Mitan Gandhi ◽  
Y. C. Lu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
High Density ◽  
Application Specific Integrated Circuits ◽  
Application Specific

Performance of Thermal Enhancements in Chip on Flex

1999 ◽  
Author(s):  
Gary Miller ◽  
Chittaranjan Sahay
Keyword(s):  
Integrated Circuits ◽  
Thermal Performance ◽  
Building Blocks ◽  
High Density ◽  
Successful Implementation ◽  
Engine Control ◽  
General Electric ◽  
Application Specific Integrated Circuits ◽  
Thermal Enhancement ◽  
Application Specific

Abstract The paper describes the development of encapsulated multiple chip on flex (COF) as Industry Common Building Blocks (CBB) as an economic alternative to high cost Application Specific Integrated Circuits (ASIC). Lockheed Martin/ General Electric developed the high density interconnect (HDI) structure used in these modules. The successful implementation of such CBB has been demonstrated in a F414 FADEC (Full Authority Digital Engine Control). The paper describes the construction of these COF CBB modules and their thermal performance with several thermal enhancement techniques.

scholarly journals A Brief Overview of On-Chip Voltage Regulation in High-Performance and High-Density Integrated Circuits

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 813-826
Author(s):  
Farid Uddin Ahmed ◽  
Zarin Tasnim Sandhie ◽  
Liaquat Ali ◽  
Masud H. Chowdhury
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Voltage Regulation ◽  
High Density ◽  
On Chip

Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

MRS Bulletin ◽  
1993 ◽  
Vol 18 (6) ◽  
pp. 46-51 ◽  
Author(s):  
S.P. Murarka ◽  
J. Steigerwald ◽  
R.J. Gutmann
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Ohmic Contacts ◽  
Access Time ◽  
Gigascale Integration ◽  
Interlayer Dielectric ◽  
Application Specific Integrated Circuits ◽  
Large Scale Integration ◽  
Scale Integration ◽  
Application Specific

Continuing advances in the fields of very-large-scale integration (VLSI), ultralarge-scale integration (ULSI), and gigascale integration (GSI), leading to the continuing development of smaller and smaller devices, have continually challenged the fields of materials, processes, and circuit designs. The existing metallization schemes for ohmic contacts, gate metal, and interconnections are inadequate for the ULSI and GSI era. An added concern is the reliability of aluminum and its alloys as the current carrier. Also, the higher resistivity of Al and its use in two-dimensional networks have been considered inadequate, since they lead to unacceptably high values of the so-called interconnection delay or RC delay, especially in microprocessors and application-specific integrated circuits (ICs). Here, R refers to the resistance of the interconnection and C to the total capacitance associated with the interlayer dielectric. For the fastest devices currently available and faster ones of the future, the RC delay must be reduced to such a level that the contribution of RC to switching delays (access time) becomes a small fraction of the total, which is a sum of the inherent device delay associated with the semiconductor, the device geometry and type, and the RC delay.

scholarly journals FPGAs in Client Compute Hardware

2021 ◽  
Author(s):  
Michael Mattioli
Keyword(s):  
Integrated Circuits ◽  
Field Programmable Gate Arrays ◽  
Gate Arrays ◽  
Application Specific Integrated Circuits ◽  
Field Programmable ◽  
Programmable Gate Arrays ◽  
And Performance ◽  
Application Specific

<div>Field-programmable gate arrays (FPGAs) are remarkably versatile. FPGAs are used in a wide variety of applications and industries where use of application-specific integrated circuits (ASICs) is less economically feasible. Despite the area, cost, and power challenges designers face when integrating FPGAs into devices, they provide significant security and performance benefits. Many of these benefits can be realized in client compute hardware such as laptops, tablets, and smartphones.</div>

Monolithical integration of polymer-based microfluidic structures on application-specific integrated circuits

2003 ◽  
Author(s):  
Steffen Chemnitz ◽  
Heiko Schafer ◽  
Stephanie Schumacher ◽  
Volodymyr Koziy ◽  
Alexander Fischer ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Application Specific Integrated Circuits ◽  
Application Specific

Application-Specific Integrated Circuits

2011 ◽  
pp. 71-71 ◽  
Author(s):  
Rajesh K. Karmani ◽  
Gul Agha ◽  
Mark S. Squillante ◽  
Joel Seiferas ◽  
Marian Brezina ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Application Specific Integrated Circuits ◽  
Application Specific
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