Tantalum and tantalum nitride films deposited by electron cyclotron resonance sputtering as barriers to copper diffusion
1999 ◽
Vol 17
(5)
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pp. 2385
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1984 ◽
Vol 45
(C1)
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pp. C1-961-C1-963
Keyword(s):
1998 ◽
Vol 69
(2)
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pp. 1129-1131
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2017 ◽
Vol 20
(10)
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