Thermal stability of rapidly annealed indium tin oxide/n-GaAs heterostructures

1995 ◽  
Vol 13 (4) ◽  
pp. 1560 ◽  
Author(s):  
G. Eftekhari
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Thermal Stability Of

Thermal stability of indium-tin-oxide/n-GaAs Schottky diodes

1992 ◽  
Vol 28 (2) ◽  
pp. 142 ◽  
Author(s):  
Y.H. Aliyu ◽  
D.V. Morgan ◽  
R.W. Bunce
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Schottky Diodes ◽  
Thermal Stability Of

Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass

2003 ◽  
Vol 17 (15) ◽  
pp. 2085-2095 ◽  
Author(s):  
J. H. Hsieh ◽  
Tzong-Ming Wu ◽  
J. Z. Tong ◽  
Y. S. Yang
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Coated Glass ◽  
Cr Film ◽  
Thermal Stability Of

The Thermal Stability of Indium-Tin-Oxide/n-GaAs Schottky Contacts

1992 ◽  
Vol 133 (1) ◽  
pp. 77-93 ◽  
Author(s):  
D. V. Morgan ◽  
Y. Aliyu ◽  
R. W. Bunce
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Schottky Contacts ◽  
Thermal Stability Of

Thermal stability of indium tin oxide thin films co-sputtered with zinc oxide

2008 ◽  
Vol 516 (10) ◽  
pp. 3196-3203 ◽  
Author(s):  
Day-Shan Liu ◽  
Chia-Sheng Sheu ◽  
Ching-Ting Lee ◽  
Chun-Hsing Lin
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Zinc Oxide ◽  
Tin Oxide ◽  
Indium Tin Oxide ◽  
Oxide Thin Films ◽  
Thermal Stability Of

scholarly journals Electroless Plating – Its Applications in Resistor Technology

1976 ◽  
Vol 3 (2) ◽  
pp. 103-111 ◽  
Author(s):  
J. Dearden
Keyword(s):  
Thermal Stability ◽  
Tin Oxide ◽  
Electroless Nickel ◽  
Temperature Sensors ◽  
Metal Films ◽  
Temperature Coefficient Of Resistance ◽  
Distribution Requirement ◽  
Improved Performance ◽  
Mylar Sheet ◽  
Thermal Stability Of

Electroless processes for the deposition of metal films onto insulators have been known for many years. Various aspects of this technology have been applied in the field of resistor technology leading to improved performance of existing resistors and the evaluation of new resistors with novel characteristics.The applications of electroless nickel as a readily solderable, completely ohmic contact for tin oxide resistors is described.Copper oxide layers produced from oxidised electroless copper are shown to improve the thermal stability of tin oxide resistors.A range of electroless high precision metal film resistors from a fraction of an ohm to 100 kohm per square and from a few millimetres in length to over 1 metre is shown to be feasible. This technology has been applied to the manufacture of thin film circuits.The outstanding thermal stability of the electroless nickel-boron films and their temperature coefficient of resistance indicates a potential application in the field of temperature sensors.The ability to produce “weightless” films on Mylar sheet at 10 Gohm per square is considered to be a solution to the charge distribution requirement for electrostatic loudspeakers.

Thermal stability of aluminum‐tin‐oxide thin‐film interface

1988 ◽  
Vol 64 (3) ◽  
pp. 1238-1244 ◽  
Author(s):  
E. Eser ◽  
F. Ramos ◽  
J. Grez
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Tin Oxide ◽  
Oxide Thin Film ◽  
Film Interface ◽  
Thermal Stability Of
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