Structural characterization of encapsulated Au/Zn/Au ohmic contacts to p-type GaAs

Author(s):  
X. W. Lin
2003 ◽  
Vol 18 (6) ◽  
pp. 554-559 ◽  
Author(s):  
F Moscatelli ◽  
A Scorzoni ◽  
A Poggi ◽  
G C Cardinali ◽  
R Nipoti

1992 ◽  
Vol 283 ◽  
Author(s):  
T. R. Cottrell ◽  
J. B. Benziger ◽  
J. C. Yee ◽  
J. K. M. Chunt ◽  
A. B. Bocarslyt

ABSTRACTOrganic-inorganic junctions were formed between porous silicon and various conjugated conducting polymers, poly(3-methylthiophene) and polypyrrole. Schottky type barriers were observed between the conducting polymers in their doped state and p and n-type porous silicon. In their undoped state the conducting polymers behave like p-type semiconductors. Consistent with this, ohmic contacts were observed between undoped conducting polymers and p-type porous silicon while rectifying behavior typical of a p-n junction was observed for conducting polymers deposited onto n-type porous silicon. During characterization of the porous silicon substrate, an investigation of the surface chemistry revealed a strong correspondence between solution pH and the luminescence intensity of porous silicon. Surface titration experiments were performed on p and n-type porous silicon and the results indicate that a monoprotic surface acid with a pKa between 3–4 is a primary component in the luminescence mechanism of porous silicon.


2006 ◽  
Vol 22 (2) ◽  
pp. 10-14 ◽  
Author(s):  
E Przeździecka ◽  
E Kamińska ◽  
K P Korona ◽  
E Dynowska ◽  
W Dobrowolski ◽  
...  

2000 ◽  
Vol 338-342 ◽  
pp. 1017-1020 ◽  
Author(s):  
Konstantin Vassilevski ◽  
Konstantinos Zekentes ◽  
George Konstantinidis ◽  
N. Papanicolaou ◽  
Irina P. Nikitina ◽  
...  

2019 ◽  
Vol 114 (19) ◽  
pp. 192103
Author(s):  
J. R. Toledo ◽  
R. de Oliveira ◽  
P. H. Vaz ◽  
F. D. Brandão ◽  
G. M. Ribeiro ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 485-489
Author(s):  
Monia Spera ◽  
Giuseppe Greco ◽  
Raffaella Lo Nigro ◽  
Salvatore di Franco ◽  
Domenico Corso ◽  
...  

This paper reports on the formation and characterization of Ohmic contacts to n-type and p-type type 3C-SiC layers grown on silicon substrates. In particular, Ohmic contact behavior was obtained either using Ni or Ti/Al/Ni layers annealed at 950°C. The values of the specific contact resistance ρc estimated by means of circular TLM (C-TLM) structures varied in the range ~ 10-3-10-5 Ωcm2, depending on the doping level of the 3C-SiC layer. A structural analysis performed by X-Ray Diffraction (XRD) allowed to identify the main phases formed upon annealing, i.e., Ni2Si and Al3Ni2. The morphology of the reacted contacts depended on that of the underlying substrate. The results can be useful for the development of a variety of devices on the cubic 3C-SiC polytype.


2000 ◽  
Vol 622 ◽  
Author(s):  
S.-K. Lee ◽  
E. Danielsson ◽  
C.-M. Zetterling ◽  
M. Östling ◽  
J.-P. Palmquist ◽  
...  

ABSTRACTEpitaxial TiC Ohmic and Schottky contacts to 4H-SiC were formed by a new deposition method, UHV co-evaporation with Ti and C60, at low temperature (< 500°C). We achieved a contact resistivity of 2 × 10−5Δcm2 at 25°C for as deposited Ohmic contacts on Al ion implanted 4H-Silicon carbide. The rectifying behavior of TiC Schottky contacts was also investigated using I-V and C-V. The measured Schottky barrier height (SBH) was 1.26 eV for n-type and 1.65 eV for p-type 4H-SiC using C-V measurements for frequencies ranging from 1kHz to 1MHz. LEED, RBS, XPS, and XRD measurements were performed to analyze composition ratio, interface reaction, and structural properties of the TiC epitaxial layer.


2017 ◽  
Author(s):  
N. H. Abd Wahab ◽  
A. F. Abd Rahim ◽  
A. Mahmood ◽  
Y. Yusof

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