Sputter deposition and annealing of Ta, TaSix and TaBx composite films and their application in next generation lithography masks

2000 ◽  
Vol 18 (4) ◽  
pp. 1119-1124 ◽  
Author(s):  
Kenneth Racette ◽  
Cameron Brooks ◽  
C. Richard Guarnieri ◽  
Dennis Hendy
Keyword(s):  
Composite Films ◽  
Sputter Deposition ◽  
Next Generation ◽  
Next Generation Lithography

Reduce process bias of photomask manufacturing for next-generation lithography

2004 ◽  
Author(s):  
Booky Lee ◽  
Sharon Wang ◽  
Toroy Tian ◽  
Samuel Yang ◽  
Roy Chen
Keyword(s):  
Next Generation ◽  
Next Generation Lithography

Maximizing piezoelectricity by self-assembled highly porous perovskite–polymer composite films to enable the internet of things

2020 ◽  
Vol 8 (27) ◽  
pp. 13619-13629 ◽  
Author(s):  
Asif Abdullah Khan ◽  
Md Masud Rana ◽  
Guangguang Huang ◽  
Nanqin Mei ◽  
Resul Saritas ◽  
...  
Keyword(s):  
Internet Of Things ◽  
Polymer Composite ◽  
High Performance ◽  
Composite Films ◽  
The Internet ◽  
Next Generation ◽  
Self Assembled ◽  
Self Powered ◽  
The Internet Of Things ◽  
Highly Porous

A high-performance perovskite/polymer piezoelectric nanogenerator for next generation self-powered wireless micro/nanodevices.

E-beam writing: a next-generation lithography approach for thin-film head critical features

2002 ◽  
Vol 38 (1) ◽  
pp. 95-100 ◽  
Author(s):  
R.E. Fontana ◽  
J. Katine ◽  
M. Rooks ◽  
R. Viswanathan ◽  
J. Lille ◽  
...  
Keyword(s):  
Thin Film ◽  
Next Generation ◽  
Next Generation Lithography

scholarly journals Mechanically Robust Flexible Multilayer Aramid Nanofibers and MXene Film for High-Performance Electromagnetic Interference Shielding and Thermal Insulation

Nanomaterials ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 3041
Author(s):  
Jun Zhou ◽  
Junsheng Yu ◽  
Dongyu Bai ◽  
Huili Liu ◽  
Lu Li
Keyword(s):  
Mechanical Properties ◽  
Composite Film ◽  
Electromagnetic Interference ◽  
Multilayer Structure ◽  
High Performance ◽  
Composite Films ◽  
Next Generation ◽  
Shielding Effectiveness ◽  
Breaking Strain ◽  
Practical Applications

In order to overcome the various defects caused by the limitations of solid metal as a shielding material, the development of electromagnetic shielding materials with flexibility and excellent mechanical properties is of great significance for the next generation of intelligent electronic devices. Here, the aramid nanofiber/Ti3C2Tx MXene (ANF/MXene) composite films with multilayer structure were successfully prepared through a simple alternate vacuum-assisted filtration (AVAF) process. With the intervention of the ANF layer, the multilayer-structure film exhibits excellent mechanical properties. The ANF2/MXene1 composite film exhibits a tensile strength of 177.7 MPa and a breaking strain of 12.6%. In addition, the ANF5/MXene4 composite film with a thickness of only 30 μm exhibits an electromagnetic interference (EMI) shielding efficiency of 37.5 dB and a high EMI-specific shielding effectiveness value accounting for thickness (SSE/t) of 4718 dB·cm2 g−1. Moreover, the composite film was excellent in heat-insulation performance and in avoiding light-to-heat conversion. No burning sensation was produced on the surface of the film with a thickness of only 100 μm at a high temperature of 130 °C. Furthermore, the surface of the film was only mild when touched under simulated sunlight. Therefore, our multilayer-structure film has potential significance in practical applications such as next-generation smart electronic equipment, communications, and military applications.

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