Target compound layer formation during reactive sputtering

1999 ◽  
Vol 17 (4) ◽  
pp. 1827-1831 ◽  
Author(s):  
L. B. Jonsson ◽  
T. Nyberg ◽  
S. Berg
Keyword(s):  
Reactive Sputtering ◽  
Compound Layer ◽  
Layer Formation ◽  
Target Compound

Interfacial Microstructure of Diffusion-Bonded and Annealed Cu-10Fe/Al6061 Clad Material

2012 ◽  
Vol 248 ◽  
pp. 60-65
Author(s):  
Ju Young Jin ◽  
Sun Ig Hong
Keyword(s):  
Diffusion Bonding ◽  
Energy Dispersive Spectrometry ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Intermetallic Compound Layer ◽  
Strengthening Effect ◽  
Layer Formation ◽  
Al 6061 ◽  
Kinetics Of ◽  
Intermetallic Layers

Diffusion bonding between the Cu-10%Fe and Al6061 alloys were successfully achieved at various temperatures (450-525°C) in the argon atmosphere. The bonding interface regions were analyzed using scanning electron microscopy and energy dispersive spectrometry and XRD. The presence of Fe particles in Cu was found to have an influence on the kinetics of intermetallic compound layer formation. Cu-Fe/Al 6061 exhibited the slower growth rate of intermetallic layers than Cu/Al 6061 after diffusion bonding. The movement of Cu-Fe/Cu9Al4 interface into Cu-Fe substrate appears to be hindered by the presence of populated Fe-containing particles and filaments. In addition to Cu9Al4, CuAl and CuAl2 intermetallic layers, Al7Cu2Fe and unreacted Fe were observed to be present in the intermetallic layers. The intermetallic layers which are close to Cu such as Cu9Al4 and CuAl were observed to be harder in Cu-10%Fe/Al 6061 than in Cu/Al 6061, suggesting Fe and its intermetallics have some strengthening effect on Cu9Al4 and CuAl.

scholarly journals Fe Nitride Formation in Fe–Si Alloys: Crystallographic and Thermodynamic Aspects

2021 ◽  
Author(s):  
Stefan Kante ◽  
Andreas Leineweber
Keyword(s):  
Single Phase ◽  
Compound Layer ◽  
Nitride Layer ◽  
Layer Formation ◽  
Orientation Relationships ◽  
Transformation Mechanism ◽  
Displacive Transformation ◽  
Nitride Formation ◽  
Nitriding Potential ◽  
Stability Ranges

AbstractA Fe–3wt pctSi alloy was gas nitrided to study the effect of Si on the Fe nitride formation. Both ε-Fe3N1+x and γ′-Fe4N were observed at nitriding conditions only allowing to form single-phase γ′ layers in pure α-Fe. During short nitriding times, ε and γ′ simultaneously grow in contact with Si-supersaturated α-Fe(Si). Both nitrides almost invariably exhibit crystallographic orientation relationships with α-Fe, which are indicative of a partially displacive transformation of α-Fe being involved in the initial formation of ε and γ′. Due to Si constraining the Fe nitride growth, such transformation mechanism becomes highly important to the nitride layer formation, causing α-Fe-grain-dependent variations in the nitride layer morphology and thickness, as well as microstructure refinement within the nitride layer. After prolonged nitriding, α-Fe is depleted in Si due the pronounced precipitation of Si-rich nitride in α-Fe. The growth mode of the compound layer changes, now advancing by conventional planar-type growth. During nitriding times of 1 to 48 hours, ε exists in contact with the NH3/H2-containing nitriding atmosphere at a nitriding potential of 1 atm−1/2 and 540 °C, only allowing for the formation of γ′ in pure Fe, indicating that Si affects the thermodynamic stability ranges of ε and γ′.

Processing with Nitriding

2003 ◽  
pp. 153-161
Keyword(s):  
High Speed ◽  
High Speed Steel ◽  
Compound Layer ◽  
Case Depth ◽  
Low Alloy Steels ◽  
Layer Formation ◽  
Tool Steels ◽  
Maraging Steels ◽  
Alloy Steels ◽  
Hot Work Tool Steels

Abstract The nitriding process can be applied to various materials and part geometries. This chapter focuses on tool steels (hot-work tool steels, high-speed steel cutters, and gears), pure irons, low-alloy steels, and maraging steels. Various considerations such as the surface metallurgy requirements of the die, including case depth, compound layer formation, and temperature, are also discussed in this chapter.

Intermetallic compound layer formation between Au and In-48Sn solder

1999 ◽  
Vol 40 (7) ◽  
pp. 815-820 ◽  
Author(s):  
I Shohji ◽  
S Fujiwara ◽  
S Kiyono ◽  
K.F Kobayashi
Keyword(s):  
Intermetallic Compound ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Layer Formation

Compound Layer Formation During Plasma Nitriding and Plasma Nitrocarburising

1993 ◽  
Vol 9 (1) ◽  
pp. 69-76 ◽  
Author(s):  
T. Lampe ◽  
S. Eisenberg ◽  
G. Laudien
Keyword(s):  
Plasma Nitriding ◽  
Compound Layer ◽  
Layer Formation

scholarly journals Effects of preheat time in compound layer formation

1958 ◽  
Author(s):  
C.A. Strand ◽  
E.V. Padgett
Keyword(s):  
Compound Layer ◽  
Layer Formation
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