Obtaining extremely high vacuum using sintered fine copper powder as a cryosorbent

Minsheng Xu; Yutaka Matsui

doi:10.1116/1.579426

Obtaining extremely high vacuum using sintered fine copper powder as a cryosorbent

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.579426 ◽

1995 ◽

Vol 13 (1) ◽

pp. 132-135 ◽

Cited By ~ 2

Author(s):

Minsheng Xu ◽

Yutaka Matsui

Keyword(s):

Copper Powder ◽

High Vacuum ◽

Fine Copper

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Preparation of Fine Copper Powder With Chemical Reduction Method and Its Application in MLCC

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2007.898512 ◽

2007 ◽

Vol 30 (3) ◽

pp. 434-438 ◽

Cited By ~ 11

Author(s):

Songping Wu ◽

Xiaohong Ding

Keyword(s):

Copper Powder ◽

Reduction Method ◽

Chemical Reduction ◽

Chemical Reduction Method ◽

Fine Copper

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Coating Fine Copper Powder with Polyaniline

Journal of Dispersion Science and Technology ◽

10.1080/01932690701688490 ◽

2008 ◽

Vol 29 (1) ◽

pp. 97-100 ◽

Cited By ~ 9

Author(s):

Jizhong Chen ◽

Yanhui Guo ◽

Binbo Jiang ◽

Shijie Zhang

Keyword(s):

Copper Powder ◽

Fine Copper

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Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC

Materials Letters ◽

10.1016/j.matlet.2006.06.068 ◽

2007 ◽

Vol 61 (4-5) ◽

pp. 1125-1129 ◽

Cited By ~ 68

Author(s):

Songping Wu

Keyword(s):

Ascorbic Acid ◽

Copper Powder ◽

Reducing Agent ◽

Fine Copper

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Metallic aerogels: A novel synthesis of very fine copper powder

Materials Letters ◽

10.1016/0167-577x(86)90074-1 ◽

1986 ◽

Vol 4 (8-9) ◽

pp. 373-376 ◽

Cited By ~ 12

Author(s):

J.N. Armor ◽

E.J. Carlson ◽

G. Carrasquillo

Keyword(s):

Copper Powder ◽

Novel Synthesis ◽

Fine Copper

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The production of very fine copper powder

Soviet Powder Metallurgy and Metal Ceramics ◽

10.1007/bf00774271 ◽

1964 ◽

Vol 2 (3) ◽

pp. 190-194

Author(s):

N. T. Kudryavtsev ◽

N. I. Mikhailov ◽

A. A. Novikov

Keyword(s):

Copper Powder ◽

Fine Copper

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Preparation of ultra-fine copper powder and its lead-free conductive thick film

Materials Letters ◽

10.1016/j.matlet.2006.11.128 ◽

2007 ◽

Vol 61 (16) ◽

pp. 3526-3530 ◽

Cited By ~ 16

Author(s):

Songping Wu

Keyword(s):

Thick Film ◽

Copper Powder ◽

Lead Free ◽

Fine Copper

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Production of Fine Copper Powder by Disproportionation Reaction of Cuprous Sulfate Solution (3rd Report). Formation Mechanism of Fine Copper Powder by Disproportionation Reaction.

Shigen-to-Sozai ◽

10.2473/shigentosozai.110.1127 ◽

1994 ◽

Vol 110 (14) ◽

pp. 1127-1132

Author(s):

Hitoshi SASAKI ◽

Takanori SUDA ◽

Akimichi MATSUNAGA ◽

Kohji MATSUDA ◽

Kohji ATARASHIYA ◽

...

Keyword(s):

Formation Mechanism ◽

Copper Powder ◽

Sulfate Solution ◽

Disproportionation Reaction ◽

Cuprous Sulfate ◽

Fine Copper

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Continuous production of fine copper powder by disproportionation of sulphate solutions

Metal Powder Report ◽

10.1016/s0026-0657(99)81109-6 ◽

1995 ◽

Vol 50 (3) ◽

pp. 36

Keyword(s):

Copper Powder ◽

Continuous Production ◽

Fine Copper

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Electroless silver coating on fine copper powder and its effects on oxidation resistance

Materials Letters ◽

10.1016/s0167-577x(03)00252-0 ◽

2003 ◽

Vol 57 (24-25) ◽

pp. 3987-3991 ◽

Cited By ~ 126

Author(s):

Xinrui Xu ◽

Xiaojun Luo ◽

Hanrui Zhuang ◽

Wenlan Li ◽

Baolin Zhang

Keyword(s):

Oxidation Resistance ◽

Copper Powder ◽

Silver Coating ◽

Fine Copper

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Production of fine copper powder by disproportionation reactions of solutions

Metal Powder Report ◽

10.1016/0026-0657(95)91765-9 ◽

1995 ◽

Vol 50 (1) ◽

pp. 41

Keyword(s):

Copper Powder ◽

Fine Copper

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