Preparation of ultra-fine copper powder and its lead-free conductive thick film

2007 ◽  
Vol 61 (16) ◽  
pp. 3526-3530 ◽  
Author(s):  
Songping Wu
Keyword(s):  
Thick Film ◽  
Copper Powder ◽  
Lead Free ◽  
Fine Copper

Large electrocaloric effect in lead-free Ba(ZrxTi1-x)O3 thick film ceramics

2018 ◽  
Vol 742 ◽  
pp. 165-171 ◽  
Author(s):  
Xiao-Dong Jian ◽  
Biao Lu ◽  
Dan-Dan Li ◽  
Ying-Bang Yao ◽  
Tao Tao ◽  
...  
Keyword(s):  
Thick Film ◽  
Lead Free ◽  
Electrocaloric Effect

Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor

2010 ◽  
Vol 2010 (1) ◽  
pp. 000752-000759
Author(s):  
Xudong Chen ◽  
W. Kinzy Jones
Keyword(s):  
Electrical Properties ◽  
Temperature Coefficient ◽  
Thick Film ◽  
Glass Frit ◽  
Lead Free ◽  
Temperature Coefficient Of Resistance ◽  
Film Resistor ◽  
Thick Film Resistor ◽  
Glass Compositions ◽  
Free Glass

Glass frit is a major component of thick film resistor (TFR) for the production of hybrid circuits. More than thirty commercial lead-free glass frits with different compositions have been evaluated for developing a lead-free thick film resistor that is compatible with typical industry thick film processing and has comparable electrical properties as the lead bearing counterpart. Two glass compositions were selected out of 33 candidates for preparation of RuO2 based TFR inks, which were screen printed on alumina substrates and fired at 850°C. The preliminary results of these resistors showed that the sheet resistance spanned from 400 ohms per square (Ω/□) to 0.4 mega-ohms per square (MΩ/□) with 5–15% RuO2 and the hot temperature coefficient of resistance (HTCR) fell in a range of ±350ppm/°C.

Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering Processes

2014 ◽  
Vol 2014 (1) ◽  
pp. 000251-000257
Author(s):  
Steven Grabey ◽  
Samson Shahbazi ◽  
Sarah Groman ◽  
Catherine Munoz
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Elevated Temperatures ◽  
Printed Electronics ◽  
High Reliability ◽  
Sem Analysis ◽  
Lead Free ◽  
Sac305 Solder ◽  
Soldering Process ◽  
Lead Free Solders

An increased interest in low temperature polymer thick film products has become apparent due to the rise of the printed electronics market. The specifications for these products are becoming more demanding with expectations that the low temperature products should perform at a level that is typically reserved for their high temperature counterparts; including solderability with lead free solders, high reliability and strong adhesion. Traditionally, it has only been possible to use leaded solders for soldering to polymer based thick film conductors. Over the last 15 years environmental concerns and legislation have pushed the industry towards a lead free approach. The shift to lead free solders, while beneficial, provides new challenges during processing. The high temperatures required for a lead-free soldering process yield a naturally harsher environment for polymer thick film pastes. In the past these conditions have proven too harsh for the pastes to survive. The polymer thick film discussed in this document aims to address some of these concerns for a highly reliable and easy to process polymer thick film paste. Due to the poor leaching characteristics of polymer thick films, at elevated temperatures, the predecessors of this paste typically soldered at low temperatures with leaded solders. The goal of this paper is to present a low temperature paste that is compatible with a variety of substrates and readily accepts lead-free solder. This paper will discuss a newly formulated low temperature curing (150°C – 200°C) RoHS and REACH compliant paste that shows excellent solderability with SAC305 solder. The paste was evaluated using a dip soldering method at 235°C–250°C on a variety of substrates. The data presented includes solder acceptance, adhesion data, thermal analysis and SEM analysis.

Coating Fine Copper Powder with Polyaniline

2008 ◽  
Vol 29 (1) ◽  
pp. 97-100 ◽  
Author(s):  
Jizhong Chen ◽  
Yanhui Guo ◽  
Binbo Jiang ◽  
Shijie Zhang
Keyword(s):  
Copper Powder ◽  
Fine Copper

Aerosol-deposited KNN–LSO lead-free piezoelectric thick film for high frequency transducer applications

2010 ◽  
Vol 163 (1) ◽  
pp. 226-230 ◽  
Author(s):  
S.T. Lau ◽  
X. Li ◽  
Q.F. Zhou ◽  
K.K. Shung ◽  
J. Ryu ◽  
...  
Keyword(s):  
Thick Film ◽  
High Frequency ◽  
Lead Free ◽  
Frequency Transducer ◽  
High Frequency Transducer

Metallic aerogels: A novel synthesis of very fine copper powder

1986 ◽  
Vol 4 (8-9) ◽  
pp. 373-376 ◽  
Author(s):  
J.N. Armor ◽  
E.J. Carlson ◽  
G. Carrasquillo
Keyword(s):  
Copper Powder ◽  
Novel Synthesis ◽  
Fine Copper

scholarly journals Study of lead free ferroelectrics using overlay technique on thick film microstrip ring resonator

2016 ◽  
Vol 10 (1) ◽  
pp. 41-46
Author(s):  
Shridhar Mathad ◽  
Maruti Rendale ◽  
Roopali Jadhav ◽  
Vijaya Puri
Keyword(s):  
Thick Film ◽  
Complex Permittivity ◽  
Ring Resonator ◽  
Low Cost ◽  
Solid State Reaction Method ◽  
Lead Free ◽  
Strontium Barium ◽  
Microstrip Ring ◽  
Very High Frequencies ◽  
Microstrip Ring Resonator

The lead free ferroelectrics, strontium barium niobates, were synthesized via the low cost solid state reaction method and their fritless thick films were fabricated by screen printing technique on alumina substrate. The X band response (complex permittivity at very high frequencies) of Ag thick film microstrip ring resonator perturbed with strontium barium niobates (SrxBa1-xNb2O6) in form of bulk and thick film was measured. A new approach for determination of complex permittivity (?? and ???) in the frequency range 8-12GHz, using perturbation of Ag thick film microstrip ring resonator (MSRR), was applied for both bulk and thick film of strontium barium niobates (SrxBa1-xNb2O6). The microwave conductivity of the bulk and thick film lie in the range from 1.779 S/cm to 2.874 S/cm and 1.364 S/cm to 2.296 S/cm, respectively. The penetration depth of microwave in strontium barium niobates is also reported.

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