High selectivity electron cyclotron resonance etching of submicron polysilicon gate structures

1992 ◽  
Vol 10 (4) ◽  
pp. 1217-1226 ◽  
Author(s):  
Diana X. Ma ◽  
Tsu‐An Lin ◽  
Ching‐Hwa Chen
1996 ◽  
Vol 17 (7) ◽  
pp. 338-340 ◽  
Author(s):  
Huang-Chung Cheng ◽  
Tzong-Kuei Kang ◽  
Tzun-Kun Ku ◽  
Bau-Tong Dai ◽  
Liang-Po Chen

1996 ◽  
Vol 449 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. R. Abernathy ◽  
R. G. Wilson ◽  
B. L. Chai ◽  
...  

ABSTRACTLiGaO2 and LiAlO2 have similar lattice constants to GaN, and may prove useful as substrates for III-nitride epitaxy. We have found that these materials may be wet chemically etched in a number of acid solutions, including HF, at rates between 150–40,000 Å/min. Dry etching with SF6/Ar plasmas provides faster rates than Cl2/Ar or CH4/H2/Ar under Electron Cyclotron Resonance conditions, indicating the fluoride etch products are more volatile that their chloride or metalorganic/hydride counterparts. Dry etch rates are low ( < 2, 000 Å/min), providing high selectivity (>5) over the nitrides. The incorporation of hydrogen in these materials is also of interest because this could provide a reservoir of hydrogen that may passivate dopants in overlying nitride films. In 2H implanted samples, 50 % of the deuterium is lost by evolution from the surface by annealing at 400 °C for 20 min and all of the deuterium is gone at 700°C. The diffusivity of 2H is ∼10-13 cm2/s at 250°C in LiA1O2, approximately two orders of magnitude higher than in LiGaO2.


1996 ◽  
Vol 35 (Part 1, No. 2A) ◽  
pp. 578-583
Author(s):  
Tzong-Kuei Kang ◽  
Shih-Yuan Ueng ◽  
Bau-Tong Dai ◽  
Liang-Po Chen ◽  
Huang-Chung Cheng

1994 ◽  
Vol 30 (1) ◽  
pp. 84-85 ◽  
Author(s):  
R.J. Shul ◽  
D.J. Rieger ◽  
C. Constantine ◽  
A.G. Baca ◽  
C. Barratt

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