Fabrication process of integrated inductors on flexible substrate for radio frequency and microwave applications

2020 ◽  
Vol 38 (2) ◽  
pp. 023204 ◽  
Author(s):  
Wilson J. Freitas ◽  
Maria H. O. Piazzetta ◽  
Leandro T. Manera ◽  
Ângelo L. Gobbi
Keyword(s):  
Radio Frequency ◽  
Flexible Substrate ◽  
Fabrication Process ◽  
Integrated Inductors ◽  
Microwave Applications

High thermal stability of the YNbO4 − CaYTiNbO7 composites for radio frequency and microwave applications

2021 ◽  
pp. 124956
Author(s):  
F.F. do Carmo ◽  
J.P.C. do Nascimento ◽  
J.E.V. de Morais ◽  
V.C. Martins ◽  
J.C. Sales ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Radio Frequency ◽  
High Thermal Stability ◽  
Microwave Applications ◽  
Thermal Stability Of

Modeling and Synthesis of Radio-Frequency Integrated Inductors

2020 ◽  
pp. 43-84
Author(s):  
Fábio Passos ◽  
Elisenda Roca ◽  
Rafael Castro-López ◽  
Francisco V. Fernández
Keyword(s):  
Radio Frequency ◽  
Integrated Inductors

Bonding and stoichiometry in low-energy radio frequency magnetron sputtered ZnO thin films on flexible substrate

Vacuum ◽  
2021 ◽  
Vol 183 ◽  
pp. 109869
Author(s):  
Chukwudi E. Iheomamere ◽  
Corey L. Arnold ◽  
Urmilaben P. Rathod ◽  
Khalil D. Omotosho ◽  
Andrey A. Voevodin ◽  
...  
Keyword(s):  
Thin Films ◽  
Radio Frequency ◽  
Flexible Substrate ◽  
Radio Frequency Magnetron ◽  
Low Energy ◽  
Zno Thin Films

Graphene radio frequency devices on flexible substrate

2013 ◽  
Vol 102 (23) ◽  
pp. 233102 ◽  
Author(s):  
Wenjuan Zhu ◽  
Damon B. Farmer ◽  
Keith A. Jenkins ◽  
Bruce Ek ◽  
Satoshi Oida ◽  
...  
Keyword(s):  
Radio Frequency ◽  
Flexible Substrate

Magneto-dielectric composite based on Y3Fe5O12 – CaTiO3 for radio frequency and microwave applications

2019 ◽  
Vol 783 ◽  
pp. 652-661 ◽  
Author(s):  
D.V.M. Paiva ◽  
M.A.S. Silva ◽  
R.G.M. de Oliveira ◽  
A.R. Rodrigues ◽  
L.M.U.D. Fechine ◽  
...  
Keyword(s):  
Radio Frequency ◽  
Dielectric Composite ◽  
Microwave Applications

Fabrication and characterization of advanced through glass via interconnects

2016 ◽  
Vol 2016 (1) ◽  
pp. 000288-000292
Author(s):  
Timothy Clingenpeel ◽  
Arian Rahimi ◽  
Seahee Hwangbo ◽  
Yong-Kyu Yoon ◽  
Aric Shorey
Keyword(s):  
Radio Frequency ◽  
Circuit Model ◽  
Fabrication Process ◽  
Electrical Characteristics ◽  
Frequency Range ◽  
High Quality ◽  
Measurement Results ◽  
Fabrication And Characterization ◽  
Copper Structure

Abstract This work presents the fabrication process, electrical characteristics, and circuit model of through glass via (TGV) structures consisting of TGV holes with each diameter of 100 μm and different conductors including copper and composite in the frequency range of 300 kHz to 20 GHz. The Cu/NiFe superlattice metaconductors in combination with high-quality glass (Corning SGW3) are intended to reduce radio-frequency losses especially in 10 GHz and above for next generation communication applications such as 5G communications. The measured results of the copper structure are compared to simulated results. Superlattice metaconductor results will be presented. Based on the simulation and measurement results, a circuit model is demonstrated.

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