Role of the solvent in large crystal grain growth of inorganic-organic halide FA0.8Cs0.2PbIxBr3 − x perovskite thin films monitored by ellipsometry

2019 ◽  
Vol 37 (6) ◽  
pp. 062401
Author(s):  
Koki Kawamura ◽  
Ryo Ishikawa ◽  
Yoko Wasai ◽  
Nataliya Nabatova-Gabain ◽  
Shun-ji Kurosu ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Growth ◽  
Large Crystal ◽  
Organic Halide

Role of abnormal grain growth on the ferroelectric properties of SrBi2Ta2O9 thin films fabricated by R.F. Magnetron sputtering

1998 ◽  
Vol 21 (1-4) ◽  
pp. 419-428 ◽  
Author(s):  
Choelhwyi Bae ◽  
Jeon-Kook Lee ◽  
Si-Hyung Lee ◽  
Yoon Baek Park ◽  
Hyung-Jin Jung
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Grain Growth ◽  
Ferroelectric Properties ◽  
Abnormal Grain Growth

Grain Growth in Al-(Cu, Pd, Nb) Thin Films

1993 ◽  
Vol 309 ◽  
Author(s):  
J.D. Mis ◽  
K.P. Rodbell
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Grain Growth ◽  
Weight Percent ◽  
Size Distributions ◽  
Precipitate Morphology ◽  
X Ray ◽  
Transmission Electron ◽  
Grain Size Distributions

AbstractThe microstructure of 1 μim thick Al films containing 0.5 and 2%Cu (weight percent), 0.3%Pd, and 0.3%Pd-0.3%Nb were investigated by transmission electron microscopy (TEM) and energy dispersive x-ray spectroscopy (EDS) as a function of isochronal and isothermal anneals. The grain size, grain size distribution, and precipitate morphology of these films was measured from 200 to 500ºC, with the activation energy for grain growth (Ea) determined for I h anneals at 200, 300, 400 and 500ºC. Normal grain growth was recorded for the A1Cu films annealed at temperatures ≤400ºC; however secondary grain growth occurred in the AI-2Cu film annealed for I h at 500ºC, with grains as large as 16 μm in diameter observed. Grain growth in the AI-0.3Pd films resulted in strongly bi-modal grain size distributions, with the onset ofsignificant grain growth retarded for I h anneals at temperatures ≤300ºC.The addition of Nb to the AI-0.3Pd film resulted in monomodal grain size distributions over the entire temperature range. The role of crystallographic texture on grain growth in thin films is discussed.

Effect of Crystalization On Photoluminescence of ER2O3 Thin Films

2001 ◽  
Vol 694 ◽  
Author(s):  
Xiaoman Duan ◽  
Sajan Saini ◽  
Keven Chen ◽  
Michel Lipson ◽  
Jurgen Michel ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elevated Temperature ◽  
Grain Growth ◽  
Reactive Sputtering ◽  
Significant Enhancement ◽  
Large Crystal ◽  
Polycrystalline Structures ◽  
Photoluminescence Peak ◽  
The Ideal

AbstractThe effect of microstructures on the photoluminescence of Er2O3thin films has been systematically studied in this paper. The Er2O3 film was fabricated via reactive sputtering of Er metal in an Ar/O2 atmosphere. The as-deposited thin film contained both amorphous and polycrystalline structures, which showed weak photoluminescence at 1.55 µm. Annealing at an elevated temperature from 650 to 1050 °C in O2 ambient significantly incorporated oxygen into the lattice and strongly promoted crystalline grain growth, which in turn dramatically induced the transaction of photoluminescence from 1.55 µm to 1.541 µm. The ideal large crystal Er2O3 structure with fcc-Er2O3 and bcc-Er2O3 precipitates was obtained by conducting a two-step annealing (650 °C for 5 hours followed by 1020 °C for 2 hours) which resulted in a sharp photoluminescence peak at 1.541 µm. Further significant enhancement of PL at 1.541 µm was achieved via RTA at 1050 °C for 30 seconds to introduce more fcc-Er2O3 precipitates into the bcc-Er2O3 matrix.

The study of interfacial reactions of nickel thin films on GaAs

1983 ◽  
Vol 41 ◽  
pp. 156-157
Author(s):  
L.J. Chen ◽  
Y.F. Hsieh
Keyword(s):  
Thin Films ◽  
Integrated Circuits ◽  
Interfacial Reactions ◽  
Metal Contacts ◽  
Nickel Thin Films ◽  
Thin Foils ◽  
The Status ◽  
Si Doped ◽  
Electron Microscopes

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.

Transmission Electron Microscopy studies of texture of Cr underlayer of magnetic recording hard disk

1991 ◽  
Vol 49 ◽  
pp. 580-581
Author(s):  
L. Tang ◽  
G. Thomas ◽  
M. R. Khan ◽  
S. L. Duan
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Magnetic Recording ◽  
Magnetic Thin Films ◽  
Magnetic Films ◽  
Substrate Bias ◽  
Epitaxial Relationship ◽  
Transmission Electron

Cr thin films are often used as underlayers for Co alloy magnetic thin films, such as Co1, CoNi2, and CoNiCr3, for high density longitudinal magnetic recording. It is belived that the role of the Cr underlayer is to control the growth and texture of the Co alloy magnetic thin films, and, then, to increase the in plane coercivity of the films. Although many epitaxial relationship between the Cr underlayer and the magnetic films, such as ﹛1010﹜Co/ {110﹜Cr4, ﹛2110﹜Co/ ﹛001﹜Cr5, ﹛0002﹜Co/﹛110﹜Cr6, have been suggested and appear to be related to the Cr thickness, the texture of the Cr underlayer itself is still not understood very well. In this study, the texture of a 2000 Å thick Cr underlayer on Nip/Al substrate for thin films of (Co75Ni25)1-xTix dc-sputtered with - 200 V substrate bias is investigated by electron microscopy.

Transmission Electron Microscopy of Evaporated Perylene Thin Films

1990 ◽  
Vol 48 (2) ◽  
pp. 336-337
Author(s):  
C. Ewins ◽  
J.R. Fryer
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Molecular Electronics ◽  
High Vacuum ◽  
Amorphous Layer ◽  
Electric Heater ◽  
Transmission Electron ◽  
Polycyclic Aromatic

The preparation of thin films of organic molecules is currently receiving much attention because of the need to produce good quality thin films for molecular electronics. We have produced thin films of the polycyclic aromatic, perylene C10H12 by evaporation under high vacuum onto a potassium chloride (KCl) substrate. The role of substrate temperature in determining the morphology and crystallography of the films was then investigated by transmission electron microscopy (TEM).The substrate studied was the (001) face of a freshly cleaved crystal of KCl. The temperature of the KCl was controlled by an electric heater or a cold finger. The KCl was heated to 200°C under a vacuum of 10-6 torr and allowed to cool to the desired temperature. The perylene was then evaporated over a period of one minute from a molybdenum boat at a distance of 10cm from the KCl. The perylene thin film was then backed with an amorphous layer of carbon and floated onto copper microscope grids.

scholarly journals The role of the substrate on the mechanical and thermal stability of Pd thin films during hydrogen (de)sorption

2021 ◽  
Vol 46 (5) ◽  
pp. 4137-4153
Author(s):  
Neha Verma ◽  
Rob Delhez ◽  
Niek M. van der Pers ◽  
Frans D. Tichelaar ◽  
Amarante J. Böttger
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Thermal Stability Of
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