CuAl2 thin films as a low-resistivity interconnect material for advanced semiconductor devices
2019 ◽
Vol 37
(3)
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pp. 031215
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2016 ◽
Vol 4
(2)
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pp. 407-415
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Keyword(s):
Keyword(s):
2018 ◽
Vol 18
(12)
◽
pp. 8333-8336
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Keyword(s):
Keyword(s):
Keyword(s):
1982 ◽
Vol 20
(3)
◽
pp. 306-307
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