Gas permeation barriers deposited by atmospheric pressure plasma enhanced atomic layer deposition

2016 ◽  
Vol 34 (1) ◽  
pp. 01A114 ◽  
Author(s):  
Lukas Hoffmann ◽  
Detlef Theirich ◽  
Tim Hasselmann ◽  
André Räupke ◽  
Daniel Schlamm ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Atmospheric Pressure ◽  
Atmospheric Pressure Plasma ◽  
Atomic Layer ◽  
Gas Permeation ◽  
Pressure Plasma ◽  
Layer Deposition

Atmospheric Pressure Process for Coating Particles Using Atomic Layer Deposition

2009 ◽  
Vol 15 (7-9) ◽  
pp. 227-233 ◽  
Author(s):  
Renske Beetstra ◽  
Ugo Lafont ◽  
John Nijenhuis ◽  
Erik M. Kelder ◽  
J. Ruud van Ommen
Keyword(s):  
Atomic Layer Deposition ◽  
Atmospheric Pressure ◽  
Atomic Layer ◽  
Layer Deposition

scholarly journals TiO 2 thin film patterns prepared by chemical vapor deposition and atomic layer deposition using an atmospheric pressure microplasma printer

2019 ◽  
Vol 16 (12) ◽  
pp. 1900127 ◽  
Author(s):  
Morteza Aghaee ◽  
Joerie Verheyen ◽  
Alquin A. E. Stevens ◽  
Wilhelmus M. M. Kessels ◽  
Mariadriana Creatore
Keyword(s):  
Thin Film ◽  
Chemical Vapor Deposition ◽  
Atomic Layer Deposition ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Atomic Layer ◽  
Layer Deposition

Application of Atomic Layer Deposition for Gas Permeation Barrier Thin Films

2019 ◽  
Vol 11 (7) ◽  
pp. 15-21
Author(s):  
Peter F. Carcia ◽  
Robert McLean ◽  
Markus Groner ◽  
Arrelaine Dameron ◽  
Steven George
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Gas Permeation ◽  
Layer Deposition

A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films

2020 ◽  
Vol 56 (89) ◽  
pp. 13752-13755
Author(s):  
Nils Boysen ◽  
Bujamin Misimi ◽  
Arbresha Muriqi ◽  
Jan-Lucas Wree ◽  
Tim Hasselmann ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Atmospheric Pressure ◽  
Atomic Layer ◽  
First Report ◽  
Layer Deposition

This is the first report on a plasma enhanced spatial atomic layer deposition (APP-ALD) process at atmospheric pressure to grow conducting metallic Cu thin films from a carbene stabilized precursor.

Sign in / Sign up

Export Citation Format

Share Document