Silane injection in a high-density low-pressure plasma system and its influence on the deposition kinetics and material properties of SiO2

2008 ◽  
Vol 26 (5) ◽  
pp. 1115-1119 ◽  
Author(s):  
R. Botha ◽  
B. Haj Ibrahim ◽  
P. Bulkin ◽  
B. Drévillon
Keyword(s):  
Material Properties ◽  
Low Pressure ◽  
High Density ◽  
Plasma System ◽  
Deposition Kinetics ◽  
Pressure Plasma ◽  
Low Pressure Plasma

Investigation of Surface Modifications of Metals with Low-Pressure Plasma System

2015 ◽  
Vol 239 ◽  
pp. 161-179
Author(s):  
B.A. Soliman ◽  
M.M. Abdelrahman ◽  
F.W. Abdelsalam
Keyword(s):  
Contact Angle ◽  
Metal Surfaces ◽  
Surface Engineering ◽  
Film Growth ◽  
Low Pressure ◽  
Green Technology ◽  
Plasma System ◽  
Argon Gas ◽  
Pressure Plasma ◽  
Low Pressure Plasma

The effects of plasma exposure and impingement of energetic particles are now widely used for substrate cleaning as well as to assist and control thin film growth and various applications. Plasma technology is a versatile green technology used for surface engineering technology. Plasma sources have become a very useful tool for surface modification and deposition of various materials. In this work, typical treatments of the surfaces of Mn, Fe, W and Cu metals were carried out using a low-pressure plasma system with argon gas and operating with an aluminum cathode. The plasma ignition was produced by flowing argon gas between two metal electrodes, and the maximum discharge voltage was 3 kV. All the treated metal samples were exposed to the plasma for a constant time of 2 hours. The modified metal surfaces were characterized by in situ X-ray florescence spectroscopy (XRF), contact angle measurements and scanning electron microscopy (SEM). The wetting behavior of the treated metal surfaces was studied by employing the contact angle method. The contact angle is found to be dependable on the surface layer properties of the metals which in turn is affected by the dose time.

Characteristics of Low Pressure Plasma Sprayed Alumina Coating

2009 ◽  
Vol 24 (1) ◽  
pp. 117-121 ◽  
Author(s):  
Chun-Ming DENG ◽  
Ke-Song ZHOU ◽  
Min LIU ◽  
Chang-Guang DENG ◽  
Jin-Bing SONG ◽  
...  
Keyword(s):  
Low Pressure ◽  
Alumina Coating ◽  
Pressure Plasma ◽  
Low Pressure Plasma ◽  
Plasma Sprayed

scholarly journals Effect of Low-Pressure Plasma Treatment Parameters on Wrinkle Features

Materials ◽  
2020 ◽  
Vol 13 (17) ◽  
pp. 3852
Author(s):  
Bongjun Gu ◽  
Dongwook Ko ◽  
Sungjin Jo ◽  
Dong Choon Hyun ◽  
Hyeon-Ju Oh ◽  
...  
Keyword(s):  
Power Flow ◽  
Treatment Time ◽  
Argon Plasma ◽  
Negative Ions ◽  
Low Pressure ◽  
Nitrogen Plasma ◽  
Pressure Plasma ◽  
Positive Ions ◽  
Low Pressure Plasma ◽  
Optical Adhesive

Wrinkles attract significant attention due to their ability to enhance the mechanical and optical characteristics of various optoelectronic devices. We report the effect of the plasma gas type, power, flow rate, and treatment time on the wrinkle features. When an optical adhesive was treated using a low-pressure plasma of oxygen, argon, and nitrogen, the oxygen and argon plasma generated wrinkles with the lowest and highest wavelengths, respectively. The increase in the power of the nitrogen and oxygen plasma increased the wavelengths and heights of the wrinkles; however, the increase in the power of the argon plasma increased the wavelengths and decreased the heights of the wrinkles. Argon molecules are heavier and smaller than nitrogen and oxygen molecules that have similar weights and sizes; moreover, the argon plasma comprises positive ions while the oxygen and nitrogen plasma comprise negative ions. This resulted in differences in the wrinkle features. It was concluded that a combination of different plasma gases could achieve exclusive control over either the wavelength or the height and allow a thorough analysis of the correlation between the wrinkle features and the characteristics of the electronic devices.

scholarly journals Effect of H2O-Based Low-Pressure Plasma (LPP) Treatment on the Germination of Bambara Groundnut Seeds

Agronomy ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 338
Author(s):  
Naeem Ahmed ◽  
Asad Masood ◽  
Kim S. Siow ◽  
M. F. Mohd Razip Wee ◽  
Rahmat Zaki Auliya ◽  
...  
Keyword(s):  
Food Security ◽  
Seed Germination ◽  
Chemical Modification ◽  
Low Pressure ◽  
Germination Percentage ◽  
Bambara Groundnut ◽  
Pressure Plasma ◽  
Low Pressure Plasma ◽  
Amine Groups

In general, seed germination is improved by low-pressure plasma (LPP) treatment using precursors such as air, nitrogen, argon, or water (H2O). Here, H2O-based LPP treatment using the optimized parameters of 10 W and 10 s improves the germination of Bambara groundnut seeds by 22%. LPP increases the wettability and roughness of the seed hilum while oxidizing the surface with carboxyl and amine groups. In this H2O-based treatment of Bambara groundnut seeds, combinatory etching and chemical modification facilitated the imbibition process and increased the germination percentage. The success of this method has the potential to be scaled up to solve food security with seeds otherwise facing germination-related issues.

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