Misfit Dislocations in the Bicrystal System of Silicon-Boron-Doped Silicon

1969 ◽  
Vol 6 (4) ◽  
pp. 585-588 ◽  
Author(s):  
Yoshimitsu Sugita ◽  
Masao Tamura ◽  
Katsuro Sugawara
1969 ◽  
Vol 40 (8) ◽  
pp. 3089-3094 ◽  
Author(s):  
Yoshimitsu Sugita ◽  
Masao Tamura ◽  
Katsuro Sugawara

1989 ◽  
Vol 54 (5) ◽  
pp. 463-465 ◽  
Author(s):  
H. Kikuchi ◽  
M. Kitakata ◽  
F. Toyokawa ◽  
M. Mikami

1995 ◽  
Vol 378 ◽  
Author(s):  
HO-JUN Lee ◽  
Chul-Hi Han ◽  
Choong-Ki Kim

AbstractIn this paper, various elastic parameters of heavily boron-doped silicon layer have been extracted by eliminating the misfit dislocations in the layer. The dislocation-free silicon membranes doped with the boron concentration of 1.3 × 1020 atoms/cm3 have been fabricated and the Young’s modulus of 1.45 × 1012 dyn/cm2 and residual tensile stress of 2.7 × 109 dyn/cm2 have been extracted by blister method. From the Young’s modulus and residual stress, the residual tensile strain of 1.34 × 10−3, lattice constant of 5.424 Å, and misfit coefficient of 1.03 × 10−23 cm3/atom have been calculated. These parameters are very similar to those obtained from X-ray diffraction analysis and theory.


1970 ◽  
Vol 7 (2) ◽  
pp. 369-369
Author(s):  
Yoshimitsu Sugita ◽  
Masao Tamura ◽  
Katsuro Sugawara

1970 ◽  
Vol 41 (4) ◽  
pp. 1877-1877
Author(s):  
Yoshimitsu Sugita ◽  
Masao Tamura ◽  
Katsuro Sugawara

Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.


2010 ◽  
Vol 484 (4-6) ◽  
pp. 258-260 ◽  
Author(s):  
D.D.D. Ma ◽  
K.S. Chan ◽  
D.M. Chen ◽  
S.T. Lee

Solar RRL ◽  
2021 ◽  
Author(s):  
Bruno Vicari Stefani ◽  
Moonyong Kim ◽  
Matthew Wright ◽  
Anastasia Soeriyadi ◽  
Dmitriy Andronikov ◽  
...  

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