A Preliminary Numerical Study of the Slurry Wire Sawing Process

2012 ◽  
Author(s):  
Chunhui Chung
Keyword(s):  
Steady State ◽  
Numerical Study ◽  
Semiconductor Wafer ◽  
Steady State Condition ◽  
Local Loads ◽  
Wire Tension ◽  
Wire Saw ◽  
Simulation Results ◽  
The Wire ◽  
Sawing Process

Slurry wire saw has been utilized to slice the brittle semiconductor wafer substrates for over 20 years. However, the complicated slicing process limits the further studies and advances of this exclusive slicing tool for big wafers. In this study, a numerical model of the slurry wire sawing process was developed based on the mechanism of brittle indentation cracks. The simulation results illustrate how the factors such as wire speed, wire tension, and feed rate of the ingot affect the slicing conditions including the bow angles of the wire and the local normal loads on both the workpiece and the wire. In addition, the results show that the steady-state condition would be reached via overshooting or non-overshooting approach based on the slicing parameters. A higher wire speed is suggested to reduce the bow angles and local loads during slicing process. However, the limitation of the wire speed depends on the material of the wire and the specification of the wire saw machine.

Wire Vibration Modeling and Experimental Analysis for Wire Saw Machining

2019 ◽  
Vol 141 (12) ◽  
Author(s):  
Aofei Tang ◽  
Shujuan Li ◽  
Guigeng Yang ◽  
Lun Li ◽  
Robert G. Landers
Keyword(s):  
Surface Quality ◽  
Process Parameters ◽  
Feed Rate ◽  
Processing Time ◽  
Experimental Studies ◽  
Wire Tension ◽  
Wire Saw ◽  
Part Surface ◽  
Wire Vibration ◽  
The Wire

Abstract Surface roughness is the key index point of wire saw processing silicon carbide (SiC). Many factors influence wafer surface quality, which is determined by the motion of the wire relative to the part. The vibration characteristic of wire saw and the process parameters are concerned factors in this paper, which presents a wire vibration model to study the wire saw vibration law. Experimental studies of a stationary wire are conducted to calibrate the damping coefficient and experimental studies of a moving wire are used to validate the developed model. Simulation, theoretical, and experimental data for wire vibrations during a variety of machining processes are found to compare very well, and the effects of various wire saw process parameters are investigated to analyze the influences of process parameters on wire vibration. It was shown that increasing the wire tension and feed rate, or decreeing the wire length, decreases the wire's first dominant frequency, and that changes in the wire velocity had a negligible effect. Finally, the measurement of the surface morphology and wire saw vibrations for different processing parameters was conducted, and it was seen that increases in the wire velocity and wire tension increases part surface quality and decreases processing time, while an increase in the feed rate decreases both part surface quality and processing time. The results show a clear correlation between the amplitude of the wire vibration outside of the processing zone and the part surface quality.

Study on the performance of nanocomposite wire guides in wire sawing process

2018 ◽  
Vol 32 (19) ◽  
pp. 1840077
Author(s):  
Chunhui Chung ◽  
Chien-Hong Lin
Keyword(s):  
Surface Roughness ◽  
Wear Resistance ◽  
Cutting Tool ◽  
Machining Process ◽  
Semiconductor Wafer ◽  
Wafer Thickness ◽  
The Wire ◽  
Sawing Process ◽  
Wafer Manufacturing

In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.

Loss of wire tension in the wire web during the slurry based multi wire sawing process

2014 ◽  
Vol 120 ◽  
pp. 346-355 ◽  
Author(s):  
Daniel Meißner ◽  
Stephan Schoenfelder ◽  
Björn Hurka ◽  
Johannes Zeh ◽  
Kirsten Sunder ◽  
...  
Keyword(s):  
Wire Tension ◽  
The Wire ◽  
Sawing Process

Abrasive Distribution of the Fixed Diamond Wire in Wire Sawing Process

2012 ◽  
Vol 579 ◽  
pp. 145-152 ◽  
Author(s):  
Chun Hui Chung
Keyword(s):  
Material Removal ◽  
Wafer Surface ◽  
Operating Environment ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Cutting Rate ◽  
The Wire ◽  
Fixed Diamond Wire ◽  
Sawing Process

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

scholarly journals Effect of Overburden Height on Hydraulic Fracturing of Concrete-Lined Pressure Tunnels Excavated in Intact Rock: A Numerical Study

Fluids ◽  
2019 ◽  
Vol 4 (2) ◽  
pp. 112 ◽  
Author(s):  
Moses Karakouzian ◽  
Mohammad Nazari-Sharabian ◽  
Mehrdad Karami
Keyword(s):  
Finite Element ◽  
Steady State ◽  
Hydraulic Fracturing ◽  
Numerical Study ◽  
Transient State ◽  
Friction Angle ◽  
Intact Rock ◽  
Steady State Condition ◽  
Pressure Tunnel ◽  
The Impact

This study investigated the impact of overburden height on the hydraulic fracturing of a concrete-lined pressure tunnel, excavated in intact rock, under steady-state and transient-state conditions. Moreover, the Norwegian design criterion that only suggests increasing the overburden height as a countermeasure against hydraulic fracturing was evaluated. The Mohr–Coulomb failure criterion was implemented to investigate failure in the rock elements adjacent to the lining. A pressure tunnel with an inner diameter of 3.6 m was modeled in Abaqus Finite Element Analysis (FEA), using the finite element method (FEM). It was assumed that transient pressures occur inside the tunnel due to control gate closure in a hydroelectric power plant, downstream of the tunnel, in three different closure modes: fast (14 s), normal (18 s), and slow (26 s). For steady-state conditions, the results indicated that resistance to the fracturing of the rock increased with increasing the rock friction angle, as well as the overburden height. However, the influence of the friction angle on the resistance to rock fracture was much larger than that of the overburden height. For transient-state conditions, the results showed that, in fast, normal, and slow control gate closure modes, the required overburden heights to failure were respectively 1.07, 0.8, and 0.67 times the static head of water in the tunnel under a steady-state condition. It was concluded that increasing the height of overburden should not be the absolute solution to prevent hydraulic fracturing in pressure tunnels.

Simulation and Experiment of Wire Tensions for Wire-Driven Parallel Manipulator

2013 ◽  
Vol 694-697 ◽  
pp. 2779-2782
Author(s):  
Yi Xin Chen ◽  
Sui Lu Yue ◽  
Qi Lin ◽  
Zhao Wang
Keyword(s):  
Nonlinear Programming ◽  
Multiple Solutions ◽  
Parallel Manipulator ◽  
Programming Model ◽  
Optimal Solution ◽  
Wire Tension ◽  
Nonlinear Programming Model ◽  
Simulation And Experiment ◽  
Simulation Results ◽  
The Wire

For the multiple solutions of wire tensions to wire-driven parallel manipulator, the paper presents a wire tension optimization program based on the penalty function. After building a nonlinear programming model and simulating in MATLAB, the optimal solution of wire tensions under the minimal preload is calculated. Compared with the simulation results and experimental results, it shows that the wire tensions in experiment are relatively stable and the trends are overall consistent with the simulation results. The study lays a foundation for selecting the suitable preload for the wire-driven parallel manipulator.

Measurement And Simulation Calculation of Wire Bow Angle During The Diamond Wire Saw Process

2022 ◽  
Author(s):  
Zhiteng Xu ◽  
Hui Huang ◽  
Changcai Cui
Keyword(s):  
High Speed ◽  
Processing Parameters ◽  
Tension Force ◽  
Feed Speed ◽  
Diamond Wire ◽  
Wire Tension ◽  
Diamond Wire Saw ◽  
Simulation Calculation ◽  
The Wire ◽  
Sawing Process

Abstract The wire bow angle is an important factor that affects the shape precision of an ingot after the diamond wire sawing process. In this research, the wire bow angles of the inside and outside of an ingot were recorded with a high-speed camera. The effects of the processing parameters such as the wire tension force, feed speed, and wire speed on the wire bow angles inside and outside the ingot were analyzed. A numerical simulation model of the wire bow in the wire sawing process is presented in this paper to describe the wire bow angle inside the ingot. It was shown that the wire bow angle inside the ingot was smaller than that of outside the ingot for all of the processing parameters. The wire bow angles improved with the increase of the feed speed and decrease of the wire speed and the wire tension force. The results of the wire bow angle measurement of the inside ingot and the simulation calculation were similar for the process parameters.

Numerical study of twin groove journal bearings performance under steady-state condition

2014 ◽  
Vol 27 (2) ◽  
pp. 83-102 ◽  
Author(s):  
Alireza Arab Solghar ◽  
F. P. Brito ◽  
Morteza Abdolzadeh ◽  
Ali Farajpour
Keyword(s):  
Steady State ◽  
Numerical Study ◽  
Journal Bearings ◽  
State Condition ◽  
Steady State Condition

Use of the AO Wire Passer to Aid Placement of Obstetrical Saw Wire for Osteotomy

1994 ◽  
Vol 07 (04) ◽  
pp. 180-182
Author(s):  
N. Gofton ◽  
Joanne Cockshutt
Keyword(s):  
Soft Tissue ◽  
Close Contact ◽  
Soft Tissue Trauma ◽  
Wire Saw ◽  
Tissue Dissection ◽  
The Wire ◽  
Tissue Trauma

The AO wire passer can be used as an effective guide for passage of obstetrical saw wire for osteotomy. Use of the wire saw and passer reduces soft tissue trauma by minimizing tissue dissection, and promoting positioning of the saw in close contact with the bone.

Sign in / Sign up

Export Citation Format

Share Document