Diamond Disc Pad Conditioning in Chemical Mechanical Planarization (CMP): A Mathematical Model to Predict Pad Surface Shape

2011 ◽  
Author(s):  
Z. C. Li ◽  
Emmanuel A. Baisie ◽  
X. H. Zhang
Keyword(s):  
Experimental Data ◽  
Mathematical Model ◽  
Chemical Mechanical Planarization ◽  
Mathematic Model ◽  
Surface Shape ◽  
Surface Element ◽  
Wafer Surface ◽  
Polishing Pad ◽  
Pad Conditioning ◽  
Diamond Disc

Chemical mechanical planarization (CMP) is widely used to planarize semiconductor wafers and smooth the wafer surface. In CMP, a diamond disc conditioner is used to condition (or dress) a polishing pad to restore the pad performance. In this paper, a surface element method is proposed to develop a mathematic model to predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Results show that the model is effective to simulate the diamond disc conditioning process and predict the pad surface shape.

Simulation of Diamond Disc Conditioning in Chemical Mechanical Polishing: Effects of Conditioning Parameters on Pad Surface Shape

2010 ◽  
Author(s):  
Emmanuel A. Baisie ◽  
Z. C. Li ◽  
X. H. Zhang
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mathematic Model ◽  
Mechanical Polishing ◽  
Surface Shape ◽  
Surface Element ◽  
Thickness Variation ◽  
Total Thickness ◽  
Rotating Speed ◽  
Total Thickness Variation ◽  
Diamond Disc

Diamond disc conditioning is traditionally employed to restore pad planarity and surface roughness in chemical mechanical polishing (CMP). In this paper, a mathematic model is developed by using a surface element method to simulate and predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Three metrics (total thickness variation (TTV), bow and non-uniformity (NU)) are defined and utilized to evaluate the pad surface shape. Based upon the validated model, effects of conditioning parameters (including sweeping profile, pad rotating speed, conditioner rotating speed, and conditioner diameter) on the pad surface shape are further investigated and discussed.

scholarly journals Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

2020 ◽  
Vol 11 (1) ◽  
pp. 179
Author(s):  
Chao-Chang A. Chen ◽  
Jen-Chieh Li ◽  
Wei-Cheng Liao ◽  
Yong-Jie Ciou ◽  
Chun-Chen Chen
Keyword(s):  
Surface Topography ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Surface Profile ◽  
Performance Level ◽  
Wafer Surface ◽  
Surface Metrology ◽  
Effective Lifetime ◽  
Polishing Pad ◽  
Swing Arm

This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure the substrate wafer or thin film on wafer that has reached the required planarization after deposition for lithographic processing of the desired structures of devices. Surface properties of polishing pad have a huge influence on the material removal rate (MRR) and quality of wafer surface by CMP process. A DPMS has been developed to analyze the performance level of polishing pad for CMP. A chromatic confocal sensor is attached on a designed fixture arm to acquire pad topography data. By swing-arm motion with continuous data acquisition, the surface topography information of pad can be gathered dynamically. Measuring data are analyzed with a designed FFT filter to remove mechanical vibration and disturbance. Then the pad surface profile and groove depth can be calculated, which the pad’s index PU (pad uniformity) and PELI (pad effective lifetime index) are developed to evaluate the pad’s performance level. Finally, 50 rounds of CMP experiments have been executed to investigate the correlations of MRR and surface roughness of as-CMP wafer with pad performance. Results of this study can be used to monitor the pad dressing process and CMP parameter evaluation for production of IC devices.

Study on Pad Conditioning Parameters in Silicon Wafer CMP Process

2007 ◽  
Vol 359-360 ◽  
pp. 309-313 ◽  
Author(s):  
Zhao Zhong Zhou ◽  
Ju Long Yuan ◽  
Bing Hai Lv ◽  
Jia Jin Zheng
Keyword(s):  
Surface Structure ◽  
Silicon Wafer ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Chemical Mechanical Planarization ◽  
Wafer Surface ◽  
Orthogonal Experiments ◽  
Pad Conditioning ◽  
High Level

Polishing pad plays a key role in determining polish rate and planarity of a chemical mechanical planarization (CMP). The properties of the pad would deteriorate during polishing because of pad surface grazing, which results in reduced removal rates and poorer planarity of wafer surface. Pad conditioning and its influence on pad surface structure and CMP process is introduced and discussed in this paper. The study shows that the surface structure can be regenerated by breaking up the glazed areas with conditioner, MRR(Material Removal Rate) can be maintained at high level with proper pad conditioning, and UN(Non-uniformity)can also improved. Orthogonal experiments design is employed in this study to determine the best conditioning parameters.

scholarly journals Modeling and Simulation of Cancer Treatment Using Cold Atmospheric Plasma

2021 ◽  
Author(s):  
Minghao Xu
Keyword(s):  
Experimental Data ◽  
Mathematical Model ◽  
Cell Viability ◽  
Cancer Treatment ◽  
Cancer Cell ◽  
Exposure Time ◽  
Mathematic Model ◽  
Least Square ◽  
Atmospheric Plasma ◽  
Cold Atmospheric Plasma

Abstract The cold atmospheric plasma (CAP) becomes a promising technology for the cancer cell treatment. There are many aspects affecting the effect of the treatment including plasma discharge voltages, CAP exposure time, cancer cell type and so on. In order to have a further understanding the cancer treatment using CAP jet, we proposed a mathematical model by using the least square method for the response of cancer cell line of U-87 MG with CAP jets treatment based on experimental data from reference. The comparison demonstrates that the mathematical model can capture the characteristics of the cancer cell viability in the experimental data. It means that we can use the same method to predict cancer cell response to CAP under a nominal condition. We also proposed the mathematic model using the Taylor expansion method according to the processed data to study the correlation between the cell viability, the treatment and the CAP exposure time.

The substantiation of the formalized estimation of effectiveness of technological and production systems

2018 ◽  
Vol 15 (1) ◽  
pp. 169-181
Author(s):  
M. I. Sidorov ◽  
М. Е. Stavrovsky ◽  
V. V. Irogov ◽  
E. S. Yurtsev
Keyword(s):  
Experimental Data ◽  
Mathematical Model ◽  
Production Systems ◽  
Van Der Pol

Using the example of van der Pol developed a mathematical model of frictional self-oscillations in topochemically kinetics. Marked qualitative correspondence of the results of calculation performed using the experimental data of researchers.

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

scholarly journals Exhaust Noise Reduction by Application of Expanded Collecting System in Pneumatic Tools and Machines

Energies ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1592
Author(s):  
Dominik Gryboś ◽  
Jacek S. Leszczyński ◽  
Dorota Czopek ◽  
Jerzy Wiciak
Keyword(s):  
Experimental Data ◽  
Mathematical Model ◽  
Noise Reduction ◽  
Sound Pressure ◽  
Acoustic Pressure ◽  
Pressure Level ◽  
Computational Results ◽  
Noise Measurements ◽  
Exhaust Noise ◽  
Collecting System

In this paper, we demonstrate how to reduce the noise level of expanded air from pneumatic tools. Instead of a muffler, we propose the expanded collecting system, where the air expands through the pneumatic tube and expansion collector. We have elaborated a mathematical model which illustrates the dynamics of the air flow, as well as the acoustic pressure at the end of the tube. The computational results were compared with experimental data to check the air dynamics and sound pressure. Moreover, the study presents the methodology of noise measurement generated in a pneumatic screwdriver in a quiet back room and on a window-fitting stand in a production hall. In addition, we have performed noise measurements for the pneumatic screwdriver and the pneumatic screwdriver on an industrial scale. These measurements prove the noise reduction of the pneumatic tools when the expanded collecting system is used. When the expanded collecting system was applied to the screwdriver, the measured Sound Pressure Level (SPL) decreased from 87 to 80 dB(A).

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