Long Term Corrosion Behaviour of Carbon Steel During Anaerobic to Aerobic Cycling Under Near-Neutral pH Saline Conditions

2010 ◽  
Author(s):  
Brent W. A. Sherar ◽  
Peter G. Keech ◽  
Zack Qin ◽  
Fraser King ◽  
David W. Shoesmith ◽  
...  
Keyword(s):  
Carbon Steel ◽  
Focused Ion Beam ◽  
Corrosion Behaviour ◽  
Ion Beam ◽  
Cycle Number ◽  
Corrosion Rates ◽  
Anaerobic Corrosion ◽  
Film Porosity ◽  
Electrochemical Microscopy

This paper investigates the long term corrosion behaviour of pretreated carbon steel under alternating anaerobic to aerobic cycles over 238 days. Changes in steel behaviour were observed electrochemically by monitoring the corrosion potential, and calculating changes to corrosion rate from linear polarization resistance. With increasing cycle number the corrosion process becomes localized at a small number of locations, consistent with the formation of tubercles. Periods of aerobic corrosion were associated with more positive potentials (between −500 mV to −350 mV) and high corrosion rates (70 to 120 μm yr−1); whereas anaerobic corrosion yielded more negative potentials (< −650 mV) and lower corrosion rates (40 to 50 μm yr−1). Upon termination of the experiment, corrosion product deposits were characterized by several techniques: scanning electrochemical microscopy to detect morphology; focused ion beam and cross sectioning to judge film thickness and film porosity; and Raman Spectroscopy to identify iron phases.

scholarly journals Anodisation of Aluminium Alloys by Micro-Capillary Technique as a Tool for Reliable, Cost-Efficient, and Quick Process Parameter Determination

2016 ◽  
Vol 2016 ◽  
pp. 1-12 ◽  
Author(s):  
Daniela Nickel ◽  
Dagmar Dietrich ◽  
Roy Morgenstern ◽  
Ingolf Scharf ◽  
Harry Podlesak ◽  
...  
Keyword(s):  
Process Parameters ◽  
Cross Sections ◽  
Aluminium Alloys ◽  
Focused Ion Beam ◽  
Corrosion Behaviour ◽  
Film Formation ◽  
Ion Beam ◽  
Parameter Determination ◽  
Pure Aluminium ◽  
Glass Capillary

Anodisation is essential for improving surface properties of aluminium alloys and composites regarding wear and corrosion behaviour. Optimisation of the anodising process depends on microstructural constituents contained in aluminium alloys and represents a key task, consisting of the control of process parameters and electrolyte formulation. We applied the micro-capillary technique known from corrosion studies and modified it to form anodic aluminium oxide films on high-strength aluminium alloys in comparison to pure aluminium in sulphuric acid. A glass capillary with an opening of 800 μm in diameter was utilized. Corresponding electrochemical measurements during potentiodynamic and potentiostatic anodisation revealed anodic current responses similar to conventional anodisation. The measurement of film thickness was adapted to the thin anodised spots using ellipsometry and energy dispersive X-ray analysis. Cross sections prepared by focused ion beam milling confirm the thickness results and show the behaviour of intermetallic phases depending on the anodising potential. Consequently, micro-capillary anodising proved to be an effective tool for developing appropriate anodisation conditions for aluminium alloys and composites because it allows quick variation of electrolyte composition by applying low electrolyte volumes and rapid film formation due to short process durations at small areas and more flexible variation of process parameters due to the used set-up.

The Challenges of FIB Chip Repair and Debug Assistance in the 0.25μm Copper Interconnect Millennium

1998 ◽  
Author(s):  
S.B. Herschbein ◽  
L.S. Fischer ◽  
T.L. Kane ◽  
M.P. Tenney ◽  
A.D. Shore
Keyword(s):  
High Performance ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Grain Structure ◽  
Long Term Storage ◽  
Wagon Wheel ◽  
Sram Cell ◽  
Oxide Deposition ◽  
Reliable Isolation

Abstract Copper will probably replace aluminum alloys as the interconnect metallurgy of choice for high performance semiconductor devices. This transition will challenge the suitability of established practices in focused ion beam (FIB) chip repair. A fundamental rethink in methodology, techniques, and process gases will be required to deal with the new metal films. This paper discusses the results of recent experiments in the areas of FIB exposure, cuts and connections to buried copper lines. While copper tends to mill faster than aluminum, etch rate variations due to grain structure tend to make reliable isolation cuts more difficult. The films also have been shown to suffer regrowth and surface reactions during long term storage following FIB exposure. Attempts at halogen gas assisted etch (GAE) mills result in undesirable removal characteristics, and in the case of bromine, the spontaneous destruction of all exposed copper in the immediate area. Resistance measurements and reliability of deposited tungsten connections to copper lines are also presented. In addition, the latest techniques developed for aluminum wiring isolation and device characterization are shown. These include 'cleanup' methods for achieving good circuit isolation without the extensive use of local oxide deposition, and the latest multilevel version of the FIB ‘wagon wheel’ for SRAM cell characterization. Also included is preliminary data from a custom built FIB chamber four manipulator prober module.

Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System due to a low I2 Background

1999 ◽  
Author(s):  
H. J. Bender ◽  
S. Jin ◽  
I. Vervoort ◽  
Y. Lantasov
Keyword(s):  
Structural Analysis ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Long Term Memory ◽  
Term Memory ◽  
Cu Metallization ◽  
Beam System ◽  
Cu Corrosion

Abstract The corrosion effect of an I2 background during focused ion beam (FIB) analysis of Cu-metallization structures is investigated. In-situ Cu corrosion in the FIB system can occur even if the I2 gas has not been used anymore in the last 24 h before the loading of the Cu sample in the system including several vents and pump-downs of the chamber in that period. Hence the I2 can have a long-term memory effect and is not compatible with FIB analysis or modification of devices with Cu metallization. Compositional and structural analysis shows that the reaction product is CuI.

scholarly journals Focused-Ion-Beam-Milled Carbon Nanoelectrodes for Scanning Electrochemical Microscopy

2015 ◽  
Vol 163 (4) ◽  
pp. H3032-H3037 ◽  
Author(s):  
Ran Chen ◽  
Keke Hu ◽  
Yun Yu ◽  
Michael V. Mirkin ◽  
Shigeru Amemiya
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Scanning Electrochemical Microscopy ◽  
Electrochemical Microscopy
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