Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

2020 ◽  
Author(s):  
Jing Wu ◽  
Mohammad S. Alam ◽  
KM Rafidh Hassan ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
High Temperature ◽  
Mechanical Behavior ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Aging Effects ◽  
Solid Solution Strengthening ◽  
Solution Strengthening

Abstract Microstructural evolution occurs in lead free Sn-Ag-Cu (SAC) solder joints exposed to isothermal aging. Such changes lead to degradations in the mechanical properties and creep behavior of the solder, and can result in dramatic reductions in the board level reliability of lead-free electronic assemblies subjected to aging. In our recent research, Scanning Electron Microscopy (SEM) has been used to: (1) monitor aging induced microstructural changes occurring within fixed regions in selected lead-free solder joints, (2) create time-lapse imagery of the microstructure evolution, and (3) analyze the microstructural changes quantitatively and correlate to the observed mechanical behavior evolution. This approach has removed the limitations of many prior studies where aged and non-aged microstructures were taken from two different samples and could only be qualitatively compared. In our current study, the microstructural evolutions were observed in SAC305 (96.5Sn-3.0Ag-0.5Cu) and SAC_Q (SAC+Bi) exposed to isothermal conditions at T = 100 °C and 125 °C for several different regions from several different joints. The microstructures in several fixed regions of interest were recorded after predetermined time intervals of aging, which were 1 hour (up to 270 hours) and 250 hours (up to 7000 hours) for the long-term aging samples. The aging induced changes in microstructure have been correlated with the changes in mechanical behavior measured using uniaxial tensile testing. The area and diameter of each IMC particle were tracked during the aging process using the recorded images and imaging processing software. As expected, the analysis of the evolving SAC305 and SAC+X microstructures showed a significant amount of diffusion of silver and bismuth in the beta-tin matrix during aging. In particular, Ag3Sn particles coalesced during aging leading to a decrease in the number of particles. Any bismuth in the SAC+X microstructure was observed to quickly go into solution, resulting in solid solution strengthening. This primary occurred within the beta-Sn dendrites, but also in the Ag3Sn intermetallic rich regions between dendrites. The presence of bismuth in was also found to slow the diffusion process that coarsens the Ag3Sn IMC particles. The combination solid solution strengthening and a lower diffusion rate for Ag lead to reduced aging effects in the SAC+Bi alloy relative to the SAC305 solder alloy. The SAC_Q alloy was found to have significantly better high temperature mechanical properties relative to SAC305 at all prior aging conditions. In particular, the initial modulus and ultimate tensile strength of SAC305 experienced large degradations during high temperature aging, whereas the same properties of SAC_Q changed only slightly. These changes in mechanical behavior correlated well with the observed increases in the average IMC particle diameter and decreases in the number of IMC particles. The microstructural and material property degradations were especially large for SAC305 during the initial 50 hours of aging.

Mechanical Properties of Ga1–xInxAs

1985 ◽  
Vol 53 ◽  
Author(s):  
S. Guruswamy ◽  
J.P. Hirth ◽  
K.T. Faber
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
High Temperature ◽  
Strengthening Effect ◽  
Plateau Stress ◽  
Solid Solution Strengthening ◽  
Stress Region ◽  
Solution Strengthening ◽  
Concentration Levels ◽  
Undoped Gaas

ABSTRACTSubstantial solid solution strengthening of GaAs by In acting as InAs4 units has recently been predicted. This strengthening could account for the reduction of dislocation density in GaAs single crystals grown from the melt. High temperature hardness measurements up to 700ºC have been carried out on (100) GaAs and Ga0.9975 In0.0025 As wafers. Results show a significant strengthening effect in In—doped GaAs even at concentration levels of about 0.2 wt%. A temperature independent flow stress region is observed for both these alloys. The In—doped GaAs shows ahigher plateau stress level compared to the undoped GaAs. The results are consistent with the solid solution strengthening model.

Effect of Ti Element on Microstructure and Properties of Cu-Cr Alloy

2015 ◽  
Vol 817 ◽  
pp. 307-311 ◽  
Author(s):  
Peng Chao Zhang ◽  
Jin Chuan Jie ◽  
Yuan Gao ◽  
Tong Min Wang ◽  
Ting Ju Li
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
Spherical Shape ◽  
Precipitation Strengthening ◽  
Peak Hardness ◽  
Ti Alloy ◽  
Strengthening Mechanisms ◽  
Vacuum Melting ◽  
Solid Solution Strengthening ◽  
Solution Strengthening

The Cu-Cr and Cu-Cr-Ti alloy plates were prepared by vacuum melting and plastic deformation. The effect of slight Ti element on microstructure and mechanical properties of Cu-Cr alloy was discussed. The result shows that Cr particles with spherical shape precipitated from Cu matrix after aging. Plenty Ti atoms dissolved in the vicinity of Cr particles and there were still parts of solid solution Ti atoms in other regions. Improvements in peak hardness and softening resistance were achieved with the addition of Ti element in Cu-Cr alloy. The addition of 0.1 wt.% Ti element makes Cu-Cr alloy possess tensile strength of 565 MPa and hardness of 185.9 HV after aging at 450 °C for 120 min, which can be attributed to multiple strengthening mechanisms, i.e. work hardening, solid solution strengthening and precipitation strengthening.

scholarly journals The Importance of Diffusivity and Partitioning Behavior of Solid Solution Strengthening Elements for the High Temperature Creep Strength of Ni-Base Superalloys

2020 ◽  
Vol 51 (12) ◽  
pp. 6195-6206 ◽  
Author(s):  
S. Giese ◽  
A. Bezold ◽  
M. Pröbstle ◽  
A. Heckl ◽  
S. Neumeier ◽  
...  
Keyword(s):  
Solid Solution ◽  
High Temperature ◽  
Creep Resistance ◽  
Elevated Temperatures ◽  
Solid Solution Hardening ◽  
Stress Regime ◽  
Solid Solution Strengthening ◽  
Solution Strengthening ◽  
The Individual ◽  
Partitioning Behavior

AbstractThe creep resistance of single-crystalline Ni-base superalloys at elevated temperatures depends among others on solid solution strengthening of the γ-matrix. To study the influence of various solid solution strengtheners on the mechanical properties, a series of Ni-base superalloys with the same content of different alloying elements (Ir, Mo, Re, Rh, Ru, W) or element combinations (MoW, ReMo, ReW) was investigated. Nanoindentation measurements were performed to correlate the partitioning behavior of the solid solution strengtheners with the hardness of the individual phases. The lowest γ′/γ-hardness ratio was observed for the Re-containing alloy with the strongest partitioning of Re to the γ-matrix. As a result of the creep experiments in the high-temperature/low-stress regime (1373 K (1100 °C)/140 MPa), it can be concluded that solid solution hardening in the γ-phase plays an essential role. The stronger the partitioning to the γ-phase and the lower the interdiffusion coefficient of the alloying element, the better the creep resistance. Therefore, the best creep behavior is found for alloys containing high contents of slow-diffusing elements that partition preferably to the γ-phase, particularly Re followed by W and Mo.

Pseudoelasticity in High Strengthening Fcc Single Crystals

1996 ◽  
Vol 459 ◽  
Author(s):  
Yu.I. Chumlyakov ◽  
I. V. Kireeva ◽  
G. S. Kapasova ◽  
E. I. Litvinova
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
Single Crystals ◽  
Stress Level ◽  
Deformation Mechanism ◽  
Crystal Orientation ◽  
Dispersion Hardening ◽  
Solid Solution Strengthening ◽  
Solution Strengthening ◽  
Applied Stresses

ABSTRACTIt was experimentally shown that the achievement of a high deforming stress level due to dispersion hardening and solid solution strengthening of FCC single crystals with a low stacking-fault energy leads to the deformation mechanism changing from slip to twinning, the dependence of mechanical properties on a crystal orientation and a sign of applied stresses. During deformation by twinning at T<150–300K effects of pseudoelasticity associated with elastic twinning is observed.

The Effect of Heat Treatment on Microstructure and Mechanical Properties of ZK60 Alloy

2007 ◽  
Vol 353-358 ◽  
pp. 718-721
Author(s):  
Ding Fei Zhang ◽  
Rong Shen Liu ◽  
Jian Peng ◽  
Wei Yuang ◽  
Hong Ju Zhang
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Solid Solution ◽  
Age Hardening ◽  
Second Phase ◽  
Solid Solution Strengthening ◽  
Microstructure And Mechanical Properties ◽  
Long Time ◽  
Zk60 Alloy ◽  
Solution Strengthening

With different heat treatment, the microstructure and mechanical properties of ZK60 magnesium alloy were investigated. It can be concluded that heat treatment has great effect on mechanical properties of ZK60. With artificial aging after extruding, the precipitation of the second phase from the supersaturated solid solution significantly improved mechanical properties. It can greatly increase yield strength of ZK60 alloy, while the tensile strength has little change. For the combination of solid solution strengthening and age hardening, two opposite factors must be considered. On one hand, the solid solution strengthening and the later precipitation strengthening is good for alloy’s strength; on the other hand, the properties decrease as the grains grew under high temperature for a long time during solution heating.

Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder

2019 ◽  
Author(s):  
S. M. Kamrul Hasan ◽  
Abdullah Fahim ◽  
Jeffrey C. Suhling ◽  
Sa’d Hamasha ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Elastic Modulus ◽  
High Temperature ◽  
Thermal Cycling ◽  
Microstructural Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Extreme ◽  
Aging Effects ◽  
Free Solder

Abstract Lead free electronic assemblies are often subjected to thermal cycling during qualification testing or during actual use. The dwell periods at the high temperature extreme during thermal cycling cause thermal aging phenomena in the solder material, including microstructural evolution and material property degradation. In addition, lead free solders can also experience aging effects during the ramp periods between the low and high temperature extremes of the cycling. In this study, the mechanical behavior evolution occurring in SAC305 lead free solder subjected to various thermal cycling exposures has been investigated. Uniaxial test specimens were prepared by reflowing solder in rectangular cross-section glass tubes with a controlled temperature profile. After reflow solidification, the samples were placed into the environmental chamber and thermally cycled from −40 C to +125 C under a stress-free condition (no load). Several thermal cycling profiles were examined including: (1) 90 minute cycles with 15 minutes ramps and 30 minutes dwells, (2) air-to-air thermal shock exposures with 30 minutes dwells and near instantaneous ramps, (3) 30 minute cycles with 15 minutes ramps and no dwells (saw tooth profile), (4) 150 minute cycles with 45 minutes ramps and 30 minutes dwells, and (5) no cycling (simple aging at the high temperature extreme). For each profile, 10–15 samples were cycled for various durations of cycling (e.g. 48, 96, and 240 cycles), which were equivalent to various aging times at the high temperature extreme of T = 125 C. After cycling, the stress-strain curves and mechanical properties including effective elastic modulus and Ultimate Tensile Strength (UTS) of all the cycled samples were measured. For each cycling profile, the evolutions of the mechanical properties were characterized as a function of the cycling duration, as well as the net aging time at the high temperature extreme. Comparison of the results of various thermal cycling profiles showed that the detrimental effects of aging are accelerated in a thermal cycling environment. Furthermore, microstructure evolution during thermal cycling has also been investigated to validate the observed mechanical properties degradation. The test results revealed that the mechanical properties degradation of SAC305 are higher in thermal cycling compared to simple equivalent aging. For example, the elastic modulus and UTS of SAC305 reduced by 41%, and 38%, respectively after 5 days aging whereas these properties reduced by 69%, and 51%, respectively after 5 days equivalent aging using thermal cycling profile #4 (240 cycles).

scholarly journals Orientation-dependent solid solution strengthening in zirconium: a nanoindentation study

2019 ◽  
Vol 55 (10) ◽  
pp. 4493-4503 ◽  
Author(s):  
Arijit Lodh ◽  
Prita Pant ◽  
Gulshan Kumar ◽  
K. V. Mani Krishna ◽  
Raghvendra Tewari ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
Finite Element ◽  
Elastic Modulus ◽  
Constitutive Relationship ◽  
Insignificant Change ◽  
Solid Solution Strengthening ◽  
Pure Zirconium ◽  
Solution Strengthening ◽  
Peak Value

AbstractOrientation-dependent solid solution strengthening was explored through a combined microtexture plus nanoindentation study. Pure zirconium (6N purity crystal-bar Zr) and commercial Zircaloy-2 were investigated for comparison. Local mechanical properties were estimated through finite element (FE) simulations of the unloading part of the nanoindentation load–displacement response. Combinations of ‘averaging’ scheme and constitutive relationship were used to resolve uncertainty of FE-extracted mechanical properties. Comparing the two grades, non-basal oriented grains showed an overall hardening and increase in elastic modulus. In contrast, insignificant change was observed for basal (or near-basal) oriented grains. The strengthening of non-basal orientations appeared via elimination of the lowest hardness/stiffness values without a shift in the peak value. Such asymmetric development brought out the clear picture of orientation-dependent solid solution strengthening in zirconium.

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

2018 ◽  
Author(s):  
Abdullah Fahim ◽  
Sudan Ahmed ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Mechanical Properties ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Bulk Solder ◽  
Lead Free ◽  
Nanoindentation Test ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Individual ◽  
Sac Solder

Exposure of lead free solder joints to high temperature isothermal aging conditions leads to microstructure evolution, which mainly includes coarsening of the intermetallic (IMC) phases. In our previous work, it was found that the coarsening of IMCs led to degradation of the overall mechanical properties of the SAC solder composite consisting of β-Sn matrix and IMC particles. However, it is not known whether the isothermal aging changes properties of the individual β-Sn and IMC phases, which could also be affecting to the overall degradation of properties. In this study, the aging induced variations of the mechanical properties of the β-Sn phase, and of Sn-Cu IMC particles in SAC solder joints have been explored using nanoindentation. SAC solder joints extracted from SuperBGA (SBGA) packages were aged for different time intervals (0, 1, 5, 10 days) at T = 125 °C. Nanoindentation test samples were prepared by cross sectioning the solder joints, and then molding them in epoxy and polishing them to prepare the joint surfaces for nanoindentation. Multiple β-Sn grains were identified in joints using optical polarized microscopy and IMCs were also observed. Individual β-Sn grains and IMC particles were then indented at room temperature to measure their mechanical properties (elastic modulus and hardness) and time dependent creep deformations. Properties measured at different aging time were then compared to explore aging induced degradations of the individual phases. The properties of the individual phases did not show significant degradation. Thus, IMC coarsening is the primary reason for the degradation of bulk solder joint properties, and changes of the properties of the individual phases making up the lead free solder material are negligible.

Optical, Thermal, and Mechanical Properties of (Y1-xScx)2O3 Transparent Ceramics

2021 ◽  
Author(s):  
Jiquan Huang ◽  
Changliang YANG ◽  
Qiufeng HUANG ◽  
Zhonghua DENG ◽  
Yun WANG ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solid Solution ◽  
Transparent Ceramics ◽  
Sintering Process ◽  
Vacuum Sintering ◽  
Solid Solution Strengthening ◽  
Complete Solid Solution ◽  
Wide Wavelength Range ◽  
Universal Approach ◽  
Solution Strengthening

Abstract Sesquioxides such as Y2O3 and Sc2O3 are important optical materials, but the fabrication of their transparent ceramics remains a challenge due to the ultra-high melting point of over 2400 oC. In this work, a series of (Y1-xScx)2O3 transparent ceramics were successfully fabricated by a simple vacuum sintering process without any sintering additives, and the effect of Scandium (Sc) content on the crystal structure and optical/thermal/mechanical properties were evaluated. Y2O3 and Sc2O3 form a complete solid solution with a cubic bixbyite structure. The formation of (Y1-xScx)2O3 solid solution promotes the densification of ceramics, leading to the realization of high transparency close to the theoretical transmittance over a wide wavelength range of 0.35-8 mm. In particular, the in-line transmittance in the range of 0.6-6 mm remains above 80% for (Y1-xScx)2O3 with x = 0.23-0.31, while the pristine Y2O3 and Sc2O3 are opaque. Moreover, the mechanical properties including Vickers hardness (Hv), fracture toughness (KIC), and biaxial strength (δb) are evidently enhanced due to the solid solution strengthening, while the thermal conductivity is reduced due to the reduction of photon free path. This study demonstrates that forming of solid solution is a facile and universal approach for preparing sesquioxides transparent ceramics with high optical and mechanical quality.

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