Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

2017 ◽  
Author(s):  
Qian Jiang ◽  
Abhishek Deshpande ◽  
Abhijit Dasgupta
Keyword(s):  
Scale Effect ◽  
Solder Joints ◽  
Volume Fraction ◽  
Coarse Grained ◽  
Heterogeneous Integration ◽  
Length Scale ◽  
Dendrite Morphology ◽  
Heterogeneous Microstructure ◽  
Anisotropic Models ◽  
Lower Tier

The coarse heterogeneous microstructure of SAC alloys makes the behavior of interconnections highly sensitive to its geometric length-scale. Heterogeneous integration and the resulting increase in package complexity and miniaturization are making this scale-effect ever more important. This scale effect derives from the anisotropy of tin and the coarse multi-tiered microstructural heterogeneities in SAC solders. As a result, no two joints behave the same and every joint is unique depending on its specific microstructure. Product teams responsible for reliable heterogeneous integration have to ensure that they have adequate methods to deal with this variability. This paper highlights the multi-tiered microstructural morphology in SAC solders due to the solidification and crystallization process. At the highest tier in the joint microstructure are individual (highly anisotropic) grains that can be 100s of microns in size. At the next lower tier the primary heterogeneity is due to individual dendrites of pro-eutectic β tin, that can have lobes as large as 10–20 microns. At the next lower tier the characteristic heterogeneity is a eutectic mix of nanoscale Ag3Sn IMC particles dispersed in a Sn matrix. Researchers have long recognized that the grain morphology is extremely important to mechanical behavior of BGA solder joints because they are coarse-grained (i.e. there may be only a few anisotropic grains in each BGA solder joint). However, heterogeneous integration has now led to joints that are much smaller (less than 100 microns tall), thus making them of the same length-scale as individual tin dendrites within each grain. In other words, there may be just a few dendrites through the thickness of the joint. Unfortunately, very little attention has focused on SAC behavior at such a small length-scale. This study focuses on the effect of the tin-dendrite morphology on the effective behavior of SAC solder joints, using a combination of experiments and multi-tiered anisotropic models that combine dislocation nano-mechanics with composite micromechanics. The volume fraction of β-Sn dendrite within one crystal could vary from 20% to 80%, depending on the time and temperature above the liquidus temperature and the cooling rates. The effects of volume fraction and aspect ratio of Sn dendrites on the anisotropic steady-state creep rate of single crystal SAC specimen are examined. The objective of the study is to provide insights into the role that solder microstructural heterogeneity will play on package reliability in heterogeneous integration.

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

2013 ◽  
Author(s):  
Preeti Chauhan ◽  
Subhasis Mukherjee ◽  
Michael Osterman ◽  
Abhijit Dasgupta ◽  
Michael Pecht
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Volume Fraction ◽  
Coarse Grained ◽  
Creep Model ◽  
Secondary Creep ◽  
Dispersion Strengthening ◽  
Sac305 Solder ◽  
Particle Spacing ◽  
Cu6sn5 Imcs

SnAgCu (SAC) solders undergo continuous micro structural coarsening during both storage and service. In this study, we use cross-sectioning and image processing techniques to periodically quantify the effect of isothermal aging quantitatively on phase coarsening and evolution, in SAC305 (Sn3.0Ag0.5Cu) solder. SAC305 alloy is aged for (24–1000) hours at 100°C (∼ 0.7–0.8Tmelt). The characteristic parameters monitored during isothermal aging include size, volume fraction, and inter-particle spacing of both nanoscale Ag3Sn intermetallic compounds (IMCs) and micronscale Cu6Sn5 IMCs, as well as the volume fraction of pure tin dendrites in SAC305 solder. Effects of above microstructural evolution on secondary creep constitutive response of SAC305 interconnects were modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs and reinforcement strengthening by micronscale Cu6Sn5 IMCs, respectively; and (2) load sharing between pure Sn dendrites and the surrounding eutectic Sn-Ag phase. The coarse-grained polycrystalline Sn micro structure in SAC305 solder was not captured in the above model because isothermal aging did not appear to cause any significant change in the initial grain morphology of SAC305 solder joints. The above model is shown to predict the drop in creep resistance due to the influence of isothermal aging on SAC305 solder joints.

scholarly journals A scaled MP-PIC method for bubbling fluidization

2021 ◽  
Author(s):  
Xing Zhao ◽  
Yong Jiang ◽  
Fei Li ◽  
Wei Wang
Keyword(s):  
Fluidized Beds ◽  
Volume Fraction ◽  
Phase Particle ◽  
Scaling Law ◽  
Coarse Graining ◽  
Coarse Grained ◽  
Particle In Cell ◽  
Wide Range ◽  
Pic Method ◽  
Multi Phase

Coarse-grained methods have been widely used in simulations of gas-solid fluidization. However, as a key parameter, the coarse-graining ratio, and its relevant scaling law is still far from reaching a consensus. In this work, a scaling law is developed based on a similarity analysis, and then it is used to scale the multi-phase particle-in-cell (MP-PIC) method, and validated in the simulation of two bubbling fluidized beds. The simulation result shows this scaled MP-PIC can reduce the errors of solids volume fraction and velocity distributions over a wide range of coarse-graining ratios. In future, we expect that a scaling law with consideration of the heterogeneity inside a parcel or numerical particle will further improve the performance of coarse-grained modeling in simulation of fluidized beds.

scholarly journals The Dilatometric Analysis of the High Carbon Alloys from Ni-Ta-Al-M System

2014 ◽  
Vol 59 (3) ◽  
pp. 977-980 ◽  
Author(s):  
P. Bała
Keyword(s):  
Elevated Temperatures ◽  
Volume Fraction ◽  
Intermetallic Phase ◽  
Coarse Grained ◽  
Precipitation Process ◽  
Cast State ◽  
High Carbon ◽  
Chromium Carbides ◽  
Tantalum Carbides ◽  
Co Alloys

Abstract In the following work presents results of high carbon alloys from the Ni-Ta-Al-M system are presented. The alloys have been designed to have a good tribological properties at elevated temperatures. Despite availability of numerous hot work tool materials there is still a growing need for new alloys showing unique properties, which could be used under heavy duty conditions, i.e. at high temperatures, in a chemically aggressive environment and under heavy wear conditions. A characteristic, coarse-grained dendritic microstructure occurs in the investigated alloys in the as-cast condition. Primary dendrites with secondary branches can be observed. Tantalum carbides of MC type and graphite precipitations are distributed in interdendritic spaces in the Ni-Ta-Al-C and Ni-Ta-Al-C-Co alloys, while Tantalum carbides of MC type and Chromium carbides of M7C3 type appeared in the Ni-Ta-Al-C-Co-Cr and Ni-Ta-Al-C-Cr alloys. In all alloys g’ phase is present, however, its volume fraction in the Ni-Ta-Al-C and Ni-Ta-Al-C-Co alloys is small.During heating from as-cast state in Ni-Ta-Al-C and Ni-Ta-Al-C-Co alloys, the beginning of the tantalum carbides precipitation process (MC type) followed (or simultaneous) by the intermetallic phase precipitation (g’ – Ni3(AlTa)) was stated, while in Ni-Ta-Al-C-Co-Cr and Ni-Ta-Al-C-Cr alloys, besides Tantalum carbides also the Chromium carbides precipitation occurred. It means that the investigated alloys were partially supersaturated in as-cast state. Above 1050°C in all investigated alloys the g’ phase is dissolving. In addition, the precipitation of secondary carbides during slow cooling was occured.

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

2018 ◽  
Vol 15 (4) ◽  
pp. 148-162 ◽  
Author(s):  
John Lau ◽  
Ming Li ◽  
Yang Lei ◽  
Margie Li ◽  
Iris Xu ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Thermal Cycling Test ◽  
Wafer Level ◽  
Molding Compound ◽  
Shock Test ◽  
Cycling Test

Abstract In this study, the reliability (thermal cycling and shock) performances of a fan-out wafer-level system-in-package (SiP) or heterogeneous integration with one large chip (5 × 5 mm), three small chips (3 ×3 mm), and four capacitors (0402) embedded in an epoxy molding compound package (10 × 10 mm) with two redistribution layers (RDLs) are experimentally determined. Emphasis is placed on the estimation of the Weibull life distribution, characteristic life, and failure rate of the solder joint and RDL of this package. The fan-out wafer-level packaging is assembled on a printed circuit board (PCB) with more than 400 (Sn3wt%Ag0.5wt%Cu) solder joints. It is a six-layer PCB. The sample sizes for the thermal cycling test and shock test are, respectively, equal to 60 and 24. The failure location and modes of the thermal cycling test and shock test of the fan-out wafer-level SiP solder joints and RDLs are provided and discussed. 3-D nonlinear finite element models are also constructed and analyzed for the fan-out heterogeneous integration package during thermal cycling and shock conditions. The simulation results are correlated to the experimental results. Finally, recommendations on improving the fan-out wafer-level SiP solder joints and RDLs under thermal and shock conditions are provided.

Fiber Diameter-Dependent Elastic Deformation in Polymer Composites—A Numerical Study

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Nitin Garg ◽  
Gurudutt Chandrashekar ◽  
Farid Alisafaei ◽  
Chung-Souk Han
Keyword(s):  
Mechanical Behavior ◽  
Polymer Composites ◽  
Elastic Deformation ◽  
Volume Fraction ◽  
Fiber Diameter ◽  
Scale Effects ◽  
Numerical Study ◽  
Length Scale ◽  
Fiber Volume ◽  
Reinforced Polymer

Abstract Microbeam bending and nano-indentation experiments illustrate that length scale-dependent elastic deformation can be significant in polymers at micron and submicron length scales. Such length scale effects in polymers should also affect the mechanical behavior of reinforced polymer composites, as particle sizes or diameters of fibers are typically in the micron range. Corresponding experiments on particle-reinforced polymer composites have shown increased stiffening with decreasing particle size at the same volume fraction. To examine a possible linkage between the size effects in neat polymers and polymer composites, a numerical study is pursued here. Based on a couple stress elasticity theory, a finite element approach for plane strain problems is applied to predict the mechanical behavior of fiber-reinforced epoxy composite materials at micrometer length scale. Numerical results show significant changes in the stress fields and illustrate that with a constant fiber volume fraction, the effective elastic modulus increases with decreasing fiber diameter. These results exhibit similar tendencies as in mechanical experiments of particle-reinforced polymer composites.

scholarly journals Modelling and Experimental Validation of the Porosity Effect on the Behaviour of Nano-Crystalline Materials

Metals ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 821
Author(s):  
Panagiotis Bazios ◽  
Konstantinos Tserpes ◽  
Spiros Pantelakis
Keyword(s):  
Numerical Model ◽  
Volume Fraction ◽  
Coarse Grained ◽  
Compression Tests ◽  
X Ray Diffraction ◽  
Static Compression ◽  
Crystalline Materials ◽  
Nano Crystalline ◽  
Porosity Effect ◽  
Grain Diameter

Nano-crystalline metals have attracted considerable attention over the past two decades due to their increased mechanical properties as compared to their microcrystalline counterparts. However, the behaviour of nano-crystalline metals is influenced by imperfections introduced during synthesis or heat treatment. These imperfections include pores, which are mostly located in the area of grain boundaries. To study the behaviour of multiphase nano-crystalline materials, a novel fully parametric algorithm was developed. The data required for implementing the developed numerical model were the volume fraction of the alloying elements and their basic properties as well as the density and the size of randomly distributed pores. To validate the developed algorithm, the alloy composition 75 wt% tungsten and 25 wt% copper was examined experimentally under compression tests. For the investigation, two batches of specimens were used; a batch having a coarse-grained microstructure with an average grain diameter of 150 nm and a nanocrystalline batch having a grain diameter of 100 nm, respectively. The porosity of both batches was derived to range between 9% and 10% based on X-ray diffraction analyses. The results of quasi-static compression testing revealed that the nanocrystalline W-Cu material exhibited brittle behaviour which was characterised by an elastic deformation that led to fracture without remarkable plasticity. A compressive strength of about 1100 MPa was derived which was more than double compared to conventional W-Cu samples. Finite element simulations of the behaviour of porous nano-crystalline materials were performed and compared with the respective experimental compression tests. The numerical model and experimental observations were in good agreement.

scholarly journals Length-scale effect in stability problems for thin biperiodic cylindrical shells: extended tolerance modelling

2020 ◽  
Author(s):  
B. Tomczyk ◽  
M. Gołąbczak ◽  
A. Litawska ◽  
A. Gołąbczak
Keyword(s):  
Scale Effect ◽  
Cylindrical Shells ◽  
Length Scale ◽  
Stability Problems ◽  
Constant Coefficients ◽  
A Cell ◽  
Circular Cylindrical Shells ◽  
Tolerance Modelling ◽  
Tolerance Model ◽  
Shell Equations

Abstract Thin linearly elastic Kirchhoff–Love-type circular cylindrical shells of periodically micro-inhomogeneous structure in circumferential and axial directions (biperiodic shells) are investigated. The aim of this contribution is to formulate and discuss a new averaged nonasymptotic model for the analysis of selected stability problems for these shells. This, so-called, general nonasymptotic tolerance model is derived by applying a certain extended version of the known tolerance modelling procedure. Contrary to the starting exact shell equations with highly oscillating, noncontinuous and periodic coefficients, governing equations of the tolerance model have constant coefficients depending also on a cell size. Hence, the model makes it possible to investigate the effect of a microstructure size on the global shell stability (the length-scale effect).

scholarly journals IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

Materials ◽  
2020 ◽  
Vol 13 (1) ◽  
pp. 252 ◽  
Author(s):  
Ning Ren ◽  
Heng Fang ◽  
Dong Wang ◽  
Chenyi Hou ◽  
Yatao Zhao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Brittle Fracture ◽  
Ductile Fracture ◽  
Solder Joints ◽  
Volume Fraction ◽  
Tensile Tests ◽  
Stress Concentrations ◽  
Element Analysis ◽  
Scale Down ◽  
Long Rod

The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationships between varying IMC volumes and mechanical properties of Ni/Sn(20μm)/Ni micro-joints. A designed method that followed the IMC volume as the only variable was used to prepare micro-joint samples with different IMC volumes. The continuously thickened Ni3Sn4 IMCs exhibited a noticeable morphology evolution from rod-like to chunky shape. The subsequent tensile tests showed unexpected tensile strength responses as increasing Ni3Sn4 volume, which was strongly associated with the Ni3Sn4 morphological evolutions. Fractographic analysis displayed that the ductile fracture dominates the 20%–40% IMC micro-joints, whereas the brittle fracture governs the 40%–80% IMC micro-joints. For the ductile fracture-dominated joints, an abnormal reduction in strength occurred as increasing IMCs volume from 20% to 40%. This is primarily due to severe stress concentrations caused by the transformed long rod-typed morphology of the Ni3Sn4. For the brittle fracture-dominated joints, the strength appeared a monotonous increase as the Ni3Sn4 volume increased. This may be attributed to the increased crack resistance resulting from continuous coarsening of the chunky Ni3Sn4 without any voids. Moreover, the finite element analysis was provided to further understand the joint failure mechanisms.

scholarly journals Modeling the Contact Mechanics of Hydrogels

Lubricants ◽  
2019 ◽  
Vol 7 (4) ◽  
pp. 35
Author(s):  
Martin H. Müser ◽  
Han Li ◽  
Roland Bennewitz
Keyword(s):  
Contact Mechanics ◽  
Feasibility Study ◽  
Three Dimensions ◽  
Coarse Grained ◽  
Length Scale ◽  
Two Dimensional ◽  
Spring Model ◽  
Mechanical Pressure ◽  
Solvent Quality ◽  
A Chain

A computationally lean model for the coarse-grained description of contact mechanics of hydrogels is proposed and characterized. It consists of a simple bead-spring model for the interaction within a chain, potentials describing the interaction between monomers and mold or confining walls, and a coarse-grained potential reflecting the solvent-mediated effective repulsion between non-bonded monomers. Moreover, crosslinking only takes place after the polymers have equilibrated in their mold. As such, the model is able to reflect the density, solvent quality, and the mold hydrophobicity that existed during the crosslinking of the polymers. Finally, such produced hydrogels are exposed to sinusoidal indenters. The simulations reveal a wavevector-dependent effective modulus E * ( q ) with the following properties: (i) stiffening under mechanical pressure, and a sensitivity of E * ( q ) on (ii) the degree of crosslinking at large wavelengths, (iii) the solvent quality, and (iv) the hydrophobicity of the mold in which the polymers were crosslinked. Finally, the simulations provide evidence that the elastic heterogeneity inherent to hydrogels can suffice to pin a compressed hydrogel to a microscopically frictionless wall that is undulated at a mesoscopic length scale. Although the model and simulations of this feasibility study are only two-dimensional, its generalization to three dimensions can be achieved in a straightforward fashion.

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