System-Level Packaging of Wide Bandgap Inverters for Electric Traction Drive Vehicles

Author(s):  
Kraig J. Olejniczak ◽  
Tom Flint ◽  
David Simco ◽  
Sergei Storkov ◽  
Brad McGee ◽  
...  

In this paper, we describe the system-level packaging of a 30 kW continuous, 55 kW peak, traction inverter to showcase the electro-thermal-mechanical performance enhancements of silicon carbide (SiC), a wide bandgap (WBG) semiconductor, over silicon. Higher efficiency, larger gravimetric and volumetric power densities, and smaller thermal management system requirements may be achieved through higher operating junction temperatures afforded by SiC versus silicon power devices. By applying advanced system-level packaging techniques, high-temperature control circuitry, utilizing 105°C-rated capacitors, and reducing the number of system interconnects and attaches to enable higher system reliability, a substantial cost reduction from the die level to the system level can be demonstrated by completely eliminating an electric vehicle’s secondary low-temperature cooling loop. The endgame is to reduce the traction inverter size (≥ 13.4 kW [peak]/L), weight (≥ 14.1 kW [peak]/kg), and cost (≤ $182/100,000) relative to output power while maintaining 15-year reliability metrics [1].

Navigation ◽  
1965 ◽  
Vol 12 (4) ◽  
pp. 339-347
Author(s):  
ERIC S. GUTTMANN

2004 ◽  
Vol 47 (2) ◽  
pp. 15-24
Author(s):  
Dustin Aldridge

A vehicle case study is used to illustrate a methodology of analysis and testing to predict component and system reliability and durability. The methodology integrates customer usage data, component failure distribution, system failure criteria, manufacturing variation, and customer severity variation. Extending this methodology to the vehicle system level enables correlation between component and system requirements. Further, this analysis provides the basis to establish a knowledge-based test option for a successful test validation program to demonstrate reliability.


2016 ◽  
Vol 858 ◽  
pp. 797-802 ◽  
Author(s):  
Anant Agarwal ◽  
Woong Je Sung ◽  
Laura Marlino ◽  
Pawel Gradzki ◽  
John Muth ◽  
...  

The attributes and benefits of wide-bandgap (WBG) semiconductors are rapidly becoming known, as their use in power electronics applications continues to gain industry acceptance. However, hurdles still exist in achieving widespread market acceptance, on a par with traditional silicon power devices. Primary challenges include reducing device costs and the expansion of a workforce trained in their use. The Department of Energy (DOE) is actively fostering development activities to expand application spaces, achieve acceptable cost reduction targets and grow the acceptance of WBG devices to realize DOEs core missions of more efficient energy generation, greenhouse gas reduction and energy security within the U.S. This paper discusses currently funded activities and application areas that are suitable for WBG introduction. A detailed cost roadmap for SiC device introduction is also presented.


2014 ◽  
Vol 598 ◽  
pp. 215-218 ◽  
Author(s):  
Ersoy Kıvılcım ◽  
Beriş Banu

This paper demonstrates how to establish the system level requirement set for an aviation piston engine, which is intended to be used for a MALE class UAV and for a Part 23 Normal category airplane. Here, it will be demonstrated, which requirements should be taken into account to construct the system level requirement set. This work is aimed to depict a methodology to create the system level requirement set.


Energies ◽  
2022 ◽  
Vol 15 (1) ◽  
pp. 304
Author(s):  
Akshay Nag Srinath ◽  
Álvaro Pena Pena López ◽  
Seyed Alireza Miran Miran Fashandi ◽  
Sylvain Lechat ◽  
Giampiero di di Legge ◽  
...  

The thermal management system architectures proposed for hydrogen-powered propulsion technologies are critically reviewed and assessed. The objectives of this paper are to determine the system-level shortcomings and to recognise the remaining challenges and research questions that need to be sorted out in order to enable this disruptive technology to be utilised by propulsion system manufacturers. Initially, a scientometrics based co-word analysis is conducted to identify the milestones for the literature review as well as to illustrate the connections between relevant ideas by considering the patterns of co-occurrence of words. Then, a historical review of the proposed embodiments and concepts dating back to 1995 is followed. Next, feasible thermal management system architectures are classified into three distinct classes and its components are discussed. These architectures are further extended and adapted for the application of hydrogen-powered fuel cells in aviation. This climaxes with the assessment of the available evidence to verify the reasons why no hydrogen-powered propulsion thermal management system architecture has yet been approved for commercial production. Finally, the remaining research challenges are identified through a systematic examination of the critical areas in thermal management systems for application to hydrogen-powered air vehicles’ engine cooling. The proposed solutions are discussed from weight, cost, complexity, and impact points of view by a system-level assessment of the critical areas in the field.


1997 ◽  
Vol 483 ◽  
Author(s):  
C. E. Weitzel ◽  
K. E. Moore

AbstractImpressive RF power performance has been demonstrated by three radically different wide bandgap semiconductor power devices, SiC MESFET's, SiC SIT's, and AlGaN HFET's. AlGaN HFET's have achieved the highest fmax 97 GHz. 4H-SiC MESFET's have achieved the highest power densities, 3.3 W/mm at 850 MHz (CW) and at 10 GHz (pulsed). 4H-SiC SIT's have achieved the highest output power, 450 W (pulsed) at 600 MHz and 38 W (pulsed) at 3 GHz. Moreover a one kilowatt, 600 MHz SiC power module containing four multi-cell SIT's with a total source periphery of 94.5 cm has been demonstrated.


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