Micro-Feature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold Plate Operation

2015 ◽  
Author(s):  
Noris Gallandat ◽  
Danielle Hesse ◽  
J. Rhett Mayor
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Flow Rate ◽  
Heat Sink ◽  
Convective Heat Transfer Coefficient ◽  
Water Flow Rate ◽  
Variable Density ◽  
Flow Path ◽  
Cold Plate ◽  
Reduced Pressure

The purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of micro-features in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of micro-feature enhancement on the convective side improves heat transfer due to an increase in surface area. Specific shapes such as micro hydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat source (20 × 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061 and micro-hydrofoils with a characteristic length of 500 μm were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90°C and the difference between the maximum temperatures of each heat source is less than 6.7 °C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Noris Gallandat ◽  
Danielle Hesse ◽  
J. Rhett Mayor
Keyword(s):  
Heat Transfer ◽  
Flow Rate ◽  
Heat Sink ◽  
Convective Heat Transfer Coefficient ◽  
Water Flow Rate ◽  
Flow Path ◽  
Heat Sources ◽  
Cold Plate ◽  
Reduced Pressure ◽  
Discrete Heat Sources

The purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as micro-hydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 × 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and micro-hydrofoils with a characteristic length of 500 μm were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 °C, and the difference between the maximum temperatures of each heat source is less than 6.7 °C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.

Thermal Performance Comparison for Five Liquid Heat Sink Designs

2011 ◽  
Author(s):  
Christopher Greene ◽  
Randall D. Manteufel ◽  
Amir Karimi
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Flow Rate ◽  
Heat Sink ◽  
Fluid Velocity ◽  
Water Flow Rate ◽  
High Flow ◽  
Heat Transfer Area ◽  
Flow Rates

Five high-flow liquid-cooled heat sink designs are compared for the cooling of a single chip CPU. Five distinctive design configurations are considered with regard to the introduction, passage, and extraction of cooling fluid. The typical water flow rate is about 3.8 liters per minute (lpm) with flow passages in the primary heat transfer area ranging from 2 to 0.1mm. The design configurations are summarized and compared, considering: the primary convective heat transfer area, flow passage streamlining, acceleration mechanisms, and nominal fluid velocity in the primary heat transfer area. Overall pressure drop and thermal resistance are compared for varying flow rates of water. At the nominal flow, the pressure drops ranged from 1 kPa to 20 kPa. In the restrictive designs, such as nozzles, flow acceleration accounts for the largest source of pressure drop. In some designs, a large fraction of the overall pressure drop is due to circuitous flow associated with the introduction and/or extraction of flow which contributes little to heat removal. At the nominal flow, the overall thermal resistance varied from 0.14 to 0.18 C/W. As flow rate increases the overall thermal resistance decreases. Results indicated that 80 to 85% of the total thermal resistance is due to conduction and about 15 to 20% attributed to convection at the nominal flow rate. There is minimal thermal benefit for flow rates beyond twice the nominal while this substantially increases fluid pumping requirements. This study highlights design features which yield above average heat transfer performance with minimal pressure drop for high-flow liquid-cooled heat sinks.

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

2000 ◽  
Author(s):  
X. Wei ◽  
Y. Joshi
Keyword(s):  
Flow Rate ◽  
Heat Sink ◽  
Water Flow Rate ◽  
Heat Removal ◽  
Single Layer ◽  
Heat Sinks ◽  
Computationally Efficient ◽  
Liquid Cooling ◽  
Number Of Layers ◽  
Microelectronic Components

Abstract A novel heat sink based on a multi-layer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6 m3/s (50 ml/min) to 6.67×10−6 m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

Heat Transfer and Pressure Drop in a Converging Pedestal Array With Exit Area Variation

2018 ◽  
Author(s):  
L. W. Soma ◽  
F. E. Ames ◽  
S. Acharya
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Flow Rate ◽  
Film Cooling ◽  
Reynolds Numbers ◽  
Flow Path ◽  
Internal Cooling ◽  
Channel Measurements ◽  
Trailing Edge ◽  
Cooling Air

The trailing edge of a vane is one of the most difficult areas to cool due to a narrowing flow path, high external heat transfer rates, and deteriorating external film cooling protection. Converging pedestal arrays are often used as a means to provide internal cooling in this region. The thermally induced stresses in the trailing edge region of these converging arrays have been known to cause failure in the pedestals of conventional solidity arrays. The present paper documents the heat transfer and pressure drop through two high solidity converging rounded diamond pedestal arrays. These arrays have a 45 percent pedestal solidity. One array which was tested has nine rows of pedestals with an exit area in the last row consistent with the convergence. The other array has eight rows with an expanded exit in the last row to enable a higher cooling air flow rate. The expanded exit of the eight row array allows a 30% increase in the coolant flow rate compared with the nine row array for the same pressure drop. Heat transfer levels correlate well based on local Reynolds numbers but fall slightly below non converging arrays. The pressure drop across the array naturally increases toward the trailing edge with the convergence of the flow passage. A portion of the cooling air pressure drop can be attributed to acceleration while a portion can be attributed to flow path losses. Detailed array static pressure measurements provide a means to develop a correlation for the prediction of pressure drop across the cooling channel. Measurements have been acquired over Reynolds numbers based on exit flow conditions and the characteristic pedestal length scale ranging from 5000 to over 70,000.

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

2003 ◽  
Vol 125 (1) ◽  
pp. 104-113 ◽  
Author(s):  
Chang-Yuan Liu ◽  
Ying-Huei Hung
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nusselt Number ◽  
Thermal Resistance ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Average Nusselt Number ◽  
Cold Plate ◽  
Air Mass

Both experimental and theoretical investigations on the heat transfer and flow friction characteristics of compact cold plates have been performed. From the results, the local and average temperature rises on the cold plate surface increase with increasing chip heat flux or decreasing air mass flow rate. Besides, the effect of chip heat flux on the thermal resistance of cold plate is insignificant; while the thermal resistance of cold plate decreases with increasing air mass flow rate. Three empirical correlations of thermal resistance in terms of air mass flow rate with a power of −0.228 are presented. As for average Nusselt number, the effect of chip heat flux on the average Nusselt number is insignificant; while the average Nusselt number of the cold plate increases with increasing Reynolds number. An empirical relationship between Nu¯cp and Re can be correlated. In the flow frictional aspect, the overall pressure drop of the cold plate increases with increasing air mass flow rate; while it is insignificantly affected by chip heat flux. An empirical correlation of the overall pressure drop in terms of air mass flow rate with a power of 1.265 is presented. Finally, both heat transfer performance factor “j” and pumping power factor “f” decrease with increasing Reynolds number in a power of 0.805; while they are independent of chip heat flux. The Colburn analogy can be adequately employed in the study.

Experimental Characterization of Heat Transfer to Vertical Dense Granular Flows Across Wide Temperature Range

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Megan F. Watkins ◽  
Richard D. Gould
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Flow Rate ◽  
Convective Heat Transfer Coefficient ◽  
Granular Flows ◽  
Effect Of Temperature ◽  
Cylindrical Tubes ◽  
Operating Temperatures ◽  
Dense Granular Flows

Particle-based heat transfer fluids for concentrated solar power (CSP) tower applications offer a unique advantage over traditional fluids, as they have the potential to reach very high operating temperatures. Gravity-driven dense granular flows through cylindrical tubes demonstrate potential for CSP applications and are the focus of the present study. The heat transfer capabilities of such a flow system were experimentally studied using a bench-scale apparatus. The effect of the flow rate and other system parameters on the heat transfer to the flow was studied at low operating temperatures (<200 °C), using the convective heat transfer coefficient and Nusselt number to quantify the behavior. For flows ranging from 0.015 to 0.09 m/s, the flow rate appeared to have negligible effect on the heat transfer. The effect of temperature on the flow's heat transfer capabilities was also studied, examining the flows at temperatures up to 1000 °C. As expected, the heat transfer coefficient increased with the increasing temperature due to enhanced thermal properties. Radiation did not appear to be a key contributor for the small particle diameters tested (approximately 300 μm in diameter) but may play a bigger role for larger particle diameters. The experimental results from all trials corroborate the observations of other researchers; namely, that particulate flows demonstrate inferior heat transfer as compared with a continuum flow due to an increased thermal resistance adjacent to the tube wall resulting from the discrete nature of the flow.

Analysis of Triangular Microchannel Under Forced Convection Heat Transfer Condition for Laminar Flow Condition

2013 ◽  
Author(s):  
D. A. Kamble ◽  
B. S. Gawali
Keyword(s):  
Heat Transfer ◽  
Laminar Flow ◽  
Water Flow ◽  
Flow Rate ◽  
Heat Input ◽  
Water Flow Rate ◽  
Temperature Drop ◽  
Experimental Result ◽  
Rate Condition ◽  
Wide Range

Micro-convection is a strategic area in transport phenomena, since it is the basis for a wide range of miniaturized high-performance heat transfer applications. Surface area is one of the important parameter for high flux heat transfer in microchannel performance. This experimental study deals with heat transfer using triangular microchannel having hydraulic diameters of 321μm and 289μm. Experimentation is carried out for triangular microchannel set for different heat input and flow rate condition. Triangular microchannel are manufactured with EDM technology. Testing of microchannel under laminar flow is considered with different tip angle, spacing, and length of microchannels. The different microchannels made up of copper material with 29 microchannel each having three different sets of length of 50 mm, 70 mm and 90 mm respectively. Tip angles for triangular microchannel is varied 50 ° and 60 ° with width of 30 mm each respectively are analyzed numerically. Spacing between triangular microchannels is also varied and 300μm and 400μm are considered for the analysis. Water flow rate is considered laminar flow. The flow rate of water is varied from 0.0167 kg/sec to 0.167 kg/sce to carry away heat. It is observed that as hydraulic diameters increase the heat transfer coefficient decreases. As the heat input to microchannel increases from 10 Watt to 100 Watt the temperature drop across varies from 2° C to 22°C as water flow rate increases. The numerical analysis is done using computer C programming. Experimental result differ from theoretical for temperature drop with variation of 2°C to 5°C. It is also observed that in all triangular microchannels its geometry i.e. tip angle and hydraulic diameter are dominant parameters which influences on rate of heat transfer. With increasing channel depth, increases flow passage area therefore enhances heat transfer sufficiently. From experimentation a Nu number correlation is proposed with considering tip angle, length, spacing of microchannel and other related parameters.

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

2004 ◽  
Vol 126 (4) ◽  
pp. 519-523 ◽  
Author(s):  
Siddharth Bhopte ◽  
Musa S. Alshuqairi ◽  
Dereje Agonafer ◽  
Gamal Refai-Ahmed
Keyword(s):  
Heat Transfer ◽  
Heat Source ◽  
Mixed Convection ◽  
Heat Sink ◽  
Three Dimensional ◽  
Source Surface ◽  
Air Cooling ◽  
Transfer Rates ◽  
Nusselt Numbers ◽  
Air Jet

The current numerical investigation will examine the effect of an impinging mixed convection air jet on the heat transfer rate of a parallel flat plate heat sink. A three-dimensional numerical model was developed to evaluate the effects of the nozzle diameter d, nozzle-to-target vertical placement H/d, Rayleigh number, and the jet Reynolds number on the heat transfer rates from a discrete heat source. Simulations were performed for a Prandtl number of 0.7 and for Reynolds numbers ranging from 100 to 5000. The governing equations were solved in the dimensionless form using a commercial finite-volume package. Average Nusselt numbers were obtained, at H/d=3 and two jet diameters, for the bare heat source, for the heat source with a base heat sink, and for the heat source with the finned heat sink. The heat transfer rates from the bare heat source surface have been compared with the ones obtained with the heat sink in order to determine the overall performance of the heat sink in an impingement configuration.

Multi-Layer Thermionic-Tunneling Structures for Power Generation

2005 ◽  
Author(s):  
Taofang Zeng
Keyword(s):  
Heat Transfer ◽  
Power Generation ◽  
Electron Transport ◽  
Heat Source ◽  
Heat Sink ◽  
Interface Design ◽  
Thermionic Emission ◽  
Power Generator ◽  
Layer Structures ◽  
Substantial Temperature

A new method for power generation based on nano-engineered interface design with partially filled gap is proposed. The device combines electron thermionic emission and tunneling to enhance electron transport. Thermal radiation and tunneling contribute to heat transfer in the device, which can be minimized using selected materials. The largely reduced heat transfer coupled with use of multi-layer structures enable a substantial temperature difference between heat source and heat sink or two electrodes, thereby maximizing heat source utilization. Detailed analyses are provided for the solid device operating either as a power generator or as a cooler.

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