Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

2015 ◽  
Author(s):  
Sohail R. Reddy ◽  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Cesar C. Pacheco ◽  
Genesis Vasquez ◽  
...  
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
High Heat ◽  
Maximum Temperature ◽  
Uniform Heat Flux ◽  
Multi Objective ◽  
Pin Fin ◽  
Uniform Heat ◽  
Pin Fins ◽  
Micro Pin Fins

The ability of various arrays of micro pin-fins to reduce maximum temperature of an integrated circuit with a 4 × 3 mm footprint and a 0.5 × 0.5 mm hot spot was investigated numerically. Micro pin-fins having circular, symmetric airfoil and symmetric convex lens cross sections were optimized to handle a background uniform heat flux of 500 W cm−2 and a hot spot uniform heat flux of 2000 W cm−2. A fully three-dimensional conjugate heat transfer analysis was performed and a multi-objective, constrained optimization was carried out to find a design for each pin-fin shape capable of cooling such high heat fluxes. The two simultaneous objectives were to minimize maximum temperature and minimize pumping power, while keeping the maximum temperature below 85 °C. The design variables were the inlet average velocity and shape, size and height of the pin-fins. A response surface was generated for each of the objectives and coupled with a genetic algorithm to arrive at a Pareto frontier of the best trade-off solutions. Stress–deformation analysis incorporating hydrodynamic and thermal loads was performed on the three Pareto optimized configurations. Von-Mises stress for each configuration was found to be significantly below the yield strength of silicon.

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics with a Hot Spot

2016 ◽  
Vol 38 (14-15) ◽  
pp. 1235-1246 ◽  
Author(s):  
Sohail R. Reddy ◽  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Cesar C. Pacheco ◽  
Genesis Vasquez ◽  
...  
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Multi Objective Optimization ◽  
Multi Objective ◽  
Pin Fin ◽  
Pin Fin Arrays

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics

2015 ◽  
Author(s):  
Sohail R. Reddy ◽  
George S. Dulikravich
Keyword(s):  
Heat Flux ◽  
Cross Section ◽  
High Heat ◽  
Heat Transfer Analysis ◽  
Maximum Temperature ◽  
High Heat Flux ◽  
Multi Objective Optimization ◽  
Multi Objective ◽  
Pin Fin ◽  
Pin Fin Arrays

The thermal management capability of various candidates of micro-pin fin arrays is investigated. An integrated circuit having a footprint of 4 × 3 mm with micro-pin fin array having circular, airfoil and convex cross-section is considered. The three pin fin cross-sections along with the cooling schemes are optimized to handle a uniform heat flux of 500 W/cm2 applied to the top surface of the electronic chip. A fully three-dimensional, steady-state conjugate heat transfer analysis was performed on each cooling configuration and a constrained multi-objective optimization was carried out for each of the three micro-pin fin shapes to find pin fin designs configurations capable of cooling such high heat fluxes. The design variables were the geometric parameters defining each pin fin cross section, height of the chip and inlet speed of the coolant. The two simultaneous objectives were to minimize maximum temperature and pressure drop (pumping power), while keeping the maximum temperature below 85°C. A response surface was constructed for each objective function and was coupled with a genetic algorithm to arrive at a Pareto frontier of the best trade-off solutions. Stress-deformation analysis incorporating the hydrodynamic and thermal loads was performed on each of the three optimized configurations. The maximum displacement was found to be on the nano-level, and the Von-Mises stress for each configuration was found to be significantly below the yield strength of Silicon.

Experimental Study of a Single Microchannel Flow Under Non-Uniform Heat Flux

2017 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Maximum Heat ◽  
Uniform Heat ◽  
Microchannel Heat Sinks

Non-uniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on non-uniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e. a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under non-uniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

2015 ◽  
Author(s):  
Sohail R. Reddy ◽  
George S. Dulikravich
Keyword(s):  
Heat Flux ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Heat Transfer Analysis ◽  
Maximum Temperature ◽  
Fluid Temperature ◽  
Cooling Fluid ◽  
Pin Fin ◽  
The Given

Most methods for designing electronics cooling schemes do not offer the information on what levels of heat fluxes are maximally possible to achieve with the given material, boundary and operating conditions. Here, we offer an answer to this inverse problem posed by the question below. Given a micro pin-fin array cooling with these constraints: - given maximum allowable temperature of the material, - given inlet cooling fluid temperature, - given total pressure loss (pumping power affordable), and - given overall thickness of the entire electronic component, find out the maximum possible average heat flux on the hot surface and find the maximum possible heat flux at the hot spot under the condition that the entire amount of the inputted heat is completely removed by the cooling fluid. This problem was solved using multi-objective constrained optimization and metamodeling for an array of micro pin-fins with circular, airfoil and symmetric convex cross sections that is removing all the heat inputted via uniform background heat flux and by a hot spot. The goal of this effort was to identify a cooling pin-fin shape and scheme that is able to push the maximum allowable heat flux as high as possible without the maximum temperature exceeding the specified limit for the given material. Conjugate heat transfer analysis was performed on each of the randomly created candidate configurations. Response surfaces based on Radial Basis Functions were coupled with a genetic algorithm to arrive at a Pareto frontier of best trade-off solutions. The Pareto optimized configuration indicates the maximum physically possible heat fluxes for specified material and constraints.

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

2017 ◽  
Author(s):  
Daniel Bae ◽  
Raphael Mandel ◽  
Michael Ohadi
Keyword(s):  
Heat Flux ◽  
Fluid Pressure ◽  
High Heat ◽  
Working Fluid ◽  
Uniform Heat Flux ◽  
High Heat Flux ◽  
Bonding Structure ◽  
Uniform Heat ◽  
Manifold Microchannel

This work presents the design and characterization of a two-phase, embedded manifold-microchannel (MMC) system for cooling of high heat flux electronics. The study uses a thin-Film Evaporation and Enhanced fluid Delivery System (FEEDS) MMC cooler for high heat flux cooling of electronics. The work builds upon our group’s earlier work in this area with a particular focus on the use of an improved bonding structure and implementation of uniform heat flux heaters that collectively contribute to enhanced performance of the system. In many MMC systems targeted for high heat flux applications microchannels and manifolds are fabricated separately due to different dimensions and tolerances required for each. However, assembly of the system often leaves a gap between the channels and the manifold, thus causing the working fluid to leak through the top of the microfins leading to decreased cooler performance. The effect of this gap is parametrized and analyzed with ANSYS Fluent CFD simulations and discussed in this paper. The findings show that even a few microns wide gap can cause a noticeable degradation of the MMC system performance. Imperfect assembly and the deformation of a microchannel chip due to working fluid pressure can cause gaps, indicating the necessity of uniform and hermetic bonding between the manifold and the tips of the microfins. Furthermore, this work presents the need for better heater designs to enable uniform and high heat flux to the heat transfer surface. Serpentine heaters are often used to mimic electronics in a laboratory environment, but there is a lack of study on the performance characterization of the heaters themselves. In the current work, the performance of a conventional serpentine heater is characterized using ANSYS thermo-electric modeling software. The results show that conventional serpentine heaters are insufficient at providing uniform heat flux in applications where there is a lack of heat spreading-such as in the current embedded cooler — showing deviations ranging over 200 % of the nominal value. The deviations are caused by the many bends present in a serpentine pattern where current density concentrations vary significantly. Two alternate designs are proposed, and numerical simulations show that these new heater designs are capable of providing uniform heat flux, not deviating more than 20% from the nominal heat flux value. The conventional and newly proposed heaters are fabricated, tested, and analyzed with a working FEEDS system.

Spray Cooling for Time Resolved Emission Measurements of ICs

2004 ◽  
Author(s):  
Rama R. Goruganthu ◽  
David Bethke ◽  
Shawn McBride ◽  
Tom Crawford ◽  
Jonathan Frank ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Performance ◽  
Flip Chip ◽  
Cooling System ◽  
Spray Cooling ◽  
Junction Temperature ◽  
Maximum Temperature ◽  
Uniform Heat Flux ◽  
High Heat Flux ◽  
Time Resolved

Abstract Spray cooling is implemented on an engineering tool for Time Resolved Emission measurements using a silicon solid immersion lens to achieve high spatial resolution and for probing high heat flux devices. Thermal performance is characterized using a thermal test vehicle consisting of a 4x3 array of cells each with a heater element and a thermal diode to monitor the temperature within the cell. The flip-chip packaged TTV is operated to achieve uniform heat flux across the die. The temperature distribution across the die is measured on the 4x3 grid of the die for various heat loads up to 180 W with corresponding heat flux of 204 W/cm2. Using water as coolant the maximum temperature differential across the die was about 30 °C while keeping the maximum junction temperature below 95 °C and at a heat flux of 200 W/cm2. Details of the thermal performance of spray cooling system as a function of flow rate, coolant

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