Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

2015 ◽  
Author(s):  
Ah-Young Park ◽  
S. B. Park
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Thermal Loading ◽  
Three Dimensional ◽  
Design Guidelines ◽  
Element Analysis ◽  
Design Guideline ◽  
Management Perspective ◽  
3D Packaging ◽  
3D Package

Three-dimensional (3D) packaging technology is directly related to the increasing I/O number as stacking chips. This technology has the potential to produce integrated circuits with a much better combination of cost, functionality, performance and power consumption. However, stacked chips raise several thermal issues that need to be addressed and eliminated. In this study, a quantitative study of the conventional solder-based interconnection is conducted based on many different cases of thermal loading, using finite element analysis (FEA). This preliminary study clearly shows limitation of the solder-based interconnection in the thermal management perspective. Underfill for microbμmp acts as a barrier of heat transfer in the conventional 3D stacked chip packages. Therefore, as an alternative, Cu-to-Cu direct bonding (CuDB), which has a better thermal conductivity, is proposed. Its parametric study is performed under the same/different loading conditions and dimensions. This study helps to highlight the thermal behavior of 3D packages consisting of various interconnections. Finally, based on the results, we can propose qualitative design guidelines of 3D packaging depending on various environment and conditions.

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

2004 ◽  
Author(s):  
Y. Pang ◽  
E. Scott ◽  
J. D. van Wyk ◽  
Z. Liang
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Three Dimensional ◽  
The Other ◽  
Other Hand ◽  
3D Packaging ◽  
3D Package

With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).

Redesign of NEMO-Type Spherical Acrylic Submersible for Manned Operation to 3000 ft (914 m) Ocean Depth

2001 ◽  
Vol 124 (1) ◽  
pp. 97-107 ◽  
Author(s):  
Partha S. Das
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
Cyclic Fatigue ◽  
Design Guidelines ◽  
Element Analysis ◽  
Design Guideline ◽  
Crack Generation ◽  
Generation Problem

A detailed nonlinear three-dimensional (3-D) finite element analysis (FEA) was performed in Phase I on a NEMO (naval experimental manned observatory) type HBOI (Harbor Branch Oceanographic Institution) spherical acrylic submersible in order to overcome the crack generation problem at its interfaces. An FEA has been carried out to develop a new design guideline, by reducing the higher stresses and relative displacements at the interfaces, which are believed to be two of the main reasons for crack generation at these areas. Variation of the stiffness between dissimilar materials at the interface, lower nylon gasket thickness, overdesigned aluminum hatch and bottom penetrator plug, attachment of the retainer ring with hatch ring, close placement of the rubber padding to the interface between the acrylic sphere, and the retainer ring are found to be the various causes for higher stresses within the acrylic sphere at the nylon gasket/acrylic interface. Based on the new design guidelines, in Phase II, a new spherical acrylic submersible was fabricated and tested. This design resulted in significant improvements by reducing the peak stresses and relative displacements at the gasket/acrylic interface areas. This improvement in design is expected to significantly extend the crack-free cyclic fatigue life of the acrylic submersible at 3000 ft (914 m) ocean depth.

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

Analysis of a Virtual Prototype First-Stage Rotor Blade Using Integrated Computer-Based Design Tools

2006 ◽  
Author(s):  
Michel Arnal ◽  
Christian Precht ◽  
Thomas Sprunk ◽  
Tobias Danninger ◽  
John Stokes
Keyword(s):  
Heat Transfer ◽  
Gas Flow ◽  
Thermal Loading ◽  
Cfd Simulation ◽  
Three Dimensional ◽  
Life Assessment ◽  
Element Analysis ◽  
Pressure Losses ◽  
Cooling Channels ◽  
Internally Cooled

The present paper outlines a practical methodology for improved virtual prototyping, using as an example, the recently re-engineered, internally-cooled 1st stage blade of a 40 MW industrial gas turbine. Using the full 3-D CAD model of the blade, a CFD simulation that includes the hot gas flow around the blade, conjugate heat transfer from the fluid to the solid at the blade surface, heat conduction through the solid, and the coolant flow in the plenum is performed. The pressure losses through and heat transfer to the cooling channels inside the airfoil are captured with a 1-D code and the 1-D results are linked to the three-dimensional CFD analysis. The resultant three-dimensional temperature distribution through the blade provides the required thermal loading for the subsequent structural finite element analysis. The results of this analysis include the thermo-mechanical stress distribution, which is the basis for blade life assessment.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

2011 ◽  
Author(s):  
Matthew Redmond ◽  
Kavin Manickaraj ◽  
Owen Sullivan ◽  
Satish Kumar
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Power Density ◽  
Hot Spot ◽  
Thermal Contact ◽  
Three Dimensional ◽  
Heat Removal ◽  
Thermoelectric Coolers ◽  
Vertical Coupling ◽  
Spot Cooling

Three dimensional (3D) technologies with stacked chips have the potential to provide new chip architecture, improved device density, performance, efficiency, and bandwidth. Their increased power density also can become a daunting challenge for heat removal. Furthermore, power density can be highly non-uniform leading to time and space varying hotspots which can severely affect performance and reliability of the integrated circuits. Thus, it is important to mitigate thermal gradients on chip while considering the associated cooling costs. One method of thermal management currently under investigation is the use of superlattice thermoelectric coolers (TECs) which can be employed for on demand and localized cooling. In this paper, a detailed 3D thermal model of a stacked electronic package with two dies and four ultrathin integrated TECs is studied in order to investigate the efficacy of TECs in hot spot cooling for a 3D technology. We observe up to 14.6 °C of cooling at a hot spot inside the package by TECs. A strong vertical coupling has been observed between the TECs located in top and bottom dies. Bottom TECs can detrimentally heat the top hotspots in both steady state and transient operation. TECs need to be carefully placed inside the package to avoid such undesired heating. Thermal contact resistances between dies, inside the TEC module, and between the TEC and heat spreader are shown to have a crucial effect on TEC performance inside the package. We observed that square root current pulse can provide very efficient short-duration transient cooling at hotspots.

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Soud Farhan Choudhury ◽  
Leila Ladani
Keyword(s):  
Fatigue Life ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Volume Fraction ◽  
Three Dimensional ◽  
Strain Range ◽  
Bulk Solder ◽  
Element Analysis ◽  
Plastic Strain Range ◽  
Inelastic Strains

Currently, intermetallics (IMCs) in the solder joint are getting much attention due to their higher volume fraction in the smaller thickness interconnects. They possess different mechanical properties compared to bulk solder. Large volume fraction of IMCs may affect the mechanical behavior, thermomechanical and mechanical fatigue life and reliability of the solder interconnects due to very brittle nature compared to solder material. The question that this study is seeking to answer is how degrading IMCs are to the thermomechanical reliability of the microbumps used in three-dimensional (3D) integrated circuits (ICs) where the microsolder bumps have only a few microns of bond thicknesses. Several factors such as “squeezed out” solder geometry and IMC thickness are studied through a numerical experiment. Fatigue life is calculated using Coffin–Manson model. Results show that, though undesirable because of high likelihood of creating short circuits, squeezed out solder accumulates less inelastic strains under thermomechanical cyclic load and has higher fatigue life. The results show that with the increase of IMCs thickness in each model, the inelastic strains accumulation per cycle increases, thus decreasing the fatigue life. The drop in fatigue life tends to follow an exponential decay path. On the other hand, it was observed that plastic strain range per cycle tends to develop rapidly in Cu region with the increase in IMC thickness which calls for a consideration of Cu fatigue life more closely when the microbump contains a higher volume fraction of the IMCs. Overall, by analyzing the results, it is obvious that the presence of IMCs must be considered for microsolder bump with smaller bond thickness in fatigue life prediction model to generate more reasonable and correct results.

Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers

2010 ◽  
Vol 132 (2) ◽  
Author(s):  
Huy N. Phan ◽  
Dereje Agonafer
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Analysis Model ◽  
Thermoelectric Coolers ◽  
Active Cooling ◽  
3D Ics ◽  
Cooling Method ◽  
Memory Applications

Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal management of three-dimensional integrated circuits (3D-ICs) leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly nonuniform and nonunidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip. In this study, the development of an experimental model of an active cooling method to cool a 25 W stack-dice to approximately 13°C utilizing a multidimensional configured thermoelectric will be presented.

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