Signal and Power Integrity Co-Simulation on DDR Memory

Author(s):  
Md. Ruhul Quddus ◽  
Sanjiv Soman

Even though it has always been known that Signal Integrity analysis and Power Integrity (Power Delivery) analysis are related, historically they have been treated and analyzed independently with some timing and voltage buckets used to tie the effects of one on the other. When the voltage and timing margins were large, this approach worked quite well. However as voltage levels, timing windows and their margins have shrunk, the traditional method of analyzing them independently no longer suffices. The signal quality and timing (eye height & eye width) losses due to the effects of power delivery are no longer negligible. The concept of signal integrity & power delivery co-simulation (referred to as SIPD or SIPI co-sim) is a methodology developed to address this problem. In this paper we will use the DDR bus as an example to illustrate the impacts of power delivery on the signal and highlight how badly the margin loss would have been underestimated if the effects of power delivery were ignored. The paper will demonstrate how SIPD co-sim can quantify or illustrate - the effects of data randomization, margin gain with fully random data patterns, margin loss due to the effects of Burst-Idle-Burst data patterns, definition of noise & eye diagram BER, statistically significant noise in system, etc.

Author(s):  
Jeff Chen ◽  
Weiping Li ◽  
Feng Ling

RF System-in-Package (SiP) has become a viable packaging platform, which offers great flexibility to integrate ICs with different processes and different architects. With operating frequency becoming higher and multiple available technologies embedded in one package, the system could fail due to the undesired noise coupling resulted from the close proximity of the components. Therefore, the design methodology with signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis becomes essential to tackle the SiP integration issues. The paper presents a RF SiP design methodology with SI/PI/EMC simulations, which greatly reduces the design time and enables first-pass success.


2017 ◽  
Vol 52 (6) ◽  
pp. 1643-1654 ◽  
Author(s):  
Paul N. Whatmough ◽  
Shidhartha Das ◽  
Zacharias Hadjilambrou ◽  
David M. Bull

2019 ◽  
Vol 2019 (1) ◽  
pp. 000381-000386 ◽  
Author(s):  
Kosuke Tsukamoto ◽  
Atsunori Kajiki ◽  
Yuji Kunimoto ◽  
Masayuki Mizuno ◽  
Manabu Nakamura ◽  
...  

Abstract Heterogeneous packaging is one of the advanced technologies. Especially for high-end applications such as data center server, HPC and Artificial-Intelligence (AI), High-Bandwidth Memory (HBM) integration is a key and strongly required. As we know, the 2.5D silicon interposer packaging is an expanded solution for HBM interconnections. However, we developed 2.1D high density organic package called i-THOP® (integrated-Thin film High density Organic Package) to take advantages of an organic solution. Furthermore, we are now focusing on 2.3D i-THOP® to have more benefits in the manufacturing. The 2.3D structure consists of two substrates. One is a thin i-THOP® interposer, the other one is a conventional build-up (BU) substrate. These two substrates are combined as the interposer placed onto the build-up substrate. In this paper, the electrical properties of 2.3D i-THOP® are studied to confirm the possibility of the 2.3D structure organic packages from the perspective of signal and power integrity. Firstly, the signal integrity between two devices is simulated, comparing the differences between i-THOP® and the 2.5D silicon interposer. Secondly, the signal integrity in die-to-substrate vertical interconnection is simulated, comparing between 2.1D, 2.3D i-THOP® and the 2.5D silicon interposer. Finally, as for the power delivery point of view, power distribution network (PDN) impedance is compared between 2.1D and 2.3D i-THOP®.


2012 ◽  
Vol 220-223 ◽  
pp. 2297-2300 ◽  
Author(s):  
Ling Feng Shi ◽  
Cheng Shan Cai ◽  
Yuan Ming Xiao ◽  
Li Ye Cheng ◽  
Chen Meng ◽  
...  

With the electronic toward miniaturization and multifunctional development, such as System-in-Package (SIP), Package-on-Package (POP), these packages have been widely used. Signal speeds increase and then require that signal has a good transmission quality. Therefore the design of signal integrity should take into account these issues from the beginning design. In this paper, a model about the wire bonding transmission problem between the upper and lower levels of chip is proposed. The simulation results are shown at the different height and radius of the equivalent model. Meanwhile, researching in different cases, noise interference source makes the influence on signal quality. Finally, by adding the signal return path, signal integrity is achieved well by the eye diagram analysis.


2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

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