Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

2011 ◽  
Author(s):  
Ridvan A. Sahan ◽  
Rahima K. Mohammed ◽  
Amy Xia ◽  
Ying-Feng Pang
Keyword(s):  
High Performance ◽  
Technology Development ◽  
Galvanic Corrosion ◽  
Flow Distribution ◽  
Base Plate ◽  
Thermal Design ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Cooling Technology ◽  
Water Cooler

Increasing thermal design power (TDP) trends with shrinking form factor requirements creates the need for advanced cooling technology development. This investigation proposes multiple innovative water cooler technologies to achieve higher thermal performance liquid-cooling (LC) solutions addressing the limitations of air-cooling (AC). High performance water cooler design options will also meet the miniaturization trends of computing market by providing scalable solution to address smaller board real-estate. This investigation serves multi-fold advantages: 1) introduces four water cooler technologies employing different fin base plate designs, diamond fins, micro-fins, skived micro-fins, and twisted diamond fins, along with an optimized flow distribution path design accompanying each cooler, 2) provides scalable thermal solutions, 3) addresses particle clogging via fin base plate as well as flow distribution path optimization, 4) addresses galvanic corrosion by eliminating the use of two dissimilar metals and introducing acrylic housing, 5) introduces acrylic housing for weight management. Results show that twisted diamond fin, micro-fin and skived micro-fin coolers provide up to 5°C performance improvement resulting in lower pressure drop across water cooler compared to diamond fin cooler and about 37°C improvement compared to air-cooled active heatsink solution.

Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions

2017 ◽  
Author(s):  
Devdatta Kulkarni ◽  
Sandeep Ahuja ◽  
Sanjoy Saha
Keyword(s):  
Form Factor ◽  
Boundary Conditions ◽  
High Performance ◽  
Thermal Design ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Increasing Demand ◽  
Performance Computing ◽  
Design Power

Continuously increasing demand for higher compute performance is pushing for improved advanced thermal solutions. In high performance computing (HPC) area, most of the end users deploy some sort of direct or indirect liquid cooling thermal solutions. But for the users who have air cooled data centers and air cooled thermal solutions are challenged to cool next generation higher Thermal Design Power (TDP) processors in the same platform form factor without changing environmental boundary conditions. This paper presents several different advanced air cooled technologies developed to cool high TDP processors in the same form factor and within the same boundary conditions of current generation processor. Comparison of thermal performance using different cooling technologies such as Liquid Assist Air Cooling (LAAC) and Loop Heat Pipe (LHP) are presented in this paper. A case study of Intel’s Knights Landing (KNL) processor is presented to show case the increase in compute performance due to different advanced air cooling technologies.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Closed Loop Liquid Cooling for High Performance Computer Systems

2007 ◽  
Author(s):  
Sukhvinder Kang ◽  
David Miller ◽  
John Cennamo
Keyword(s):  
Computer System ◽  
High Performance ◽  
Closed Loop ◽  
Cooling System ◽  
High Heat ◽  
Low Noise ◽  
Heat Fluxes ◽  
Air Cooling ◽  
Heat Sources ◽  
Liquid Cooling

The power dissipation levels in high performance personal computers continue to increase rapidly while the silicon die temperature requirements remain unchanged or have been lowered. Advanced air cooling solutions for the major heat sources such as CPU and GPU modules use heat pipes and high flow rate fans to manage the heat load at the expense of significant increases in the sound power emitted by the computer system. Closed loop liquid cooling systems offer an excellent means to efficiently meet the combined challenges of high heat loads, low thermal resistance, and low noise while easily managing die level heat fluxes in excess of 500 W/cm2. This paper describes the design and attributes of an advanced liquid cooling system that can cool single or multiple heat sources within the computer system. The cooling system described use copper cold plates with meso scale channels to pick up heat from CPU and GPU type heat sources and highly efficient liquid-to-air heat exchangers with flat copper tubes and plain fins to transfer the heat to air by forced convection. A water based coolant is used for high thermal performance and additives are used to provide burst protection to the cooling system at temperatures down to −40 °C and corrosion protection to critical components. A highly reliable compact pump is used to circulate the fluid in a closed loop. The overall system is integrated using assembly methods and materials that enable very low fluid permeation for long life.

Numerical Investigation of Mass Flow Distribution in Wavy Microchannel Heat Sink

2015 ◽  
Vol 787 ◽  
pp. 52-56
Author(s):  
M. Satheeshkumar ◽  
M.R. Thansekhar ◽  
C. Anbu Meenakshi
Keyword(s):  
Automotive Industry ◽  
Flow Distribution ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Cooling Devices ◽  
Bottle Neck ◽  
Different Shapes ◽  
Cooling Technology ◽  
Flow Maldistribution ◽  
Further Development

In order to cope with ever increasing demands from the electronic, automotive and aerospace industries, cooling devices have to be small in size, light-weight and of high performance.The search for a more efficient cooling technology becomes one of the bottle neck problems of the further development of the electronic and automotive industry. Microchannel liquid cooling is one of the candidates for this purpose. The most important parameter in the microchannel is the distribution of the coolant inside the channel. A uniform flow in the microchannel leads to uniform heat transfer.A numerical simulation is carried out to minimize the flow maldistribution inside the microchannel. The microchannel was made as wavy shaped channel. There are six channels with hydraulic diameter of 1mm each. Header is the major part in the microchannel which supplies fluid into different channels. In this work, five different shapes of the header were considered namely circular, frustum conical, rectangular, triangular and trapezoidal. From the simulation results it was found that the mal-distribution is significantly affected by flow rate and shape of the header.

Challenges in Electronic Cooling: Opportunities for Enhanced Thermal Management Techniques — Microprocessor Liquid Cooled Minichannel Heat Sink

2003 ◽  
Author(s):  
Roger Schmidt
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Performance ◽  
Memory Performance ◽  
Electronic Cooling ◽  
Air Cooling ◽  
Package Design ◽  
Computer Equipment ◽  
Cooling Technology ◽  
Market Pressures

The volumetric heat dissipated by computer equipment at each level of the package from the chip to the chassis is having a tremendous impact on the thermal management of computer equipment. Because of the consumer’s insatiable desire for increased performance the competitive pressures are driving the computer manufacturer to pack as much processor/memory performance within the smallest volume possible. The consumer views high performance in a compact package as a benefit. These market pressures seem to be in direct conflict with the desire to continue to provide air cooling solutions for the foreseeable future. Because of these trends in power and package design other cooling technologies beside air are now becoming viable techniques but each must be weighed with many other factors that influence the cooling technology selected. These factors will discussed along with two specific IBM server packages and their associated cooling technology employed. Finally a microprocessor liquid cooled minichannel heat sink will be described and its performance presented as applied to a current microprocessor (IBM Power4) chip.

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

2015 ◽  
Author(s):  
Suchismita Sarangi ◽  
Will A. Kuhn ◽  
Scott Rider ◽  
Claude Wright ◽  
Shankar Krishnan
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Total Power ◽  
Air Cooling ◽  
Xeon Phi ◽  
Liquid Cooling ◽  
Immersion Cooling ◽  
Performance Per Watt ◽  
Cpu Temperature ◽  
Performance Computing

Efficient and compact cooling technologies play a pivotal role in determining the performance of high performance computing devices when used with highly parallel workloads in supercomputers. The present work deals with evaluation of different cooling technologies and elucidating their impact on the power, performance, and thermal management of Intel® Xeon Phi™ coprocessors. The scope of the study is to demonstrate enhanced cooling capabilities beyond today’s fan-driven air-cooling for use in high performance computing (HPC) technology, thereby improving the overall Performance per Watt in datacenters. The various cooling technologies evaluated for the present study include air-cooling, liquid-cooling and two-phase immersion-cooling. Air-cooling is evaluated by providing controlled airflow to a cluster of eight 300 W Xeon Phi coprocessors (7120P). For liquid-cooling, two different cold plate technologies are evaluated, viz, Formed tube cold pates and Microchannel based cold plates. Liquidcooling with water as working fluid, is evaluated on single Xeon Phi coprocessors, using inlet conditions in accordance with ASHRAE W2 and W3 class liquid cooled datacenter baselines. For immersion-cooling, a cluster of multiple Xeon Phi coprocessors is evaluated, with three different types of Integrated Heat Spreaders (IHS), viz., bare IHS, IHS with a Boiling Enhancement Coating (BEC) and IHS with BEC coated pin-fins. The entire cluster is immersed in a pool of Novec 649 (3M fluid, boiling point 49 °C at 1 atm), with polycarbonate spacers used to reduce the volume of fluid required, to achieve target fluid/power density of ∼ 3 L/kW. Flow visualization is performed to provide further insight into the boiling behavior during the immersion-cooling process. Performance per Watt of the Xeon Phi coprocessors is characterized as a function of the cooling technologies using several HPC workloads benchmark run at constant frequency, such as the Intel proprietary Power Thermal Utility (PTU), and industry standard HPC benchmarks LINPACK, DGEMM, SGEMM and STREAM. The major parameters measured by sensors on the coprocessor include total power to the coprocessor, CPU temperature, and memory temperature, while the calculated outputs of interest also include the performance per watt and equivalent thermal resistance. As expected, it is observed that both liquid and immersion cooling show improved performance per Watt and lower CPU temperature compared to air-cooling. In addition to elucidating the performance/watt improvement, this work reports on the relationship of cooling technologies on total power consumed by the Xeon-Phi card as a function of coolant inlet temperatures. Further, the paper discusses form-factor advantages to liquid and immersion cooling and compares technologies on a common platform. Finally, the paper concludes by discussing datacenter optimization for cooling in the context of leakage power control for Xeon-Phi coprocessors.

New Thermal Management Systems for Data Centers

2011 ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
High Performance ◽  
Data Centers ◽  
Technology Development ◽  
Management Systems ◽  
Air Conditioner ◽  
Liquid Cooling ◽  
Two Phase ◽  
Development Organization

The almost half amount of power consumption in data centers which has been increasing drastically in late years is due to air conditioner for cooling down the data centers. The present authors proposed new thermal management systems for data centers aiming for the data centers without air conditioning, and R&D subjects have been conducted under the so called Green IT Project sponsored by NEDO (New Energy and Industrial Technology Development Organization). In this system, three liquid cooling methods for CPUs have been developed simultaneously, which are two types of direct liquid cooling with single-phase or two-phase heat exchanger and an indirect liquid cooling with high performance thin heat pipes. To establish this system, five R&D subjects have been conducted. In this paper, current progress of these subjects such as development of heat transfer components, verification test using real server racks, and nanofluids technology for heat transfer enhancement is reported.

Advanced Heat Transfer Devices for Aerospace Applications

2017 ◽  
Author(s):  
Kawthar Kasim ◽  
Arun Muley ◽  
Michael Stoia ◽  
Foluso Ladeinde
Keyword(s):  
Heat Transfer ◽  
Additive Manufacturing ◽  
Thermal Management ◽  
High Performance ◽  
Conductive Polymer ◽  
Energy Conversion Efficiency ◽  
Thermal Design ◽  
Air Cooling ◽  
Minimal Impact ◽  
Aircraft Systems

Aerospace system efficiency improvement and capacity growth has fueled demand for innovative, affordable and scalable thermal management technologies. Recent advancements in additive manufacturing (AM) and materials has extended the thermal design space for heat exchangers, cold plates, heat sinks, and heat pipes. Novel heat transfer enhancement techniques, along with design and system interface innovations, offer attractive cooling solutions for use in numerous aircraft systems. These advances are becoming increasingly relevant in aircraft systems as customers are demanding the use of air-cooling instead of liquid-cooling with minimal impact on overall energy conversion efficiency, installed volume and weight. This paper provides an overview of Boeing-led advances in analysis, design, fabrication and testing of next generation heat transfer devices. A case study is presented to provide insight into a methodology for selection of heat transfer surfaces and design optimization for an air-to-air heat exchanger. Design considerations are presented for additive manufacturing of the thermal management devices using a range of high performance materials including aluminum, titanium, stainless steel, and conductive polymer composites.

Sub-20nm Device Voltage-Sensitive SRAM Characterization and Failure Analysis

2018 ◽  
Author(s):  
Seng Nguon Ting ◽  
Hsien-Ching Lo ◽  
Donald Nedeau ◽  
Aaron Sinnott ◽  
Felix Beaudoin
Keyword(s):  
Failure Analysis ◽  
High Performance ◽  
Yield Loss ◽  
Technology Development ◽  
High Density ◽  
High K ◽  
Yield Learning ◽  
Oxide Deposition ◽  
Edge Profile ◽  
High K Dielectric

Abstract With rapid scaling of semiconductor devices, new and more complicated challenges emerge as technology development progresses. In SRAM yield learning vehicles, it is becoming increasingly difficult to differentiate the voltage-sensitive SRAM yield loss from the expected hard bit-cells failures. It can only be accomplished by extensively leveraging yield, layout analysis and fault localization in sub-micron devices. In this paper, we describe the successful debugging of the yield gap observed between the High Density and the High Performance bit-cells. The SRAM yield loss is observed to be strongly modulated by different active sizing between two pull up (PU) bit-cells. Failure analysis focused at the weak point vicinity successfully identified abnormal poly edge profile with systematic High k Dielectric shorts. Tight active space on High Density cells led to limitation of complete trench gap-fill creating void filled with gate material. Thanks to this knowledge, the process was optimized with “Skip Active Atomic Level Oxide Deposition” step improving trench gap-fill margin.

scholarly journals Reducing the Cooling Energy Consumption of Telecom Sites by Liquid Cooling

Proceedings ◽  
2020 ◽  
Vol 58 (1) ◽  
pp. 19
Author(s):  
Jari Huttunen ◽  
Olli Salmela ◽  
Topi Volkov ◽  
Eva Pongrácz
Keyword(s):  
Energy Savings ◽  
Reduction Potential ◽  
Dissipated Energy ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Mobile Data ◽  
Commercial Use ◽  
The Future ◽  
Base Transceiver Station ◽  
Ventilation Duct

The use of mobile data has increased and will continue to increase in the future, because more data is moving to wireless networks such as 5G. Cooling energy need is also expected to increase in indoor telecom rooms, and can be as high as the equipment’s own power consumption. The world’s first liquid Base Transceiver Station (BTS) was adopted into commercial use in 2018, in Helsinki, Finland. Conventional air-cooled BTS hardware was converted into liquid-cooled BTS equipment. Heat from the BTS was pumped out of the site room, and thus ventilation or air conditioning was not needed for the heat load from the BTS. Heat stored in the liquid was released into the ventilation duct of the building, still providing annual cooling energy savings of 70%, when compared to air cooling. In the future, 80% of the total dissipated energy, 13450 kWh/a in total, can potentially be used for heating purposes. In terms of CO2 emissions, adapting liquid cooling showed an 80% reduction potential when compared to air cooling.

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