Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

2015 ◽  
Author(s):  
Suchismita Sarangi ◽  
Will A. Kuhn ◽  
Scott Rider ◽  
Claude Wright ◽  
Shankar Krishnan
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Total Power ◽  
Air Cooling ◽  
Xeon Phi ◽  
Liquid Cooling ◽  
Immersion Cooling ◽  
Performance Per Watt ◽  
Cpu Temperature ◽  
Performance Computing

Efficient and compact cooling technologies play a pivotal role in determining the performance of high performance computing devices when used with highly parallel workloads in supercomputers. The present work deals with evaluation of different cooling technologies and elucidating their impact on the power, performance, and thermal management of Intel® Xeon Phi™ coprocessors. The scope of the study is to demonstrate enhanced cooling capabilities beyond today’s fan-driven air-cooling for use in high performance computing (HPC) technology, thereby improving the overall Performance per Watt in datacenters. The various cooling technologies evaluated for the present study include air-cooling, liquid-cooling and two-phase immersion-cooling. Air-cooling is evaluated by providing controlled airflow to a cluster of eight 300 W Xeon Phi coprocessors (7120P). For liquid-cooling, two different cold plate technologies are evaluated, viz, Formed tube cold pates and Microchannel based cold plates. Liquidcooling with water as working fluid, is evaluated on single Xeon Phi coprocessors, using inlet conditions in accordance with ASHRAE W2 and W3 class liquid cooled datacenter baselines. For immersion-cooling, a cluster of multiple Xeon Phi coprocessors is evaluated, with three different types of Integrated Heat Spreaders (IHS), viz., bare IHS, IHS with a Boiling Enhancement Coating (BEC) and IHS with BEC coated pin-fins. The entire cluster is immersed in a pool of Novec 649 (3M fluid, boiling point 49 °C at 1 atm), with polycarbonate spacers used to reduce the volume of fluid required, to achieve target fluid/power density of ∼ 3 L/kW. Flow visualization is performed to provide further insight into the boiling behavior during the immersion-cooling process. Performance per Watt of the Xeon Phi coprocessors is characterized as a function of the cooling technologies using several HPC workloads benchmark run at constant frequency, such as the Intel proprietary Power Thermal Utility (PTU), and industry standard HPC benchmarks LINPACK, DGEMM, SGEMM and STREAM. The major parameters measured by sensors on the coprocessor include total power to the coprocessor, CPU temperature, and memory temperature, while the calculated outputs of interest also include the performance per watt and equivalent thermal resistance. As expected, it is observed that both liquid and immersion cooling show improved performance per Watt and lower CPU temperature compared to air-cooling. In addition to elucidating the performance/watt improvement, this work reports on the relationship of cooling technologies on total power consumed by the Xeon-Phi card as a function of coolant inlet temperatures. Further, the paper discusses form-factor advantages to liquid and immersion cooling and compares technologies on a common platform. Finally, the paper concludes by discussing datacenter optimization for cooling in the context of leakage power control for Xeon-Phi coprocessors.

Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions

2017 ◽  
Author(s):  
Devdatta Kulkarni ◽  
Sandeep Ahuja ◽  
Sanjoy Saha
Keyword(s):  
Form Factor ◽  
Boundary Conditions ◽  
High Performance ◽  
Thermal Design ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Increasing Demand ◽  
Performance Computing ◽  
Design Power

Continuously increasing demand for higher compute performance is pushing for improved advanced thermal solutions. In high performance computing (HPC) area, most of the end users deploy some sort of direct or indirect liquid cooling thermal solutions. But for the users who have air cooled data centers and air cooled thermal solutions are challenged to cool next generation higher Thermal Design Power (TDP) processors in the same platform form factor without changing environmental boundary conditions. This paper presents several different advanced air cooled technologies developed to cool high TDP processors in the same form factor and within the same boundary conditions of current generation processor. Comparison of thermal performance using different cooling technologies such as Liquid Assist Air Cooling (LAAC) and Loop Heat Pipe (LHP) are presented in this paper. A case study of Intel’s Knights Landing (KNL) processor is presented to show case the increase in compute performance due to different advanced air cooling technologies.

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

2015 ◽  
Author(s):  
Lynn Parnell ◽  
Garrison Vaughan ◽  
John Thompson ◽  
Daniel Duffy ◽  
Louis Capps ◽  
...  
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Cooling Water ◽  
Air Cooling ◽  
Single Server ◽  
Worst Case ◽  
Flow Rates ◽  
Benchmark Tests ◽  
Consumption Change ◽  
Performance Computing

High performance computing server racks are being engineered to contain significantly more processing capability within the same computer room footprint year after year. The processor density within a single rack is becoming high enough that traditional, inefficient air-cooling of servers is inadequate to sustain HPC workloads. Experiments that characterize the performance of a direct water-cooled server rack in an operating HPC facility are described in this paper. Performance of the rack is reported for a range of cooling water inlet temperatures, flow rates and workloads that include actual and worst-case synthetic benchmarks. Power and temperature measurements of all processors and memory components in the rack were made while extended benchmark tests were conducted throughout the range of cooling variables allowed within an operational HPC facility. Synthetic benchmark results were compared with those obtained on a single server of the same design that had been characterized thermodynamically. Neither actual nor synthetic benchmark performances were affected during the course of the experiments, varying less than 0.13 percent. Power consumption change in the rack was minimal for the entire excursion of coolant temperatures and flow rates. Establishing the characteristics of such a highly energy efficient server rack in situ is critical to determine how the technology might be integrated into an existing heterogeneous, hybrid cooled computing facility — i.e., a facility that includes some servers that are air cooled as well as some that are direct water cooled.

scholarly journals Action: A New Metric for Evaluating the Energy Efficiency on High Performance Computing Platforms (ranked on Green500 List)

2022 ◽  
Vol 21 ◽  
pp. 23-30
Author(s):  
E. M. Karanikolaou ◽  
M. P. Bekakos
Keyword(s):  
Energy Efficiency ◽  
Energy Consumption ◽  
Comparative Study ◽  
High Performance Computing ◽  
High Performance ◽  
Ranking Systems ◽  
Performance Per Watt ◽  
Computing Platforms ◽  
Performance Computing

The need for new and more reliable metrics is always in demand. In this paper, a new metric is proposed for the evaluation of high performance computing platforms in conjunction with their energy consumption. The aim of the new metric is to reliably compare different HPC systems concerning their energy efficiency. The metric provides a mean to rank supercomputers of similar capabilities, avoiding the misleading results of metrics like performance-per-watt, currently used for ranking systems, as in the Green500 list, where systems with totally different sizes and capabilities are ranked consecutively. An example of this misuse for two adjacent systems in the Green500 list, is discussed. A comparative study for the energy efficiency of three high performance computing platforms, with different architectures, using the proposed metric is presented.

scholarly journals JURECA: Modular supercomputer at Jülich Supercomputing Centre

2018 ◽  
Vol 4 ◽  
Author(s):  
Dorian Krause ◽  
Philipp Thörnig
Keyword(s):  
High Performance Computing ◽  
Data Analytics ◽  
High Performance ◽  
Xeon Phi ◽  
Many Core ◽  
Performance Computing ◽  
Selection Of

JURECA is a petaflop-scale modular supercomputer operated by Jülich Supercomputing Centre at Forschungszentrum Jülich. The system combines a flexible Cluster module, based on T-Platforms V-Class blades with a balanced selection of best of its kind components, with a scalability focused Booster module, delivered by Intel and Dell EMC based on the Xeon Phi many-core processor. With its novel architecture, it supports a wide variety of high-performance computing and data analytics workloads.

scholarly journals Optimizing performance-per-watt on GPUs in high performance computing

2015 ◽  
Vol 31 (4) ◽  
pp. 185-193 ◽  
Author(s):  
D. C. Price ◽  
M. A. Clark ◽  
B. R. Barsdell ◽  
R. Babich ◽  
L. J. Greenhill
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Performance Per Watt ◽  
Performance Computing

scholarly journals On the Use of Large Intel Xeon Phi Clusters for GEANT4-Based Simulations

2017 ◽  
Vol 17 (5) ◽  
pp. 101-109
Author(s):  
Nevena Ilieva ◽  
Elena Lilkova ◽  
Leandar Litov ◽  
Borislav Pavlov ◽  
Peicho Petkov
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Particle Interactions ◽  
Xeon Phi ◽  
Intel Xeon Phi ◽  
Supplementary Material ◽  
Large Clusters ◽  
Precise Simulation ◽  
Performance Computing ◽  
Intel Xeon

Abstract GEANT4 is the basic software for fast and precise simulation of particle interactions with matter. Along the way towards enabling the execution of GEANT4 based simulations on hybrid High Performance Computing (HPC) architectures with large clusters of Intel Xeon Phi co-processors, we study the performance of this software suit on the supercomputer system Avitohol@BAS, Some practical scripts are collected in the supplementary material shown in the appendix.

High-Performance Computing on the Intel® Xeon Phi™

2014 ◽  
Author(s):  
Endong Wang ◽  
Qing Zhang ◽  
Bo Shen ◽  
Guangyong Zhang ◽  
Xiaowei Lu ◽  
...  
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
Xeon Phi ◽  
Performance Computing

scholarly journals JURECA: Data Centric and Booster Modules implementing the Modular Supercomputing Architecture at Jülich Supercomputing Centre

2021 ◽  
Vol 7 ◽  
Author(s):  
Philipp Thörnig
Keyword(s):  
High Performance Computing ◽  
Data Analytics ◽  
High Performance ◽  
Xeon Phi ◽  
Many Core ◽  
Performance Computing ◽  
Selection Of

JURECA is a Pre-Exascale Modular Supercomputer operated by Jülich Supercomputing Centre at Forschungszentrum Jülich. The system combines a flexible Data Centric (DC) module, based on the Atos BullSequana XH2000 with a selection of best-of-its-kind components, and a scalability-focused Booster module, delivered by Intel and Dell Technologies based on the Xeon Phi many-core processor. With its novel architecture, it supports a wide variety of high-performance computing and data analytics workloads.

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