Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

2011 ◽  
Author(s):  
Nusrat J. Chhanda ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Flip Chip ◽  
Mechanical Response ◽  
Testing Machine ◽  
Production Equipment ◽  
Material Behavior ◽  
Specimen Preparation ◽  
Viscoplastic Material ◽  
Stress Strain ◽  
Release Agent ◽  
Stress Levels

In this work, the viscoplastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent stress-strain testing over a wide temperature range, and creep testing for a large range of applied stress levels and temperatures. A specimen preparation procedure has been developed to manufacture 80 × 5 mm uniaxial tension test samples with a specified thickness of .5 mm. The test specimens are dispensed and cured with production equipment using the same conditions as those used in actual flip chip assembly, and no release agent is required to extract them from the mold. Using the manufactured test specimens, a microscale tension-torsion testing machine has been used to evaluate stress-strain and creep behavior of the underfill material as a function of temperature. Stress-strain curves have been measured at 5 temperatures (25, 50, 75, 100 and 125 C), and strain rates spanning over 5 orders of magnitude. In addition, creep curves have been evaluated for the same 5 temperatures and several stress levels. With the obtained mechanical property data, several viscoelastic and viscoplastic material models have been fit to the data, and optimum constitutive models for subsequent use in finite element simulations have been determined.

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

2015 ◽  
Author(s):  
Promod R. Chowdhury ◽  
Nusrat J. Chhanda ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Room Temperature ◽  
Flip Chip ◽  
Mechanical Response ◽  
Testing Machine ◽  
Ultimate Tensile Stress ◽  
Production Equipment ◽  
Material Behavior ◽  
Tensile Creep ◽  
Uniaxial Test ◽  
Humidity Chamber

Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and high humidity conditions. In this work, the material behavior changes occurring in underfill materials subjected to moisture exposures in an humidity chamber have been characterized using 60 × 3 × 0.5 mm uniaxial test specimens which were cured with production equipment using the same conditions as those used in actual flip chip assembly. After curing, the samples were divided into two groups and subjected to different preconditioning: (1) no preconditioning, (2) prebaking at 85 C for 24 hours. The fabricated and preconditioned uniaxial test specimens were then exposed in an adjustable thermal and humidity chamber to combined hygrothermal exposures at 85 C and 85% RH for various durations (0, 1, 3, 10, 30, 60 days). After the moisture exposures, a microscale tension-torsion testing machine was used to evaluate the complete stress-strain behavior of the material at room temperature (25 C). In addition, the viscoelastic mechanical response of the underfill encapsulant has also been characterized via creep testing at room temperature for several applied stress levels after the moisture exposures. From the recorded results, it was found that the moisture exposures strongly degrade the mechanical properties of the tested underfill including the initial elastic modulus, ultimate tensile stress, and tensile creep rate. Prebaking was found to increase the initial material properties, but the degradations due to subsequent moisture exposures occurred in a similar manner.

Measurement of the Constitutive Behavior of Underfill Encapsulants

2003 ◽  
Author(s):  
M. Saiful Islam ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Flip Chip ◽  
Mechanical Response ◽  
Capillary Flow ◽  
Mechanical Test ◽  
Testing Machine ◽  
Production Equipment ◽  
Uniaxial Tensile ◽  
Stress Strain ◽  
Strain Behavior ◽  
Nonlinear Stress

Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. In our research efforts, the mechanical responses of several different capillary flow snap cure underfill encapsulants are being characterized. A microscale tension-torsion testing machine has been used to evaluate the uniaxial tensile stress-strain behavior of underfill materials as a function of temperature, strain rate, specimen dimensions, humidity, thermal cycling exposure, etc. A critical step to achieving accurate experimental results has been the development of a sample preparation procedure that produces mechanical test specimens that reflect the properties of true underfill encapsulant layers. In the developed method, 75–125 μm (3–5 mil) thick underfill uniaxial tension specimens are dispensed and cured using production equipment and the same processing conditions as those used with actual flip chip assemblies. Although several underfills have been examined, this work features results for the mechanical response of a single typical capillary flow snap cure underfill. A three parameter hyperbolic tangent empirical model has been shown to provide accurate fits to the observed underfill nonlinear stress-strain behavior over a range of temperatures and strain rates. In addition, typical creep data are presented.

Evolution of the Stress-Strain and Creep Behavior of Underfill Encapsulants With Aging

2009 ◽  
Author(s):  
Chang Lin ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
Creep Rate ◽  
Thermal Cycling ◽  
Aging Time ◽  
Aging Temperature ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Material Behavior ◽  
Initial Slope ◽  
Aging Effects ◽  
Stress Strain

Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, measurements of material behavior changes occurring in flip chip underfill encapsulants exposed to isothermal aging have been performed. A novel method has been developed to fabricate freestanding underfill uniaxial test specimens so that they accurately reflect the encapsulant layer present in flip chip assemblies. Using the developed specimen preparation procedure, isothermal aging effects have been characterized at several elevated temperatures (+ 80, +100, + 125, and +150 °C). Samples have been aged at the four temperatures for periods up to 6 months. Stress-strain and creep tests have been performed on non-aged and aged samples, and the changes in mechanical behavior have been recorded for the various aging temperatures and durations of isothermal exposure. Empirical models have been developed to predict the evolution of the material properties (modulus, strength) and the creep strain rate as a function of temperature, aging time, and aging temperature. The evaluated underfill illustrated softening behavior at temperatures exceeding 100 °C, although the documented Tg ranged from 130–150 °C. The obtained results showed an obvious enhancement of the underfill mechanical properties as a function of the aging temperature and aging time. Both the effective elastic modulus (initial slope) and ultimate tensile strength (highest stress before failure) increase monotonically with the amount of isothermal aging or aging temperature, regardless of whether the aging temperature is below, at, or above the Tg of the material. From the creep results, it was seen that at a given time, the creep strains were much lower for the aged samples relative to the non-aged samples. Thermal aging has a significant effect on the secondary creep rate, which decreases with both the aging temperature and the aging time. Up to a 100X reduction in the creep rate was observed, and the major changes occurred during the first 50 days of the isothermal aging.

scholarly journals Ability of Constitutive Models to Characterize the Temperature Dependence of Rubber Hyperelasticity and to Predict the Stress-Strain Behavior of Filled Rubber under Different Defor Mation States

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 369
Author(s):  
Xintao Fu ◽  
Zepeng Wang ◽  
Lianxiang Ma
Keyword(s):  
Experimental Data ◽  
Temperature Dependence ◽  
Mechanical Response ◽  
Constitutive Models ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Chain Model ◽  
Stress Strain ◽  
Filled Rubber ◽  
Yeoh Model

In this paper, some representative hyperelastic constitutive models of rubber materials were reviewed from the perspectives of molecular chain network statistical mechanics and continuum mechanics. Based on the advantages of existing models, an improved constitutive model was developed, and the stress–strain relationship was derived. Uniaxial tensile tests were performed on two types of filled tire compounds at different temperatures. The physical phenomena related to rubber deformation were analyzed, and the temperature dependence of the mechanical behavior of filled rubber in a larger deformation range (150% strain) was revealed from multiple angles. Based on the experimental data, the ability of several models to describe the stress–strain mechanical response of carbon black filled compound was studied, and the application limitations of some constitutive models were revealed. Combined with the experimental data, the ability of Yeoh model, Ogden model (n = 3), and improved eight-chain model to characterize the temperature dependence was studied, and the laws of temperature dependence of their parameters were revealed. By fitting the uniaxial tensile test data and comparing it with the Yeoh model, the improved eight-chain model was proved to have a better ability to predict the hyperelastic behavior of rubber materials under different deformation states. Finally, the improved eight-chain model was successfully applied to finite element analysis (FEA) and compared with the experimental data. It was found that the improved eight-chain model can accurately describe the stress–strain characteristics of filled rubber.

Semi-inverse method for predicting stress–strain relationship from cone indentations

2003 ◽  
Vol 18 (9) ◽  
pp. 2068-2078 ◽  
Author(s):  
A. DiCarlo ◽  
H. T. Y. Yang ◽  
S. Chandrasekar
Keyword(s):  
A Priori ◽  
Model Material ◽  
Material Behavior ◽  
The Finite Element Method ◽  
Stress Strain ◽  
Indentation Tests ◽  
Strain Relationship ◽  
Initial Force ◽  
Relationship Of ◽  
Force Displacement

A method for determining the stress–strain relationship of a material from hardness values H obtained from cone indentation tests with various apical angles is presented. The materials studied were assumed to exhibit power-law hardening. As a result, the properties of importance are the Young's modulus E, yield strength Y, and the work-hardening exponent n. Previous work [W.C. Oliver and G.M. Pharr, J. Mater. Res. 7, 1564 (1992)] showed that E can be determined from initial force–displacement data collected while unloading the indenter from the material. Consequently, the properties that need to be determined are Y and n. Dimensional analysis was used to generalize H/E so that it was a function of Y/E and n [Y-T. Cheng and C-M. Cheng, J. Appl. Phys. 84, 1284 (1999); Philos. Mag. Lett. 77, 39 (1998)]. A parametric study of Y/E and n was conducted using the finite element method to model material behavior. Regression analysis was used to correlate the H/E findings from the simulations to Y/E and n. With the a priori knowledge of E, this correlation was used to estimate Y and n.

Calibration and Validation of an Elasto-Viscoplastic Material Model for a Hot Work Tool Steel Used in Pressure Casting Dies

2007 ◽  
Vol 345-346 ◽  
pp. 685-688 ◽  
Author(s):  
Werner Ecker ◽  
Thomas Antretter ◽  
R. Ebner
Keyword(s):  
Constitutive Model ◽  
Tool Steel ◽  
Mechanical Response ◽  
Mechanical Load ◽  
Kinematic Hardening ◽  
Ex Situ ◽  
Pressure Casting ◽  
Viscoplastic Material ◽  
Crack Network ◽  
Hot Work Tool Steel

Pressure casting dies are subjected to a large number of thermal as well as mechanical load cycles, which are leading to a characteristic thermally induced crack network on the die surface. As a typical representative for a die material the cyclic thermo-mechanical behavior of the hot work tool steel grade 1.2343 (X38CrMoV5-1) is investigated both experimentally as well as numerically. On the one hand the information from isothermal compression-tension tests is used in a subsequent analysis to calibrate a constitutive model that takes into account the characteristic combined isotropic-kinematic hardening/softening of the material. On the other hand the non-isothermal mechanical response of the material to thermal cycles is characterized by means of a periodic laser pulse applied to a small plate-like specimen which is cooled on the back. The residual stresses developing at the surface of the irradiated region of the specimen are determined ex-situ by means of X-ray diffraction. The obtained values agree well with the results of an accompanying finite-element study. This information is used to verify the calibrated constitutive model. The material law is finally used for the prediction of stresses and strains in a die.

Numerical Modeling of Macroscopic Behavior of Particulate Composite with Crosslinked Polymer Matrix

2011 ◽  
Vol 465 ◽  
pp. 129-132
Author(s):  
Luboš Náhlík ◽  
Bohuslav Máša ◽  
Pavel Hutař
Keyword(s):  
Young’S Modulus ◽  
Polymer Matrix ◽  
Young's Modulus ◽  
Numerical Models ◽  
Strain Curve ◽  
Particulate Composite ◽  
Material Behavior ◽  
Particulate Composites ◽  
Stress Strain ◽  
Crosslinked Polymer

Particulate composites with crosslinked polymer matrix and solid fillers are one of important classes of materials such as construction materials, high-performance engineering materials, sealants, protective organic coatings, dental materials, or solid explosives. The main focus of a present paper is an estimation of the macroscopic Young’s modulus and stress-strain behavior of a particulate composite with polymer matrix. The particulate composite with a crosslinked polymer matrix in a rubbery state filled by an alumina-based mineral filler is investigated by means of the finite element method. A hyperelastic material behavior of the matrix was modeled by the Mooney-Rivlin material model. Numerical models on the base of unit cell were developed. The numerical results obtained were compared with experimental stress-strain curve and value of initial Young’s modulus. The paper can contribute to a better understanding of the behavior and failure of particulate composites with a crosslinked polymer matrix.

Uncertainty Quantification in Predicting Behaviour of Rubber-Like Materials in Uni-Axial Loading

2020 ◽  
Author(s):  
Aref Ghaderi ◽  
Vahid Morovati ◽  
Pouyan Nasiri ◽  
Roozbeh Dargazany
Keyword(s):  
Uncertainty Quantification ◽  
Mechanical Response ◽  
Pure Shear ◽  
Constitutive Models ◽  
Material Behavior ◽  
Elastic Behavior ◽  
Deterministic Models ◽  
Data Set ◽  
Material Parameters ◽  
Axial Extension

Abstract Material parameters related to deterministic models can have different values due to variation of experiments outcome. From a mathematical point of view, probabilistic modeling can improve this problem. It means that material parameters of constitutive models can be characterized as random variables with a probability distribution. To this end, we propose a constitutive models of rubber-like materials based on uncertainty quantification (UQ) approach. UQ reduces uncertainties in both computational and real-world applications. Constitutive models in elastomers play a crucial role in both science and industry due to their unique hyper-elastic behavior under different loading conditions (uni-axial extension, biaxial, or pure shear). Here our goal is to model the uncertainty in constitutive models of elastomers, and accordingly, identify sensitive parameters that we highly contribute to model uncertainty and error. Modern UQ models can be implemented to use the physics of the problem compared to black-box machine learning approaches that uses data only. In this research, we propagate uncertainty through the model, characterize sensitivity of material behavior to show the importance of each parameter for uncertainty reduction. To this end, we utilized Bayesian rules to develop a model considering uncertainty in the mechanical response of elastomers. As an important assumption, we believe that our measurements are around the model prediction, but it is contaminated by Gaussian noise. We can make the noise by maximizing the posterior. The uni-axial extension experimental data set is used to calibrate the model and propagate uncertainty in this research.

Sign in / Sign up

Export Citation Format

Share Document