A Novel Precision Die Attach Technique for Opto-Electronics Packaging

2011 ◽  
Author(s):  
V. Bhagavatula ◽  
S. Chaparala ◽  
J. Himmelreich
Keyword(s):  
Laser Diode ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Research Work ◽  
High Volume ◽  
Ceramic Substrates ◽  
Die Attach ◽  
Semiconductor Laser Diodes ◽  
The Cost ◽  
Low Cost Manufacturing

Semiconductor Laser diodes that emit visible light have various interesting applications such as sensing, high density optical storage and projection displays. In any opto-electronic package, the laser diode chips are typically attached or soldered to metal or ceramic substrates that have good thermal conductivity and are well-matched in coefficient of thermal expansion using solder. Some applications require a critical alignment of the front facet of the laser diode to the front edge of the substrate onto which the laser diode chip is attached to. Depending on the application, the alignment precision could be varying from 20 μm to being as stringent as 0.5 to 1 μm. In many of these applications, the cost of packaging is also a very important factor. In such applications, it is essential to develop a laser diode chip bonding process that can meet such stringent die alignments along with a low cost manufacturing process. Therefore, the objective of this research work is to provide a low cost alternative solution for die attach process that can guarantee alignment precision of 0.5 to 1 microns and can be easily adapted to high volume manufacturing. The novel technique proposed in this work uses primarily gravity force for the facet alignments between the two components. In this passive-gravity assisted precision (P-GAP) assembly process, the laser diode (LD) chip is placed on the substrate using a traditional pick and place machine and later the substrate and the chip are tilted such that the chip slides on the substrate due to the gravity and touches a mechanical stop in-front of them. This does not involve any active alignment. In addition, we have provided few ideas to improve the sliding when gravity is used. This technique has been implemented on several samples and the feasibility of achieving the alignment precision to within a micron was demonstrated.

Low-cost manufacturing process for nanostructured metals and alloys

2002 ◽  
Vol 17 (10) ◽  
pp. 2484-2488 ◽  
Author(s):  
Travis L. Brown ◽  
Srinivasan Swaminathan ◽  
Srinivasan Chandrasekar ◽  
W. Dale Compton ◽  
Alexander H. King ◽  
...  
Keyword(s):  
Nanostructured Materials ◽  
Manufacturing Process ◽  
Large Scale ◽  
Bulk Material ◽  
Low Cost ◽  
Limited Range ◽  
Pure Metals ◽  
The Cost ◽  
Machining Operations ◽  
Low Cost Manufacturing

In spite of their interesting properties, nanostructured materials have found limited uses because of the cost of preparation and the limited range of materials that can be synthesized. It has been shown that most of these limitations can be overcome by subjecting a material to large-scale deformation, as occurs during common machining operations. The chips produced during lathe machining of a variety of pure metals, steels, and other alloys are shown to be nanostructured with grain (crystal) sizes between 100 and 800 nm. The hardness of the chips is found to be significantly greater than that of the bulk material.

Fabrication Technologies for Advanced Heat Transfer Applications

2003 ◽  
Author(s):  
William J. Grande
Keyword(s):  
Heat Transfer ◽  
Emerging Technologies ◽  
Low Cost ◽  
High Volume ◽  
The Subject ◽  
Active Research ◽  
High Level ◽  
Low Cost Manufacturing ◽  
Conventional Machining ◽  
Microchannel Devices

Microchannel devices with channel widths in the range from one micron to several hundred microns have become increasingly important structures for heat transfer applications. This paper will examine several classes of fabrication technologies that are employed in the field. Established technologies, such as bulk and surface micromachining, high aspect ratio machining, and conventional machining have been perfected over the last several decades and are the principal methods of creating microchannel structures. Synthesizing technologies, such as wafer bonding and micromolding techniques, allow these primary structures to be assembled together into working devices or enable high volume, low cost manufacturing using microstructured masters. Established and synthesizing technologies have reached a high level of performance and are generally the subject of refinement efforts rather than innovative investigations. Active research into new materials, processes, and fabrication strategies are found in the class of emerging technologies. This paper will briefly review the dimensional spectrum of microchannels and survey the established and synthesizing technologies. Then an exploration of emerging technologies will be made. The topic of rapid prototyping will be given particular emphasis.

Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001893-001917 ◽  
Author(s):  
Yu-Hua Chen ◽  
Yu-Chung Hsieh ◽  
Wei-Di Lin ◽  
Chun-Hsien Chien ◽  
Dyi-Chung Hu
Keyword(s):  
Line Width ◽  
Glass Substrate ◽  
Process Integration ◽  
Coefficient Of Thermal Expansion ◽  
Low Cost ◽  
Unit Cost ◽  
High Volume ◽  
Thin Glass ◽  
Panel Size ◽  
Wafer Processing

Although Silicon interposer has good performance, however high cost is still the major issue and limits its high volume adoption. Therefore to decrease the assembly cost or develop low cost, high density interconnect interposer technology is the keys to enable 2.5D SiP integration. One possibility is to develop low cost interposer by adopting the alternative materials instead of Silicon. The glass, low CTE polymer material, ceramic, etc. may be included. Glass represents an attractive choice with potential of tailorable properties dependent on specific glass composition. By targeting the coefficient of thermal expansion (CTE), the CTE of glass can be made to match perfectly with silicon dies and for reliable package. In addition, the advantages of using glass for interposer derive from process flexibility for size and thickness since the glass fusion process provides sheets with dimensions of more than three meters. It is straight forward to provide glass substrate of almost any size needed. Large glass panels are ideally suited for fabrication of interposer where the panel process is expected to provide large number of interposers in each run compared with wafer processing. Additionally, the two sided processing of the panel, the avoidance of Si wafer CMP processes further enable lower unit cost for the interposer Consequently, glass is an ideal interposer material due to its insulating property, large panel size availability, high modulus and ability to tailor CTE. In this paper, we successfully demonstrate manufacturing feasibility of glass substrate with 4 build-up layers starting with a thin glass panel in 508mm×508mm panel size format and under the IC substrate manufacturing environment. Glass thickness of 100~300um could be processed through the IC substrate HVM line. The laser via in via or direct metallization technology could be selected for double side electrical connection. The copper line width/space of 8/8um was demonstrated by current substrate HVM line. By adopting advanced lithography process and material, line width/space less than 2/2um was achievable. TCT Reliability test without glass crack results will also be discussed.

scholarly journals Cost per insertion and couple year of protection for post-partum intrauterine devices and implants provided during service scale-up in Kigali, Rwanda

2018 ◽  
Vol 2 ◽  
pp. 39 ◽  
Author(s):  
Kristin M. Wall ◽  
Rosine Ingabire ◽  
Susan Allen ◽  
Etienne Karita
Keyword(s):  
Post Partum ◽  
Low Cost ◽  
Intrauterine Device ◽  
Scale Up ◽  
High Volume ◽  
Health Facilities ◽  
Doctoral Level ◽  
Implementation Costs ◽  
The Government ◽  
The Cost

Introduction: In two high-volume government hospitals, their two affiliated health facilities, and two additional health facilities, we developed and implemented post-partum intrauterine device (PPIUD) and post-partum (PP) implant promotions and service delivery procedures between May and July 2017 in Kigali, Rwanda. Between August 2017 and July 2018, 9,073 pregnant women received PPIUD/PP implant promotions who later delivered in one of our selected facilities. Of those, 2,633 had PPIUDs inserted, and 955 had PP implants inserted. Methods: Here, we detail the expenditures during the implementation from the payer perspective (including both the implementation costs and the cost of contraceptive methods) and estimate the cost per PPIUD insertion, PP implant insertion, and couple years of protection (CYP) for PPIUD and PP implant users. Research costs for formative work were excluded. Results: A total of $74,147 USD was spent on the implementation between August 2017 and July 2018. The largest expense (34% of total expenses) went toward personnel, including doctoral-level, administrative, data management and nurse counseling staff. Training for PPIUD and implant providers and promoters comprised 8% of total expenses. Recruitment and reimbursements comprised 6% of expenses. Costs of implants to the government comprised 12% of the expenses, much higher than the cost of IUDs (1%). Costs per insertion were $25/PPIUDs and $77/PP implant. Costs per CYP were $5/PPIUDs and $20/PP implant. Conclusion: The PPIUD/PP implant service implementation provided services at a low cost per insertion and CYP. Understanding the cost per PPIUD/PP implant inserted and CYP can help to inform the cost of scaling up PPIUD/PP implant service implementation activities and resource allocation decision-making by the Rwandan Ministry of Health.

Chip Last Fan Out as an Alternative to Chip First

2015 ◽  
Vol 2015 (1) ◽  
pp. 000245-000250 ◽  
Author(s):  
Scott Chen ◽  
Simon Wang ◽  
Coltrane Lee ◽  
Adren Hsieh ◽  
John Hunt ◽  
...  
Keyword(s):  
Low Cost ◽  
Smart Phone ◽  
High Volume ◽  
Smart Phones ◽  
Portable Devices ◽  
Wafer Level ◽  
Packaging Technology ◽  
Two Factors ◽  
The Cost ◽  
Technology Nodes

Smart phones & other portable devices have dominated Semiconductor growth, and drive IC packages smaller, lighter & thinner, and they continue to integrate more functions in that smaller volume. Besides SOC solutions driven by design houses or system companies, we have seen more packages of Quad Flat Non-lead (QFN), wafer level CSP (WLCSP), and system in package (SIP) being widely used in these smart phones & mobile devices.. Fan out WLCSP (FOWLP) has great potential to be the next new package for the smart phone mobility application. Two factors have driven fan out WLCSP (FOWLP) package technology in the last few years. The first is the advancing technology nodes which allow the shrinkage of die, allowing more die per wafer. However this comes at the cost of reduced package area for I/Os such as solder ball interconnects. The second and potentially more important factor relates to the demand of the market for more functions. Not all silicon functionality benefits from these advanced nodes, and merely adds to the cost of the die. This has driven the designers to partitioning of desired functionality into multiple die, which in turn requires effective interconnection of these separate die. The packaging technology that has evolved to solve these two situations has been Fan Out Wafer Level Packaging (FOWLP). Up to date FOWLP used chip first processing, in which the bare die was molded into a wafer shaped carrier with die pads exposed. Typically sputtering is used to provide interconnects to the die pad followed by patterned electroplating of redistribution lines (RDL) to “Fan Out” the next level interconnect pads to regions that can extend on to the molded material beyond the die perimeter. These processes require the use of relatively expensive semiconductor front end classes of equipment and are tailored to handle the reconstituted molded plastic wafers. We will describe a new alternative to chip first FOWLP, an alternative which meets the needs of a large percentage of the applications requiring a packaging technology such as FOWLP. This new package has been in production in ASE for over a year, and uses a “Chip Last” approach to the problem of increasing useable interconnect pad area. Die which have been bumped with Copper(Cu) Pillars are mass reflowed onto a low cost coreless substrate, followed by over molding which also serves as the die underfill. The Cu pillars allow direct connection to die pads at 50 μm pitch or below, negating the requirement for RDL formation on the die. The use of embedded traces allows for fine lines and spaces down to 15μm or less, and bonding directly on to the bare Copper. The Cu Pillars are bonded to one side of the Copper trace, and the solderballs or LGA pads are directly on the opposite side of the Copper. This makes the substrate to be effectively only as thick as the Copper used in the traces, and allows the final package to be as thin as 400μm. Since this uses existing high volume packaging infrastructures, more complex assemblies including multiple die, inclusion of passive components, and 3D structures can be easily implemented. We have designated this package structure “Fan Out Chip Last Package (FOCLP)” For higher end applications we will show the ability to use a high density substrate process for use in more demanding chip last fan out packages

Development of a Second Generation TiAl Turbocharger

2007 ◽  
Vol 561-565 ◽  
pp. 379-382 ◽  
Author(s):  
Toshimitsu Tetsui
Keyword(s):  
Market Share ◽  
Creep Strength ◽  
Second Generation ◽  
Low Cost ◽  
Manufacturing Processes ◽  
Turbine Wheel ◽  
The Cost ◽  
Low Cost Manufacturing ◽  
Wheel Material

In order to expand a market share of TiAl turbocharger a second generation TiAl turbocharger was newly developed. The characteristic of this turbocharger is its improved turbine wheel material with excellent creep strength and its low cost manufacturing processes. The usable temperature of this turbocharger is higher than Inconel713C turbocharger, and the cost is much reduced compared with current TiAl turbocharger.

scholarly journals Concrete Mix Using Solid Waste Aggregates (Coconut Shell Concrete)

2019 ◽  
Vol 8 (10) ◽  
pp. 84-89 ◽  
Keyword(s):  
Coarse Aggregate ◽  
Low Cost ◽  
Agricultural Waste ◽  
Research Work ◽  
Coconut Shell ◽  
Partial Replacement ◽  
Fine Aggregate ◽  
Concrete Mix ◽  
The Cost ◽  
Cost Of Construction

Now days the cost of construction is increasing day by day due to increase in the prices of the building materials. The main ingredients of the concrete are coarse aggregate, fine aggregate and cement. Every construction company mainly depends on these ingredients for the production of concrete. In the present scenario most of the research work is done on how to reduce the cost of construction by increasing the strength of the concrete. Depending up on the properties many of the waste materials are used in the concrete as the partial replacement of aggregates. Mostly fly ash ,rice husk ash and blast furnace slag are found to be suitable for replacing the fine aggregate partially in concrete. Agriculture is the major occupation of the people in India and coconut production is one of the major agriculture production in India. The shell of the coconut is an agricultural waste and requires large amount of area for its dumping after its usage. It causes environment pollution if it is not dumped properly and creates major problem. If this coconut shell is used as replacement for coarse aggregate in concrete it gives solution to the major environmental pollution. Experiments have done on the effect of partial replacement of coarse aggregate with coconut shell for different percentages and investigated the properties of this composite concrete In this study, for M20 and M25 grades concrete four different concrete mixes for each grade with various combinations of coconut shell of about 0%, 10%, 20% and 30% were prepared. For each concrete mix three sample specimens were casted. The main focus behind this study is to utilize the agricultural waste like coconut shells which are of low cost when compared to the coarse aggregates and thus giving rise to the topic of how to construct the structures within low cost. In this study a short term analysis, at 28 days, the nature of coconut shell aggregate concrete is studied by conducting some tests like compressive strength, workability tests and comparison of these results are made with the normal concrete. In order to maintain serviceability, durability and strength of the members all the necessary precautions are taken. Thus by adopting this concept it will be very much helpful for the civil engineers and especially the society to fulfill their basic needs like low cost housing.

scholarly journals Channelized Substrates Made from BaZr0.75Ce0.05Y0.2O3−d Proton-Conducting Ceramic Polymer Clay

Membranes ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 130
Author(s):  
Sandrine Ricote ◽  
Benjamin L. Kee ◽  
W. Grover Coors
Keyword(s):  
Low Cost ◽  
Proton Conductor ◽  
High Volume ◽  
Proton Conductors ◽  
Membrane Reactors ◽  
Barium Zirconate ◽  
Separation Membrane ◽  
Complex Architectures ◽  
State Ceramic ◽  
Low Cost Manufacturing

A novel process for producing thick protonic ceramics for use in hydrogen separation membrane reactors is demonstrated. Polymer clay bodies based on polyvinyl acetate (PVA) and mineral oil were formulated, and they permitted parts with complex architectures to be prepared by simple, low-pressure molding in the unfired, “green” state. Ceramic proton conductors based on doped barium zirconate/cerate, made by solid-state reactive sintering, are particularly well-suited for the polymer clay process. In this work, the ceramic proton conductor, BZCY755 (BaZr0.75Ce0.05Y0.2O3−d) was fabricated into a variety of shapes and sizes. Test coupons were produced to confirm that the polymer clay route leads to a high-quality ceramic material suitable for the demanding environment of high-temperature membrane reactors. It has been demonstrated that protonic ceramic specimens with the requisite properties are easily prepared at the laboratory scale. The polymer clay fabrication route opens up the possibility of high-volume, low-cost manufacturing at a commercial scale, by a process similar to how dinnerware and sanitary porcelain are produced today.

scholarly journals Consideration of risks in the evaluation of channel deformations for the design of culverts on forest roads.

2017 ◽  
Author(s):  
А.Н. Кондратьев
Keyword(s):  
Low Cost ◽  
Research Work ◽  
Bank Erosion ◽  
Channel Deformations ◽  
Forest Roads ◽  
Normative Documents ◽  
Hydrological Characteristics ◽  
Channel Erosion ◽  
The Cost ◽  
Cost Of Construction

Оценен учет рисков при проектировании водопропускных сооружений на лесных дорогах на примере расчета русловых размывов берегов на малых водотоках. В результате расчетов гидрологических характеристик в современных нормативных документах по изысканиям получаются конкретные значения. Например, размыв берега в створе проектирования трубного перехода принимается равным 10 м. Неточности и ошибки расчетов при этом не учитываются, хотя они могут привести к тому, что проектируемое сооружение может быть размыто или, наоборот, заилено. Фактически же в расчетах всегда скрыты ошибки разного рода. Следовательно, имеется интервал разброса результатов расчета, например 8–12 м. Специфика инженерно-гидрометеорологических изысканий при подготовке данных для проектирования объектов лесной инфраструктуры заключается в том, что здесь более интересна верхняя граница, т. е. следует принимать размыв 12 м. Рассмотрено, как разброс результатов подобных расчетов может отразиться на затратах. Для этого оценен переход от значений размыва берега за период проектной эксплуатации сооружения и вероятности (P, %) к затратам (Z, руб.), а затем к риску (R, руб.), под которым понимается произведение затрат на обеспеченность R = ZP. Рассмотрен вклад разных затратных частей, из которых основные – на строительство и ликвидацию аварии. Выяснилось, что при разных соотношениях стоимости строительства и ликвидации аварии оптимальными будут разные стратегии: при малой стоимости выгодно уменьшать стоимость строительства, при большой стоимости ликвидации аварии лучше выбирать более безопасные варианты, даже при увеличении стоимости строительства. Estimated risks in the design of culverts on forest roads by the example of the calculation of channel erosion on the banks of small watercourses. The result of the calculation of hydrological characteristics in the modern normative documents on research work specific values. For example, erosion of the coast in alignment with the projecting pipe is 10 m. Inaccuracies and errors of calculation are not taken into account, although they can lead to the fact that the designed structure may be blurred, or vice versa, silted. In fact, the calculations are hidden all kinds of errors. Therefore, an interval of variation of the calculation result, for example, 8–12 m. Specificity of engineering-hydrometeorological survey in the preparation of data for the design of forest infrastructure is that in this case, a more interesting upper bound, that is, we should accept the erosion of 12 m. the article considers, as variation results of such calculations can affect the cost. For the evaluated transition from the values of Bank erosion during the period of project operation facilities and security (P, %), cost (Z, rub.), then risk (R, rub.), which is defined as the product of the cost of the security R = ZP. Contribution of different cost parts, which is main – 1) construction and 2) liquidation of the accident. It turned out that at different ratios of the cost of construction and the elimination of the accident will be optimized with different strategies: in low-cost liquidation of the accident is advantageous to reduce the cost of construction, with the high cost of liquidation of the accident it is better to choose more secure options, even if you increase the cost of construction.

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