A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys
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In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of submicron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
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2002 ◽
Vol 11
(2)
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pp. 266-275
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2014 ◽
Vol 35
(21)
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pp. 5472-5481
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2016 ◽
Vol 26
(16)
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pp. 2609-2616
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