Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

2007 ◽  
Author(s):  
Jin Yang ◽  
I. Charles Ume
Keyword(s):  
Modal Analysis ◽  
Manufacturing Industry ◽  
Flip Chip ◽  
Solder Bump ◽  
Electronic Devices ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Inspection System ◽  
Out Of Plane ◽  
Vibration Experiment

Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A novel solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices. The effect of solder bump defects on the mode frequencies and mode shapes is investigated in this paper. The objective is to develop a modal analysis approach integrating analytical, numerical and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and out-of-plane vibration experiment for a 6.35mm×6.35mm×0.6mm non-underfilled PB18 flip chip on a FR4 board.

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Jin Yang ◽  
I. Charles Ume
Keyword(s):  
Modal Analysis ◽  
Manufacturing Industry ◽  
Flip Chip ◽  
Solder Bump ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Inspection System ◽  
Solder Bumps ◽  
Out Of Plane ◽  
Plane Displacement

Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices under pulsed laser loading. The effect of solder bump defects on the mode frequencies and mode shapes is reported in this paper. The objective is to develop a modal analysis approach, which integrates analytical, numerical, and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and transient out-of-plane displacement measurements for a 6.35×6.35×0.6mm3 PB18 flip chip mounted on a FR4 board.

Dynamic Analysis of an Elevator Traveling Cable Using a Singularity-Free Beam Formulation

2017 ◽  
Vol 84 (4) ◽  
Author(s):  
W. Fan ◽  
W. D. Zhu
Keyword(s):  
Dynamic Analysis ◽  
Multibody Dynamics ◽  
Natural Frequencies ◽  
Vertical Motion ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Out Of Plane ◽  
Forced Responses ◽  
Free Beam ◽  
Good Agreement

A round elevator traveling cable is modeled using a singularity-free beam formulation. Equilibria of the traveling cable with different elevator car positions are studied. Natural frequencies and the corresponding mode shapes of the traveling cable are calculated and they are in excellent agreement with those calculated by abaqus. In-plane natural frequencies of the traveling cable do not change much with the car position compared with its out-of-plane ones. Dynamic responses of the traveling cable are calculated and they are in good agreement with those from commercial multibody dynamics software recurdyn. Effects of vertical motion of the car on free responses of the traveling cable and those of in-plane and out-of-plane building sways on forced responses are investigated.

Modal Analysis and Dynamic Responses of a Hysteretically Damped Axle Shaft With a Transverse Crack

2019 ◽  
Author(s):  
C. Shravankumar ◽  
Yash K. Sarda ◽  
V. Thamarai Selvan
Keyword(s):  
Modal Analysis ◽  
Condition Monitoring ◽  
Crack Detection ◽  
Natural Frequencies ◽  
Fatigue Cracks ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Fast Fourier Transformation ◽  
Transverse Loads ◽  
Eigen Value

Abstract An axle shaft supports rotating elements, and is fitted to the housing by means of bearings. It mostly does not transmit torque, with exceptions such as in train axles. Non-rotating axles are subjected to bending moments due to dynamic transverse loads. Axles such as in automobiles are marked with occasional failures due to fatigue cracks, which can prove serious, if the cracks are not detected early. Vibration based condition monitoring is the field concerned with crack detection based on the dynamic responses of the system. In this light, the present paper discusses the vibration analysis of a cracked axle. The cracked shaft is modelled using finite element method, for transverse vibration conditions. The shaft is modelled based on Euler-Bernoulli theory for bending, while the crack is modelled based on fracture mechanics approach. After modelling, modal analysis of the system is carried out, with the consideration of proportional hysteretic damping. The Eigen value problem provides the natural frequencies and mode shapes. The Frequency Response Functions (FRF’s) magnitude and phase plots are obtained, from which the natural frequencies and structural damping loss factors can be calculated. Further, the free vibration and forced vibration system time responses are obtained, using numerical integration methods. The corresponding responses in frequency domain are obtained using Fast Fourier Transformation (FFT). The FRF’s and dynamic responses of the shaft without and with crack are comparatively studied. The study provides the platform for condition monitoring of shaft cracks.

scholarly journals Forced Vibration of a Timoshenko Beam Subjected to Stationary and Moving Loads Using the Modal Analysis Method

2017 ◽  
Vol 2017 ◽  
pp. 1-26 ◽  
Author(s):  
Taehyun Kim ◽  
Ilwook Park ◽  
Usik Lee
Keyword(s):  
Modal Analysis ◽  
Timoshenko Beam ◽  
Forced Vibration ◽  
Natural Frequencies ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Timoshenko Beams ◽  
Moving Loads ◽  
Analysis Method ◽  
Simply Supported

The modal analysis method (MAM) is very useful for obtaining the dynamic responses of a structure in analytical closed forms. In order to use the MAM, accurate information is needed on the natural frequencies, mode shapes, and orthogonality of the mode shapes a priori. A thorough literature survey reveals that the necessary information reported in the existing literature is sometimes very limited or incomplete, even for simple beam models such as Timoshenko beams. Thus, we present complete information on the natural frequencies, three types of mode shapes, and the orthogonality of the mode shapes for simply supported Timoshenko beams. Based on this information, we use the MAM to derive the forced vibration responses of a simply supported Timoshenko beam subjected to arbitrary initial conditions and to stationary or moving loads (a point transverse force and a point bending moment) in analytical closed form. We then conduct numerical studies to investigate the effects of each type of mode shape on the long-term dynamic responses (vibrations), the short-term dynamic responses (waves), and the deformed shapes of an example Timoshenko beam subjected to stationary or moving point loads.

Experimental and Numerical Investigation of Residual Stress Stiffening Influence on Dynamic Response of Welded Structures

2019 ◽  
Author(s):  
AmirHossein MajidiRad ◽  
Yimesker S. Yihun
Keyword(s):  
Residual Stress ◽  
Finite Element ◽  
Modal Analysis ◽  
Natural Frequencies ◽  
Model Updating ◽  
Experimental Modal Analysis ◽  
Experimental Results ◽  
Welding Residual Stress ◽  
Dynamic Responses ◽  
Mode Shapes

Abstract This paper presents the study of welding residual stress-stiffening effect on the dynamic responses and vibrational parameters of welded aluminum parts through an experimental modal analysis and Center Hole Drilling (CHD) residual stress measurement methods. Having a great corrosion resistance, AA5056 was utilized in this research that has been used in aircraft and ship structures; making the welding assesment of crucial. Natural frequencies and damping factors of several specimens are compared before and after the welding along with verification of experimental modal analysis integrity using Euler-Bernoulli relations. Finite element modeling of welding, cutting and modal/stress analysis of samples are also done to compare the experimental results. The results obtained from the precise modal analysis of all samples show that welding made the structure harder leading to 2% increase in natural frequencies and changing damping factors of different mode shapes. Cutting also reduced the level of residual stresses up to 34%. A good agreement is shown between the modal analysis and the experimental results. The technique used in the experiment and finite element simulation along with modeling assumptions are beneficial to other applications where model updating is required or a prediction of residual stress stiffening influence on modal responses is important.

Application of a Novel Flip Chip Solder Joint Inspection System to Chips on an FR-4 Substrate

2000 ◽  
Author(s):  
Dathan S. Erdahl ◽  
Sheng Liu ◽  
I. Charles Ume
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Solder Bump ◽  
Solder Joints ◽  
Inspection System ◽  
Vibration Displacement ◽  
Manufacturing Defects ◽  
Flip Chips ◽  
Solder Joint Inspection

Abstract Because the trend in electronic interconnection technology is toward the development of solder bump technologies, that include flip chips, chip scale packages, multi-chip modules (MCMs), and ball grid array (BGA) packages, solder bump inspection methods must be developed to allow rapid, accurate, and high resolution on-line inspection of joint quality. Although traditional methods can detect some manufacturing defects, they do not actually test the mechanical quality of the connection. A novel solder-joint inspection system has been developed based on laser ultrasound and interferometric techniques. A pulsed laser generates ultrasound on the chip’s surface and the whole chip is excited into vibration modes. An interferometer is used to measure the vibration displacement of the chip’s surface. Solder joints with different qualities cause different vibration responses, acting as constraints on the system. The system was used to inspect the quality of solder joints on a group of flip chips mounted on FR-4 substrates, and the results show the ability of the system to detect defects such as missing solder balls, cracked chips, and gross misalignment.

Application of Modal Analysis to Damage Detection in Composite Laminates

Volume 2 ◽  
2004 ◽  
Author(s):  
Huiwen Hu ◽  
Bor-Tsuen Wang ◽  
Jing-Shiang Su
Keyword(s):  
Modal Analysis ◽  
Composite Laminates ◽  
Strain Energy ◽  
Promising Result ◽  
Differential Quadrature Method ◽  
Damage Index ◽  
Laminate Plate ◽  
Modal Testing ◽  
Dynamic Responses ◽  
Mode Shapes

A nondestructive detection of damage in composite laminates by using modal analysis is investigated in this paper. Continued fiber-reinforced composite AS4/PEEK was used to fabricate a symmetrical laminate plate and a surface crack was created in one side of the laminate plate. The results of modal testing are presented for the application of modal analysis to the laminate plate before and after damage. Changes in mode shapes, mode shape slopes and strain energies were used to calculate the damage index for indicating the damage location. Differential quadrature method (DQM) was introduced to solve the problem of partial derivatives function in strain energy formula. A 3-D finite element model was created for comparison with the experimental results. The model accurately predicted the dynamic responses. It was found that damage index using strain energy method provides a more promising result than other methods in locating the damage.

Dynamic Analysis of an Elevator Traveling Cable Using a Singularity-Free Beam Formulation

2017 ◽  
Author(s):  
W. Fan ◽  
W. D. Zhu
Keyword(s):  
Natural Frequencies ◽  
Vertical Motion ◽  
Dynamic Responses ◽  
Mode Shapes ◽  
Normal Strain ◽  
Euler Parameters ◽  
Current Formulation ◽  
Out Of Plane ◽  
Forced Responses ◽  
Free Beam

An elevator traveling cable is modeled using a singularity-free beam formulation and its static and dynamic behaviors are analyzed. The beam is assumed to be an extensible Euler-Bernoulli beam, and the configuration of the beam is described by Euler parameters, which can resolve the singularity problem of Euler angles, and the normal strain of the centroid line of the beam. The position of the centroid line of the beam is integrated from its slope. Governing equations of the beam and constraint equations are derived using Lagrange’s equations for systems with constraints. The current formulation is used to calculate the equilibrium and dynamic responses of an elevator traveling cable with arbitrarily moving ends. Equilibria of a traveling cable with different elevator car positions are calculated. Natural frequencies and corresponding mode shapes of the traveling cable are calculated and they are in excellent agreement with those calculated by ABAQUS. In-plane natural frequencies of the traveling cable do not change much with the car position compared with its out-of-plane ones. Dynamic responses of the traveling cable are calculated using the current formulation and compared with those from commercial multibody dynamics software RecurDyn, and they are in good agreement with each other. Free responses of the traveling cable due to vertical motion of the car and forced responses with inplane and out-of-plane building sways are simulated, and their effects on dynamic responses of the traveling cable are investigated. While the vertical motion of the car can affect the in-plane lateral response of the traveling cable, it has almost no effect on its out-of-plane response. Building sways can affect both lateral and out-of-plane responses of the traveling cable, but they have little effect on its vertical response.

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

2012 ◽  
Vol 134 (3) ◽  
Author(s):  
Da Yu ◽  
Jae Kwak ◽  
Seungbae Park ◽  
Soonwan Chung ◽  
Ji-Young Yoon
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Plane Deformation ◽  
Electronic Devices ◽  
Drop Impact ◽  
Dynamic Responses ◽  
Electronic Components ◽  
Full Field ◽  
Out Of Plane ◽  
Board Level

In order to protect the electronic components of electronic devices on a printed circuit board (PCB) against electromagnetic radiation, a conductive shield-can or box is normally attached to the PCB covering the electronic components. In particular, handheld electronic devices are prone to be subjected to drop impact. This means that the products would experience a significant amount of out-of-plane deformation along the PCB, which may cause stresses eventually resulting in solder joint failures. The attached shield-can could provide additional mechanical strength and minimize the out-of-plane deformation, especially where the electronic package is located. In this study, both the dynamic responses of the PCB and the characteristic life of solder joints with different shield-can designs were investigated, which are seldom explored by other researchers. In the board-level drop tests, a noncontact full-field optical measurement technique, digital image correlation (DIC) with images taken by stereo-high-speed cameras, was used to obtain full-field displacement data showing the dynamic responses of the PCB during the drop impact. PCBs with a fine ball grid array (FBGA) package were prepared with various types of shield-can attached. From the experimental results the effects of different shield-can types, varying in shape and size on the dynamic responses of the PCB, were analyzed. In addition, the number of drops to failure for each shield-can was also recorded by an event detector. Using ANSYS/LS-DYNA, an accurately validated finite element model has been developed. Then the stress analysis could be performed in order to study the failure mechanism by finding the maximum tensile stress of the solder joints during the drop impact and correlate the stress results with the characteristic life of solder joint.

Modal Analysis of Flip Chip for Solder Bump Defect Detection

2012 ◽  
Vol 468-471 ◽  
pp. 2104-2110
Author(s):  
Jun Chao Liu ◽  
Tie Lin Shi ◽  
Ke Wang ◽  
Miao Zeng ◽  
Guang Lan Liao
Keyword(s):  
Modal Analysis ◽  
Defect Detection ◽  
Flip Chip ◽  
Solder Bump ◽  
Ultrasonic Waves ◽  
Critical Element ◽  
Inspection Method ◽  
Chip Technology ◽  
Solder Bumps ◽  
Resonance Frequencies

Flip chip technology is one of the fastest growing segments of microelectronics packaging because of its ability to satisfy the increasing demands of high input/output density, package miniaturization, and reduced cost. A critical element in the successful application of flip chip technology is the reliability of solder bumps. In this paper, a nondestructive inspection method combining ultrasonic excitation with modal analysis is proposed for flip-chip solder bump defect detection. The signal generator and power amplifier are utilized to drive the capacitive air-coupled ultrasonic transducer to produce continuous ultrasonic waves for exciting the test chips. The vibration velocities of the chips are measured by the laser scanning vibrometer to extract the modal shapes and resonance frequencies. The results prove that the defective chips can be distinguished from the good chip by the modal shapes, and the resonance frequencies of the chips decrease with the increase of the open solder bumps. Therefore, this detection method may provide a new path for the improvement and innovation of flip chip on-line inspection systems.

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