Quantitative Characterization of Microsystem Dynamics

2007 ◽  
Author(s):  
Ryszard J. Pryputniewicz ◽  
Emily J. Pryputniewicz
Keyword(s):  
Computer Aided Design ◽  
Operating Conditions ◽  
Software Environment ◽  
Quantitative Characterization ◽  
Full Field ◽  
Modeling Simulation ◽  
Requirements Specifications ◽  
Physical Measurements ◽  
Measurement Methodology

Development of microelectromechanical system (MEMS) sensors for various applications requires the use of analytical and computational modeling/simulation coupled with rigorous physical measurements. This requirement has led to advancement of an approach that combines computer aided design (CAD) and multiphysics modeling/simulation tools with the state-of-the-art (SOTA) measurement methodology to facilitate reduction of high prototyping costs, long product development cycles, and time-to-market pressures while devising MEMS for a variety of applications. In this approach, a unique, fully integrated software environment for multiscale, multiphysics, high fidelity modeling of MEMS is combined with the optoelectronic laser interferometric microscope methodology for quantitative measurements. The optoelectronic methodology allows remote, noninvasive full-field-of view (FFV) measurements of deformations/motions (under operating conditions) with high spatial resolution, nanometer accuracy, and in near real-time. In this paper, both, the modeling environment (including an analytical process used to quantitatively show the influence that various parameters defining a sensor have on its dynamics — using this process dynamic characteristics of a sensor can be optimized by constraining its nominal dimensions and finding the optimum set of uncertainties in these dimensions that best satisfy design requirements/specifications) and the optoelectronic methodology are described and their applications are illustrated with representative examples demonstrating viability of the approach, combining modeling and measurements, for quantitative characterization of microsystem dynamics. These representative examples demonstrate capability of the approach described herein to quantitatively determine effects of dynamic loads on performance of selected MEMS.

Measurement and Modeling of MEMS

2006 ◽  
Author(s):  
Ryszard J. (Rich) Pryputniewicz ◽  
Ryan T. Marinis ◽  
Adam R. Klempner ◽  
Peter Hefti
Keyword(s):  
Computer Aided Design ◽  
Multiscale Simulation ◽  
Software Environment ◽  
Full Field ◽  
Fully Integrated ◽  
Simulation Tools ◽  
Physical Measurements ◽  
Very High Spatial Resolution ◽  
Measurement Methodology ◽  
Computational Modeling And Simulation

Advances in MEMS, also called microsystems, require the use of computational modeling and simulation with physical measurements, i.e., measurements and modeling (M&M) approach is needed. We believe that successful combination of computer aided design (CAD) and multiphysics/multiscale simulation tools with the state-of-the-art (SOTA) measurement methodology will contribute to reduction of high prototyping costs, minimization of long product development cycles as well as time-to-market pressures while developing MEMS for various applications. In our approach we combine a unique, fully integrated, software environment for multiscale, multiphysics, high fidelity analyses of MEMS with the SOTA optoelectronic laser interferometric microscope (OELIM) methodology. The OELIM methodology allows remote, noninvasive, full-field-of-view measurements of deformations with very high spatial resolution, nanometer accuracy, and in near real-time. In this paper, both, the software environment and the OELIM methodology are described and their applications are illustrated with representative results demonstrating viability of the M&M approach to the development of MEMS. These preliminary results demonstrate capability of the M&M approach to quantitatively determine effects that static and dynamic loads have on the performance of MEMS.

Advanced OEH Methodology for Evaluation of Microelectronics and Packaging

2002 ◽  
Author(s):  
Cosme Furlong ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
New Technologies ◽  
Operating Conditions ◽  
Phase Correlation ◽  
Field Of View ◽  
Electronic Packages ◽  
Full Field ◽  
Actual Operating ◽  
Microelectronics Industry ◽  
Microelectronic Components

With the microelectronics industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time. In addition, for certain applications, the nondestructive testing (NDT) of electronic packages may be needed, especially for applications requiring noninvasive, full-field-of-view, real-time testing the behavior of a specific package subjected to actual operating conditions. This type of NDT can be accomplished by application of optical techniques and, in particular, speckle phase correlation techniques in the form of optoelectronic holography (OEH). In this paper, advanced OEH techniques are described and representative applications of OEH for the effective characterization of microelectronic components and packages are presented.

Local strain and defects in silicon wafers due to nanoindentation revealed by full-field X-ray microdiffraction imaging

2015 ◽  
Vol 22 (4) ◽  
pp. 1083-1090 ◽  
Author(s):  
Z. J. Li ◽  
A. N. Danilewsky ◽  
L. Helfen ◽  
P. Mikulik ◽  
D. Haenschke ◽  
...  
Keyword(s):  
Local Strain ◽  
Strain Engineering ◽  
Silicon Wafers ◽  
Defect Characterization ◽  
Quantitative Characterization ◽  
Strain Fields ◽  
Full Field ◽  
X Ray ◽  
Quantitative Mapping

Quantitative characterization of local strain in silicon wafers is critical in view of issues such as wafer handling during manufacturing and strain engineering. In this work, full-field X-ray microdiffraction imaging using synchrotron radiation is employed to investigate the long-range distribution of strain fields in silicon wafers induced by indents under different conditions in order to simulate wafer fabrication damage. The technique provides a detailed quantitative mapping of strain and defect characterization at the micrometer spatial resolution and holds some advantages over conventional methods.

CAD Of Anticorrosive Protection Of Steel Structures

2019 ◽  
pp. 18-23
Keyword(s):  
Protective Coating ◽  
Computer Aided Design ◽  
Steel Structures ◽  
Cost Effective ◽  
Operating Conditions ◽  
Computational Tool ◽  
Protection Method ◽  
Cost Effective Method ◽  
The Cost ◽  
Aided Design

The choice of cost-effective method of anticorrosive protection of steel structures is an urgent and time consuming task, considering the significant number of protection ways, differing from each other in the complex of technological, physical, chemical and economic characteristics. To reduce the complexity of solving this problem, the author proposes a computational tool that can be considered as a subsystem of computer-aided design and used at the stage of variant and detailed design of steel structures. As a criterion of the effectiveness of the anti-corrosion protection method, the cost of the protective coating during the service life is accepted. The analysis of existing methods of steel protection against corrosion is performed, the possibility of their use for the protection of the most common steel structures is established, as well as the estimated period of effective operation of the coating. The developed computational tool makes it possible to choose the best method of protection of steel structures against corrosion, taking into account the operating conditions of the protected structure and the possibility of using a protective coating.

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