A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

2007 ◽  
Author(s):  
X. Long ◽  
I. Dutta ◽  
R. Guduru ◽  
R. Prasanna ◽  
M. Pacheco
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Fatigue Reliability ◽  
Element Analysis ◽  
Mechanical Cycling ◽  
Experimental Apparatus ◽  
Dependent Strain ◽  
Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling

1991 ◽  
Vol 226 ◽  
Author(s):  
Yi-Hsin Pao ◽  
Kuan-Luen Chen ◽  
An-Yu Kuo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Free Edge ◽  
Time Dependent ◽  
Element Analysis ◽  
Finite Element Program ◽  
Element Program ◽  
Peel Stress

AbstractA nonlinear and time dependent finite element analysis was performed on two surface mounted electronic devices subjected to thermal cycling. Constitutive equations accounting for both plasticity and creep for 37Pb/63Sn and 90Pb/10Sn solders were assumed and implemented in a finite element program ABAQUS with the aid of a user subroutine. The FE results of 37Pb/63Sn solder joints were in reasonably good agreement with the experimental data by Hall [19]. In the case of 9OPb/1OSn solder in a multilayered transistor stack, the FE results showed the existence of strong peel stress near the free edge of the joint, in addition to the anticipated shear stress. The effect of such peel stress on the crack initiation and growth as a result of thermal cycling was discussed, together with the singular behavior of both shear and peel stresses near the free edge.

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

2004 ◽  
Vol 126 (2) ◽  
pp. 256-264 ◽  
Author(s):  
Raghuram V. Pucha ◽  
Krishna Tunga ◽  
James Pyland ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Cycling ◽  
Thermal Environment ◽  
Inelastic Strain ◽  
Electronic Packages ◽  
Strain Accumulation ◽  
Material Models ◽  
Process Mechanics ◽  
Accelerated Thermal Cycling ◽  
Damage Mapping ◽  
Board Level

A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages intended to be used in military avionics thermal environment. The board-level assembly process mechanics and critical geometric features with appropriate material models are taken into consideration while developing the methodology. The models developed are validated against in-house and published accelerated thermal cycling experimental data. The developed mapping methodology is employed to design alternate accelerated thermal cycles by matching the creep and plastic strain contributions to total inelastic strain accumulation in solder under military field-use and accelerated thermal cycling environments, while reducing the time for accelerated thermal cycling and qualification.

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

2017 ◽  
Author(s):  
Deng Yun Chen ◽  
Michael Osterman
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Material Properties ◽  
Solder Joints ◽  
Material Selection ◽  
Temperature Cycling ◽  
Sac305 Solder ◽  
Element Analysis ◽  
Bga Packages ◽  
The Impact

Solder interconnects in electronic assemblies are susceptible to failures due to environmental high strain rate impact and cyclic stresses. To mitigate the failures, adhesive bonds can be added after the solder assembly process to provide additional mechanical support. For ball grid array (BGA) packages, the adhesive is normally applied to the corners of the package and referred to as corner staking. In addition to corner staking, underfill is also a strategy used to mitigate the stresses on the solder joints. While components with underfill has been widely studied, the study of the impact of corner staking on the reliability of packages remains limited. This paper presents a study of corner-staked BGA packages with tin-3.0 silver-0.5 copper (SAC305) solder subjected to temperature cycling. Experimental temperature cycling is conducted to examine impact of the selected corner staking material on the fatigue life of BGAs. Further, finite element analysis is conducted to understand the influence of material properties of staking material on the fatigue life of BGAs. The result of the study indicates that the presence of corner staking, with selected material properties, reduces the damage on the solder joints under thermal cycling, and thus increases its fatigue life by about 80%. This paper may serve as a guidance for staking material selection to improve the fatigue life of solder joints of BGAs under thermal cycling.

Fatigue Life Modeling of Anisotropic Materials Using a Multiaxial Notch Analysis

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Z. J. Moore ◽  
R. W. Neu
Keyword(s):  
Fatigue Life ◽  
Elevated Temperatures ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Anisotropic Materials ◽  
Equivalent Strain ◽  
Strain Response ◽  
Element Analysis ◽  
Anisotropic Elastic ◽  
Notch Analysis

Fatigue life modeling of anisotropic materials such as directionally-solidified (DS) and single-crystal Ni-base superalloys is often complicated by the presence of notches coupled with dwells at elevated temperatures. This paper focuses on an approach for predicting low cycle fatigue that includes notch geometry effects while taking into consideration material orientation. An analytical model based on a generalization of the Neuber notch analysis to both multiaxial loading and anisotropic materials is used to determine the localized stress-inelastic strain response at the notch. The material anisotropy is captured through a multiaxial generalization of the Ramberg–Osgood relation using a Hill’s criterion. The elastic pseudo stress and pseudo strain response in the vicinity of the notch used as input in the Neuber analysis is determined from an anisotropic elastic finite element analysis. The effects of dwells at elevated temperature are captured using an equivalent strain rate. A nonlocal approach is needed to correlate the life of notched specimens to smooth specimens.

scholarly journals Creep-Fatigue Behaviours of Sn-Ag-Cu Solder Joints in Microelectronics Applications

2021 ◽  
Author(s):  
Joshua A. Depiver ◽  
Sabuj Mallik ◽  
Yiling Lu ◽  
Emeka H. Amalu
Keyword(s):  
Energy Density ◽  
Thermal Cycling ◽  
Strain Rate ◽  
Deformation Rate ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Solder Joints ◽  
Creep Fatigue ◽  
Accelerated Thermal Cycling ◽  
Isothermal Ageing

Electronic manufacturing is one of the dynamic industries in the world in terms of leading technological advancements. Electronic assembly’s heart lies the ‘soldering technology’ and the ‘solder joints’ between electronic components and substrate. During the operation of electronic products, solder joints experience harsh environmental conditions in terms of cyclic change of temperature and vibration and exposure to moisture and chemicals. Due to the cyclic application of loads and higher operational temperature, solder joints fail primarily through creep and fatigue failures. This paper presents the creep-fatigue behaviours of solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB). Using finite element (FE) simulation, the solder joints were subjected to thermal cycling and isothermal ageing. Accelerated thermal cycling (ATC) was carried out using a temperate range from 40°C to 150°C, and isothermal ageing was done at −40, 25, 75 and 150°C temperatures for 45 days (64,800 mins). The solders studied are lead-based eutectic Sn63Pb37 and lead-free SAC305, SAC387, SAC396 and SAC405. The results were analysed using the failure criterion of equivalent stress, strain rate, deformation rate, and the solders’ strain energy density. The SAC405 and SAC396 have the least stress magnitude, strain rate, deformation rate, and strain energy density damage than the lead-based eutectic Sn63Pb37 solder; they have the highest fatigue lives based on the damage mechanisms. This research provides a technique for determining the preventive maintenance time of BGA components in mission-critical systems. Furthermore, it proposes developing a new life prediction model based on a combination of the damage parameters for improved prediction.

Effect of Selected Manufacturing Variables on Reliability of Lead Free Solder Joints

2006 ◽  
Author(s):  
Leila Jannesari Ladani ◽  
Abhijit Dasgupta ◽  
Idelcio Cardoso ◽  
Eduardo Monlevade
Keyword(s):  
Thermal Cycling ◽  
Waiting Time ◽  
Solder Joints ◽  
Lead Free ◽  
Electrical Performance ◽  
Lead Free Solder ◽  
X Rays ◽  
Response Variable ◽  
Accelerated Thermal Cycling ◽  
Free Solder

This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the durability of lead free solder joints. An experiment was designed to systematically vary the reflow and printing process variables in order to fabricate error-seeded test assemblies. The error-seeded samples were then inspected visually and with x-rays, to identify different types of defects, and tested for electrical performance. The specimens were put under accelerated thermal cycling test to characterize the durability of specimens and to study the effect of each manufacturing variable on the durability of solder joints. Thus, the response variable for the design of experiments is the thermal cycling durability of the solder joints. Pre-test micro-structural analysis shows that specimens produced under inadequate reflow profiles suffer from insufficient wetting and insufficient intermetallic formation. Statistical analysis of the response variable shows that waiting time, heating ramp, peak temperature and cooling rate have non-linear effects on the response variable. Two variables, in particular (the heating ramp time and the waiting time), appear to have optimum values within the ranges investigated.

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