Various Levels of Drop Analysis for BGA in Mobile Phones

2007 ◽  
Author(s):  
Takayoshi Katahira ◽  
Masato Fujita ◽  
Tsuyoki Shibata ◽  
Masaki Shiratori ◽  
Qiang Yu
Keyword(s):  
Mobile Phones ◽  
High Speed ◽  
Dielectric Materials ◽  
System Level ◽  
Detailed Model ◽  
Multiple Devices ◽  
Micro Level ◽  
Orthotropic Properties ◽  
Board Level ◽  
Ic Package

To final product quality of mobile phones, key reliability requirements are drop, bend and thermal cycling. Especially in terms of IC-device, drop reliability is the most significant of the three, and also difficult to optimize since it is a dynamic phenomenon in high speed and drop reliability is influenced by 1) system-level factors, 2) board-level and 3) micro-level. In this paper, system-level is defined as phone-level drop, specifically simplified mono-block phone including multiple devices on PWB. System-level enables to evaluate various factors, drop height, drop directions, materials to drop on, phone weight and phone mechanics. Board-level indicates IC-package, PWB and solder joints connecting in between. The board-assembled PWB is fixed onto fixture at 2∼6 points. Drop direction is flat drop only. This paper defines micro level as more detailed model than board level. PWB is modeled as composite structure consisting of dielectric materials with orthotropic properties, copper layers and micro via. IC-package is modeled as well. System level drop shows significant differences in drop directions and also the interactions between drop direction and component location. Micro level simulation results are well-correlative with experimental in failure mode. This paper will discuss overview of 3 levels of drop modeling and will focus on micro level and system level analysis in conjunction with board level.

Assessment of Viscous Flows in High-Speed Micro Rotating Machinery for Energy Conversion Applications

2001 ◽  
Author(s):  
Luc G. Fréchette
Keyword(s):  
Shear Flow ◽  
Energy Conversion ◽  
Viscous Flow ◽  
High Speed ◽  
Applied Pressure ◽  
Secondary Flows ◽  
System Level ◽  
Flow Profile ◽  
System Level Design ◽  
Level Design

Abstract This paper investigates the characteristics of viscous flow in the micron-scale clearances surrounding high-speed micro-rotors currently being developed for miniature energy conversion applications. Analysis and experimental results from 4 mm diameter microfabricated rotors operated above 1 million rpm are used to describe the viscous flow characteristics, and provide guidelines for system-level design. To first order, the flow is characterized as fully developed shear flow (Couette flow) across the small gaps, induced by the rotor motion. However, secondary flows are induced perpendicular to the direction of rotor motion when externally applied pressure gradients exist along the small gaps. The developing flow in the entrance region of the small gaps in this secondary flow direction impacts the shear flow profile, hence affecting the drag on the disk. The effect of other inertial forces, such as Coriolis and centrifugal forces, are investigated analytically and numerically and found to affect the shear flow profile on the fluid in the motor gap at high rotational speeds. Since viscous losses are prevelant in microsystems, appropriate modeling is necessary for system-level design.

Board Level High Speed Photonic Interconnections: Recent System Developments

1990 ◽  
Author(s):  
Gail R. Lalk ◽  
Penny D. Smith ◽  
David W. Emmetts ◽  
Davis H. Hartman
Keyword(s):  
High Speed ◽  
Board Level

System Design and Modeling of a Thermally Activated Reconfigurable Wing

2010 ◽  
Author(s):  
Richard Beblo ◽  
Darrel Robertson ◽  
James Joo ◽  
Brian Smyers ◽  
Gregory Reich
Keyword(s):  
Thermal Energy ◽  
High Speed ◽  
Frictional Heating ◽  
Mechanical Analysis ◽  
Design Tool ◽  
System Level ◽  
Morphing Aircraft ◽  
Thermal Actuation ◽  
Short Period ◽  
Reconfigurable Structures

Reconfigurable structures such as morphing aircraft generally require an on board energy source to function. Frictional heating during the high speed deployment of a blunt nosed low speed reconnaissance air vehicle can provide a large amount of thermal energy during a short period of time. This thermal energy can be collected, transferred, and utilized to reconfigure the deployable aircraft. Direct utilization of thermal energy has the ability to significantly decrease or eliminate the losses associated with converting thermal energy to other forms, such as electric. The following work attempts to describe possible system designs and components that can be utilized to transfer the thermal energy harvested at the nose of the aircraft during deployment to internal components for direct thermal actuation of a reconfigurable wing structure. A model of a loop heat pipe is presented and used to predict the time dependant transfer of energy. Previously reported thermal profiles of the nose of the aircraft calculated based on trajectory and mechanical analysis of the actuation mechanism are reviewed and combined with the model of the thermal transport system providing a system level feasibility investigation and design tool. The efficiency, implementation, benefits, and limitations of the direct use thermal system are discussed and compared with currently utilized systems.

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

2009 ◽  
Vol 131 (1) ◽  
Author(s):  
J. J. M. Zaal ◽  
W. D. van Driel ◽  
F. J. H. G. Kessels ◽  
G. Q. Zhang
Keyword(s):  
High Speed ◽  
Simulation Models ◽  
3D Models ◽  
Drop Impact ◽  
Impact Testing ◽  
Navigation Systems ◽  
High Speed Camera ◽  
Impact Performance ◽  
Impact Simulations ◽  
Board Level

The increased use of mobile appliances such as mobile phones and navigation systems in today’s society has resulted in an increase in reliability issues related to drop performance. Mobile appliances are dropped several times during their lifespan and the product is required to survive common drop accidents. A widely accepted method to assess the drop reliability of microelectronics on board-level is the drop impact test. This test has been standardized by international councils such as Joint Electron Device Engineering Council and is widely adopted throughout the industry. In this research the solder loading is investigated by combining high-speed camera measurements of several drop impact tests with verified finite element models. These simulation models are developed in order to gain an insight on the loading pattern of solder joints based on interconnect layout, drop conditions, and product specifications prior to physical prototyping. Deflections and frequencies during drop testing are measured using a high-speed camera setup. The high-speed camera experiments are performed on two levels: machine level (rebounds with and without a catcher) and product level (with different levels of energy and different pulse times). Parametric (dynamic and quasistatic) 3D models are developed to predict the drop impact performance. The experimental results are used to verify and enhance the simulation models, e.g., by tuning the damping parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance.

High Performance Storage for Big Data Analytics and Visualization

2018 ◽  
pp. 254-275
Author(s):  
Armando Fandango ◽  
William Rivera
Keyword(s):  
Big Data ◽  
High Speed ◽  
High Performance ◽  
File System ◽  
Predictive Analytics ◽  
Big Data Analytics ◽  
File Systems ◽  
Distributed Applications ◽  
System Level ◽  
File Formats

Scientific Big Data being gathered at exascale needs to be stored, retrieved and manipulated. The storage stack for scientific Big Data includes a file system at the system level for physical organization of the data, and a file format and input/output (I/O) system at the application level for logical organization of the data; both of them of high-performance variety for exascale. The high-performance file system is designed with concurrent access, high-speed transmission and fault tolerance characteristics. High-performance file formats and I/O are designed to allow parallel and distributed applications with easy and fast access to Big Data. These specialized file formats make it easier to store and access Big Data for scientific visualization and predictive analytics. This chapter provides a brief review of the characteristics of high-performance file systems such as Lustre and GPFS, and high-performance file formats such as HDF5, NetCDF, MPI-IO, and HDFS.

High-Speed Connectivity

2022 ◽  
pp. 69-87
Author(s):  
Vijay Prakash ◽  
Lalit Garg ◽  
Jack Azzopardi ◽  
Thomas Camilleri
Keyword(s):  
Mobile Phones ◽  
High Speed ◽  
Local Community ◽  
Cellular Systems ◽  
Future Perspective ◽  
The Internet ◽  
Public Infrastructure ◽  
Broadband Network ◽  
The Internet Of Things

Since the early 1990s, there has been a lot of enthusiasm for using high-speed connectivity to develop local community links through education, employment possibilities, fostering community events, and enhancing overall sociability within a local region. 5G is the 5th iteration of a broadband network operating on cellular systems. 5G is not only for mobile phones, but it is also the foundation for virtual reality (VR); the internet of things (IoT); and autonomous transport, immersive services, and public infrastructure; and connecting many electronic devices to the internet. In this chapter, first, the authors have discussed the evolution of 1G network to 6G networks by focussing on its potential impact on the quality of life. Further, 5G applications in IoT, autonomous transport, immersive services, and public infrastructure have been discussed. Then the chapter discusses popular advantages, limitations in the current technologies, implementations, and future perspective.

Advanced Package Design: Inter-Domain Design Methodologies

2019 ◽  
Vol 2019 (1) ◽  
pp. 000284-000288
Author(s):  
Bill Acito ◽  
Keyword(s):  
Design Flow ◽  
Advanced Technology ◽  
System Level ◽  
Management Tool ◽  
Design System ◽  
System Management ◽  
Next Generation ◽  
Ic Design ◽  
Package Design ◽  
Ic Package

Abstract Just as we transitioned from simplistic lead frames to large ball grid arrays decades ago, we find ourselves again at another inflection point in design. Originally a derivative of PCB design, IC package design finds itself straddling both PCB-style design and traditional IC design. Dimensions have shrunk to place IC package design squarely in the same design dimensions as integrated circuits. Likewise, with Moore's law rapidly losing steam to support SoC's as a system integration vehicle, advanced package technologies have been asked to fill the system enablement gap. We now see advanced packaging technologies with silicon content as the system enabler in 2.5D, 3D and fanout wafer-level packaging. Because of the silicon and small geometries, IC design flows and signoff mechanisms are being used to design the next-generation of packaged systems. Package design now finds itself in the forefront of system-level design enablement. Where once system aggregation was done in a SoC at the silicon level, packaging is being used to build a system from technology-optimized die from each functional area (memory, processing, and interfaces). Silicon is no longer just a substrate material for IC manufacturing but a “package” substrate and functional integration vehicle. As such, package design teams find themselves adding IC-based design flows and methodologies. Package designers must look to the IC tools for routing, DRC, and signoff capabilities. Designers are looking for next-generation EDA tools to support these new integration and design challenges, including LVS-like validation checks and IC-based design rules. Rather than transitioning the design team from traditional packaging tools to IC tools entirely, we propose that users can leverage complete design flows that merge the best-in-class capabilities from each of their respective design domains. Is this regard, the best-in-class capabilities can remain in their respective domains, and a design flow can be created that relies on tight integration between both domains. These flows can also leverage a single point of entry for design capture and system level management. Flows based on the system management tool and the appropriate features in each of the domains can be created that enable and optimize complex designs that meet physical, signal integrity, cost and performance requirements. We will describe how capabilities can be leveraged from both domains in a tightly coupled flow, overseen by a design system-management tool, to address the challenges of advanced-technology and silicon-based system.

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