Analysis of Thermal Displacements Due to CTE Mismatches Using FEA Simulation and Experimental Validation With a Differential Variable Reluctance Transducer

2007 ◽  
Author(s):  
Tony A. Asghari ◽  
Joseph Janas
Keyword(s):  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Relative Displacement ◽  
Linear Displacement ◽  
System Level ◽  
Element Analysis ◽  
Variable Reluctance ◽  
Power Cycling ◽  
Thermal Displacements ◽  
Fea Simulation

Deformation induced by thermal loading in a severe automotive environment, between an electronic ceramic substrate — bonded to an aluminum heatsink — and an adjacent nylon material, was investigated by numerical and experimental methods. The goal of this paper is to quantify the relative displacement of certain points of interest, where an aluminum wire bond exists. This displacement is caused by 1) coefficient of thermal expansion (CTE) mismatches of various parts of the assembly when temperature distribution is uniform, and 2) when temperature gradients exist in either steady-state or transient conditions due to thermal cycling (between +150°C and −40°C) as well as power cycling. ANSYS Workbench™ finite element analysis (FEA) software was used to model the system level deformation under various conditions. A unique, quick, and repeatable method of experimentally measuring displacement using a Differential Variable Reluctance Transducer (DVRT®) was utilized. The DVRT® and its signal conditioner provide an analog DC voltage output, which is proportional to linear displacement (resolution as fine as 1.5 micrometer). Error inherent to the DVRT® was adjusted by further testing using a modified sample of Invar. The numerical and experimental results showed good overall correlation.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

2005 ◽  
Vol 128 (3) ◽  
pp. 208-214 ◽  
Author(s):  
John G. Bai ◽  
Jesus N. Calata ◽  
Guo-Quan Lu
Keyword(s):  
Thermal Cycling ◽  
Solder Bump ◽  
Coefficient Of Thermal Expansion ◽  
Operating Temperature ◽  
Power Device ◽  
Element Analysis ◽  
Temperature Changes ◽  
Power Cycling ◽  
Thermomechanical Reliability ◽  
Cycling Experiment

Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling experiment and finite element analysis (FEA). The SB interconnection shows superior reliability over the DS interconnection in the thermal cycling experiment because the mismatched coefficient of thermal expansion leads to smaller stresses at the SB interconnection under the same temperature changes. On the other hand, FEA results show that the DS package has significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis.

scholarly journals An Investigation of Silica Aerogel to Reduce Acoustic Crosstalk in CMUT Arrays

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1459
Author(s):  
Varshitha Yashvanth ◽  
Sazzadur Chowdhury
Keyword(s):  
Silica Aerogel ◽  
Ultrasonic Transducer ◽  
Fluid Interface ◽  
Fractional Bandwidth ◽  
Neighboring Element ◽  
Element Analysis ◽  
Average Improvement ◽  
Capacitive Micromachined Ultrasonic Transducer ◽  
Scholte Wave ◽  
Fea Simulation

This paper presents a novel technique to reduce acoustic crosstalk in capacitive micromachined ultrasonic transducer (CMUT) arrays. The technique involves fabricating a thin layer of diisocyanate enhanced silica aerogel on the top surface of a CMUT array. The silica aerogel layer introduces a highly nanoporous permeable layer to reduce the intensity of the Scholte wave at the CMUT-fluid interface. 3D finite element analysis (FEA) simulation in COMSOL shows that the developed technique can provide a 31.5% improvement in crosstalk reduction for the first neighboring element in a 7.5 MHz CMUT array. The average improvement of crosstalk level over the −6 dB fractional bandwidth was 22.1%, which is approximately 5 dB lower than that without an aerogel layer. The results are in excellent agreement with published experimental results to validate the efficacy of the new technique.

Analysis of a Virtual Prototype First-Stage Rotor Blade Using Integrated Computer-Based Design Tools

2006 ◽  
Author(s):  
Michel Arnal ◽  
Christian Precht ◽  
Thomas Sprunk ◽  
Tobias Danninger ◽  
John Stokes
Keyword(s):  
Heat Transfer ◽  
Gas Flow ◽  
Thermal Loading ◽  
Cfd Simulation ◽  
Three Dimensional ◽  
Life Assessment ◽  
Element Analysis ◽  
Pressure Losses ◽  
Cooling Channels ◽  
Internally Cooled

The present paper outlines a practical methodology for improved virtual prototyping, using as an example, the recently re-engineered, internally-cooled 1st stage blade of a 40 MW industrial gas turbine. Using the full 3-D CAD model of the blade, a CFD simulation that includes the hot gas flow around the blade, conjugate heat transfer from the fluid to the solid at the blade surface, heat conduction through the solid, and the coolant flow in the plenum is performed. The pressure losses through and heat transfer to the cooling channels inside the airfoil are captured with a 1-D code and the 1-D results are linked to the three-dimensional CFD analysis. The resultant three-dimensional temperature distribution through the blade provides the required thermal loading for the subsequent structural finite element analysis. The results of this analysis include the thermo-mechanical stress distribution, which is the basis for blade life assessment.

Finite Element Analysis of a Gasketed Flange Joint Under Combined Internal Pressure and Thermal Transient Loading

2007 ◽  
Author(s):  
Muhammad Abid ◽  
Javed A. Chattha ◽  
Kamran A. Khan
Keyword(s):  
Finite Element Analysis ◽  
Steady State ◽  
Internal Pressure ◽  
Thermal Loading ◽  
Flange Joint ◽  
Element Analysis ◽  
Transient Loading ◽  
Thermal Transient ◽  
Transient Thermal ◽  
Bolted Flange

Performance of a bolted flange joint is characterized mainly by its ‘strength’ and ‘sealing capability’. A number of analytical and experimental studies have been conducted to study these characteristics only under internal pressure loading. In the available published work, thermal behavior of the pipe flange joints is discussed under steady state loading with and without internal pressure and under transient loading condition without internal pressure. The present design codes also do not address the effects of steady state and thermal transient loading on the structural integrity and sealing ability. It is realized that due to the ignorance of any applied transient thermal loading, the optimized performance of the bolted flange joint can not be achieved. In this paper, in order to investigate gasketed joint’s performance i.e. joint strength and sealing capability under combined internal pressure and transient thermal loading, an extensive nonlinear finite element analysis is carried out and its behavior is discussed.

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

1996 ◽  
Vol 118 (4) ◽  
pp. 206-213 ◽  
Author(s):  
K. X. Hu ◽  
C. P. Yeh ◽  
X. S. Wu ◽  
K. Wyatt
Keyword(s):  
Thin Film ◽  
Phase Angle ◽  
Structural Reliability ◽  
Thermal Loading ◽  
Multichip Module ◽  
Crack Model ◽  
Element Analysis ◽  
Delamination Growth ◽  
Interfacial Delamination ◽  
Functional Behavior

Analysis of interfacial delamination for multichip module thin-film interconnects (MCM/TFI) is the primary objective of this paper. An interface crack model is integrated with finite-element analysis to allow for accurate numerical evaluation of the magnitude and phase angle of the complex stress intensity factor. Under the assumption of quasi-static delamination growth, the fate of an interfacial delamination after inception of propagation is determined. It is established that whether an interfacial delamination will continue to grow or become arrested depends on the functional behavior of the energy release rate and loading phase angle over the history of delamination growth. This functional behavior is numerically obtained for a typical MCM/TFI structure with delamination along die and via base, subjected to thermal loading condition. The effect of delamination interactions on the structural reliability is also investigated. It is observed that the delamination along via wall and polymer thin film can provide a benevolent mechanism to relieve thermal constraints, leading to via stress relaxation.

Computer-Aided Gear Product Realization

2018 ◽  
Author(s):  
Alireza Yazdanshenas ◽  
Emilli Morrison ◽  
Chung-Hyun Goh ◽  
Janet K. Allen ◽  
Farrokh Mistree
Keyword(s):  
Computer Aided Design ◽  
Interaction Analysis ◽  
Gear Tooth ◽  
Integrated Design ◽  
System Level ◽  
Trial And Error ◽  
Stress Concentrations ◽  
Element Analysis ◽  
Gear Design ◽  
Computer Aided

To save time and resources, many are making the transition to developing their ideas virtually. Computer-aided gear production realization is becoming more and more desired in the industry. To produce gears with custom qualities, such as material, weight and shape, the trial and error approach has yielded the best results. However, trial and error is costly and time consuming. The computer-aided integrated design and manufacturing approach is intended to resolve these drawbacks. A simple one stage reduction spur gearbox is used as an example in a case study. First, the gear geometry is developed using computer aided design (CAD) modeling. Next, using MATLAB/Simulink, the gear assembly is connected virtually to other subsystems for system expectations and interaction analysis. Finally, using finite element analysis (FEA) tools such as ABAQUS, a dynamic FEA of the gear integration is completed to analyze the stress concentrations and gear tooth failures. Through this method of virtual gear design, customized dimensions and specifications of gears for satisfying system-level requirements can be developed, thereby saving time and manufacturing costs for any custom gear design request.

Design, Kinematics and Prototype of a Flexible Robot Arm With Planar Springs

2015 ◽  
Author(s):  
Peng Qi ◽  
Hongbin Liu ◽  
Lakmal Seneviratne ◽  
Kaspar Althoefer
Keyword(s):  
Preliminary Test ◽  
Industrial Applications ◽  
Robot Arm ◽  
Kinematic Modeling ◽  
Flexible Robot ◽  
Element Analysis ◽  
Robot Arms ◽  
Environmental Interactions ◽  
In Series ◽  
Fea Simulation

Flexible robot arms have been developed for various medical and industrial applications because of their compliant structures enabling safe environmental interactions. This paper introduces a novel flexible robot arm comprising a number of elastically deformable planar spring elements arranged in series. The effects of flexure design variations on their layer compliance properties are investigated. Numerical studies of the different layer configurations are presented and finite Element Analysis (FEA) simulation is conducted. Based on the suspended platform’s motion of each planar spring, this paper then provides a new method for kinematic modeling of the proposed robot arm. The approach is based on the concept of simultaneous rotation and the use of Rodrigues’ rotation formula and is applicable to a wide class of continuum-style robot arms. At last, the flexible robot arms respectively integrated with two different types of compliance layers are prototyped. Preliminary test results are reported.

Clamp Load Decay Due to Material Creep of Lightweight-Material Joints Under Cyclic Temperature

2015 ◽  
Vol 137 (5) ◽  
Author(s):  
Sayed A. Nassar ◽  
Amir Kazemi
Keyword(s):  
Finite Element ◽  
Temperature Profile ◽  
Thermal Loading ◽  
Substrate Material ◽  
Valuable Insight ◽  
Substrate Thickness ◽  
Element Analysis ◽  
Fea Model ◽  
Cyclic Temperature ◽  
Material Creep

Experimental and finite element techniques are used for investigating the effect of cyclic thermal loading on the clamp load decay in preloaded single-lap bolted joints that are made of multimaterial lightweight alloys. Substrate material combinations include aluminum, magnesium, and steel, with various coupon thicknesses. The range of cyclic temperature profile varies between −20 °C and +150 °C in a computer-controlled environmental chamber for generating the desired cyclic temperature profile and durations. Real time clamp load data are recorded using strain gage-based, high-temperature, load cells. Clamp load decay is investigated for various combinations of joint materials, initial preload level, and substrate thickness. Thermal and material creep finite element analysis (FEA) is performed using temperature-dependent mechanical properties. The FEA model and results provided a valuable insight into the experimental results regarding the vulnerability of some lightweight materials to significant material creep at higher temperatures.

Approximate method for the analysis of components undergoing ratchetting and failure

1998 ◽  
Vol 33 (1) ◽  
pp. 55-65 ◽  
Author(s):  
J Lin ◽  
F P E Dunne ◽  
D R Hayhurst
Keyword(s):  
Approximate Method ◽  
Mechanical Loading ◽  
Thermal Loading ◽  
Cyclic Plasticity ◽  
Processing Unit ◽  
Computationally Efficient ◽  
Element Analysis ◽  
Cyclic Thermal Loading ◽  
Central Processing ◽  
Practical Design

An approximate method has been presented for the design analysis of engineering components subjected to combined cyclic thermal and mechanical loading. The method is based on the discretization of components using multibar modelling which enables the effects of stress redistribution to be included as creep and cyclic plasticity damage evolves. Cycle jumping methods have also been presented which extend previous methods to handle problems in which incremental plastic straining (ratchetting) occurs. Cycle jumping leads to considerable reductions in computer CPU (central processing unit) resources, and this has been shown for a range of loading conditions. The cycle jumping technique has been utilized to analyse the ratchetting behaviour of a multibar structure selected to model geometrical and thermomechanical effects typically encountered in practical design situations. The method has been used to predict the behaviour of a component when subjected to cyclic thermal loading, and the results compared with those obtained from detailed finite element analysis. The method is also used to analyse the same component when subjected to constant mechanical loading, in addition to cyclic thermal loading leading to ratchetting. The important features of the two analyses are then compared. In this way, the multibar modelling is shown to enable the computationally efficient analysis of engineering components.

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