Heat Transfer Analysis and Design Optimization of ALOX High Brightness Light Emitting Diode Package

2007 ◽  
Author(s):  
Shan Gao ◽  
Jupyo Hong ◽  
Sanghyun Choi ◽  
Seogmoon Choi ◽  
Sung Yi
Keyword(s):  
Heat Transfer ◽  
Thermal Properties ◽  
Thermal Resistance ◽  
Light Emitting Diode ◽  
Aluminum Substrate ◽  
Heat Transfer Analysis ◽  
Flux Analysis ◽  
High Brightness ◽  
Light Emitting ◽  
Analysis And Design

High Brightness (HB) Light emitting diode (LED) technology is becoming the choice for many lighting applications. However, one potential problem with LED based lighting systems is the thermal issue during service, which has restricted LED in the application of mini-devices. In this study, thermal performance of Al2O3 (ALOX) based HBLED package is considered. Steady state heat transfer analysis is carried out using 3-D finite element method (FEM). A new algorithm has firstly been developed, which combines FEM analysis and thermal transient experimental investigation, to determine the interfacial thermal properties of the package. Then the interfacial thermal properties are applied in the FEM model for heat transfer analysis. Temperature distribution and heat flux analysis are calculated and thermal resistance of the package is determined based on the FEM simulation. The results show that die attachment (solder material) plays the most important role in the thermal resistance of the ALOX package, i.e., it takes about 80% of the total thermal resistance. In addition, thermal resistance of the package is mainly caused by the interfacial thermal resistances, the behavior of which depends strongly on manufacturing processes. The parametric study shows that Al2O3 isolation ring increases the thermal resistance of the package because it creates an interface inside the aluminum substrate. Pure Aluminum substrate achieves a better performance in the respect of thermal behavior of packaging designs.

Effects of Different Package Structures on Thermal Properties of High Power White LED

2012 ◽  
Vol 503 ◽  
pp. 397-401 ◽  
Author(s):  
Zhe Ran Sun ◽  
Da Ming Wu ◽  
Ya Jun Zhang ◽  
Jian Zhuang ◽  
Kai Fang Dang
Keyword(s):  
Thermal Properties ◽  
Thermal Resistance ◽  
White Light ◽  
High Power ◽  
Light Emitting Diode ◽  
White Led ◽  
Forward Voltage ◽  
Light Emitting

The characteristics of several package structures of high power white Light emitting diode (LED) are described in this paper. The influence of different structures on thermal properties is analyzed. Forward voltage method is used to test the thermal resistance of LED chips.

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
K. C. Yung ◽  
H. Liem ◽  
H. S. Choy ◽  
W. K. Lun
Keyword(s):  
Surface Temperature ◽  
Printed Circuit Board ◽  
Cfd Simulation ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Heat Transfer Analysis ◽  
Significant Drop ◽  
High Brightness ◽  
Light Emitting ◽  
Led Array

This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD) were performed according to the practical working conditions of the LED array. Emphasis was placed upon investigating how the temperature of the surface of LEDs changed in accordance with different placement methods. A significant drop in the surface temperature of the LEDs was found when the triangular and arithmetic spacing placement methods were used; hence, the overall heat dissipating capability of the LED array to the PCB was improved. By optimizing the placement design, the average surface temperature of the LED array achieved a decrease of about 20%, from 120°C to 100°C. The illuminance level of each placement design was measured and compared. Both CFD simulation and experimental results are provided to demonstrate the efficacy of the proposed approach for LED array thermal management.

Reduction of Thermal Resistance and Optical Power Loss Using Thin-Film Light-Emitting Diode (LED) Structure

2015 ◽  
Vol 62 (11) ◽  
pp. 6925-6933 ◽  
Author(s):  
Huan Ting Chen ◽  
Yuk Fai Cheung ◽  
Hoi Wai Choi ◽  
Siew Chong Tan ◽  
S. Y. Hui
Keyword(s):  
Thin Film ◽  
Thermal Resistance ◽  
Power Loss ◽  
Light Emitting Diode ◽  
Optical Power ◽  
Light Emitting

Heat Transfer Analysis and Energy-Saving Methods of the Exterior Windows in the Northern Area

2014 ◽  
Vol 881-883 ◽  
pp. 1233-1236
Author(s):  
Zhong Hua Wang
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Energy Saving ◽  
Outdoor Environment ◽  
Heat Transfer Analysis ◽  
Radiation Heat ◽  
Mathematical Formula ◽  
Factors Affecting ◽  
Northern Area ◽  
Indoor And Outdoor

In this paper, ways of heat transfer through windows and doors between the indoor and outdoor environment in the northern area are summarized. And every heat transfer way is described by mathematical formula. On this basis, methods to improve the energy saving performance of exterior windows are put forward according to factors affecting heat transfer through windows. The first method is increasing solar radiation heat, and then reducing heat loss by infiltration, and increasing the thermal resistance as much as possible. Ideal form of energy-saving window is proposed based on compared windows with different material and thermal resistance.

(Invited) High Brightness, Large Scale GaN Based Light-Emitting Diode Grown on 8-Inch Si Substrate

2014 ◽  
Vol 61 (4) ◽  
pp. 71-78
Author(s):  
S.-J. Lee ◽  
H.-J. Park ◽  
J.-B. Park ◽  
D.-W. Jeon ◽  
J. H. Baek ◽  
...  
Keyword(s):  
Large Scale ◽  
Light Emitting Diode ◽  
Si Substrate ◽  
High Brightness ◽  
Light Emitting

Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board

2015 ◽  
Vol 15 (10) ◽  
pp. 7578-7581
Author(s):  
Jung-Kab Park ◽  
Jin-Ha Shin ◽  
Mun-Gi Jung ◽  
Tomabechi Shigehisa ◽  
Hwa-Sun Park ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Light Emitting Diode ◽  
Thermal Conductance ◽  
Polyimide Film ◽  
Luminous Efficiency ◽  
Circuit Board ◽  
Light Sources ◽  
Thermal Shock Test ◽  
Light Emitting ◽  
Au Electrode

Unlike other light sources such as fluorescent lamps and incandescent bulbs, light-emitting diodes (LED) convert 70∼80% of energy into heat. If the heat produced an LED chip is not effectively released, its luminous efficiency and lifespan are reduced. Therefore, as a method effectively release heat, an LED PKG substrate containing a heat-releasing material with excellent thermal conductance was fabricated, and its thermal resistance and luminous efficiency were analyzed. In this experiment, a thin polyimide film with excellent ductility was used to fabricate the LED PKG substrate. A 35-μm-thick Cu foil with excellent thermal conductance was subjected to high temperature and pressure and attached to both sides of the polyimide film. By electroplating Ag or Au, which has excellent thermal conductance, for us as the electrode and heat-releasing material, LED PKG substrate was fabricated with a thickness of approximately 170 μm. (−40 °C → RT → 120 °C). The results revealed that the LED PKG substrate having a Ag electrode with excellent thermal conductance had an excellent thermal resistance of approximately 4.2 °C/W (Au electrode: 5.6 °C/W). The luminous flux after 100 cycles in the thermal shock test was reduced by approximately 0.09% (Au electrode: 2.77%), indicating that the LED PKG substrate had excellent thermal resistance without any mechanical and material defects in a rapid-temperature-changing environment. The advantages and excellent thermal resistance can be exploited in cellular phones and LCD panels, and heat-releasing problems in thin panels be solved.

High Brightness Blue InGaN/GaN Light Emitting Diode on Nonpolarm-plane Bulk GaN Substrate

2007 ◽  
Vol 46 (No. 40) ◽  
pp. L960-L962 ◽  
Author(s):  
Kenji Iso ◽  
Hisashi Yamada ◽  
Hirohiko Hirasawa ◽  
Natalie Fellows ◽  
Makoto Saito ◽  
...  
Keyword(s):  
Light Emitting Diode ◽  
High Brightness ◽  
Light Emitting ◽  
Bulk Gan
Sign in / Sign up

Export Citation Format

Share Document