Thermal Management of Fujitsu High-End Unix Servers

2005 ◽  
Author(s):  
Jie Wei ◽  
Masahiro Suzuki
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Thermal Interface Materials ◽  
Air Cooling ◽  
Asymmetric Power ◽  
High Performance Computers ◽  
Interface Materials ◽  
Heat Spreading ◽  
System Packaging ◽  
Processor Module

An overview of system packaging and thermal management of the Fujitsu high-performance Unix server PRIMEPOWER HPC2500 is introduced in the present paper. Each node of the HPC2500 comprises sixteen system boards containing up to 128 SPARC64V CPU processors, with the maximum power dissipation about 30kW. A full configuration of the HPC2500 can be further scaled up to the maximum of 128 nodes, resulting in 16,384 CPU processors installed. Thermal management is introduced from viewpoints of the server-cabinet, system-board and CPU processor module levels, respectively. A design strategy of the forced convection air cooling scheme is outlined, implemented to meet increased demanding requirements of high density packaging, high power and power-density dissipations. Furthermore, thermal challenges, arising from high asymmetric power distributions and dissipations of CPU processors, are investigated for high performance computers. Temperature distributions of the CPU processors, effects of heat spreading materials (HIS) and impacts of thermal interface materials (TIM) on the cooling and packaging designs are also analysed and illustrated.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

Advanced Thermal Interface Materials for Thermal Management

2018 ◽  
Author(s):  
Wei Yu ◽  
◽  
Changqing Liu ◽  
Lin Qiu ◽  
Ping Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

Superior thermal interface materials for thermal management

2019 ◽  
Vol 12 ◽  
pp. 80-85 ◽  
Author(s):  
Chang Ping Feng ◽  
Lu Bai ◽  
Rui-Ying Bao ◽  
Shi-Wei Wang ◽  
Zhengying Liu ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities

2020 ◽  
Vol 8 (31) ◽  
pp. 10568-10586 ◽  
Author(s):  
Ying Cui ◽  
Man Li ◽  
Yongjie Hu
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
State Of The Art ◽  
Interface Materials

State-of-the-art experiments and modeling, challenges, and future opportunities for developing high-performance interface materials for electronics thermal management.

The Progress of Graphene in Thermal Transportation

2014 ◽  
Vol 1039 ◽  
pp. 438-445 ◽  
Author(s):  
Ming Zhu Wang ◽  
Xing Xing ◽  
Wei Yu
Keyword(s):  
Thermal Management ◽  
Test Methods ◽  
Research Progress ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Composites ◽  
Nanocarbon Material ◽  
Conductive Property ◽  
Interface Materials ◽  
Application Prospects

Graphene, a two-dimensional nanocarbon material with unique planar structure, has wide application prospects in the field of thermal management due to its excellent thermal conductive property. The test methods for thermal conductivity of graphene are described. Research progress in the application of graphene in the field of thermal management is reviewed. Especially, the application of graphene in nanofluids, thermal interface materials and thermal conductive composites is described in detail.

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

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