Design Optimization of Off-Chip Inductors

2003 ◽  
Author(s):  
Lin Jin ◽  
Albert Chee W. Lu ◽  
Lai L. Wai ◽  
Wei Fan ◽  
Aik Chong Tan ◽  
...  
Keyword(s):  
Design Optimization ◽  
Manufacturing Process ◽  
Design Methodology ◽  
Solution Space ◽  
Operating Frequency ◽  
Wafer Level ◽  
Space Design ◽  
Electromagnetic Simulations

A solution space design methodology is presented for optimization of off-chip inductors. The analysis has been performed for an advanced wafer level redistribution manufacturing process. Electromagnetic simulations were performed to extract the characteristics of different inductor designs. It was observed that the design optimization should be tuned to the operating frequency.

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages

2008 ◽  
Vol 48 (5) ◽  
pp. 757-762 ◽  
Author(s):  
Tsung-Yueh Tsai ◽  
Yi-Shao Lai ◽  
Chang-Lin Yeh ◽  
Rong-Sheng Chen
Keyword(s):  
Design Optimization ◽  
Structural Design ◽  
Wafer Level ◽  
Structural Design Optimization ◽  
Board Level

Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration

2004 ◽  
Vol 812 ◽  
Author(s):  
P. D. Persans ◽  
M. Ojha ◽  
R. J. Gutmann ◽  
J.-Q. Lu ◽  
A. Filin ◽  
...  
Keyword(s):  
Design Optimization ◽  
Optical Waveguides ◽  
Optical Interconnect ◽  
Device Performance ◽  
Wafer Level ◽  
Chip Fabrication ◽  
Cmos Compatible ◽  
Waveguide Fabrication ◽  
Optical Connection

AbstractOptical waveguides for three-dimensionally stacked chip fabrication technologies, in which optical connection between layers plays a central role, are described. CMOS-compatible approaches to optical via and waveguide fabrication are addressed. Detailed modeling is used for design optimization and also addresses how manufacturing variations from ideal design may affect device performance.

Design Optimization of Rotary-Wing Micro Air Vehicles

2006 ◽  
Vol 220 (6) ◽  
pp. 865-873 ◽  
Author(s):  
T T H Ng ◽  
G S B Leng
Keyword(s):  
Design Optimization ◽  
Design Methodology ◽  
Optimization Problem ◽  
Micro Air Vehicles ◽  
Robust Performance ◽  
And Control ◽  
The Given ◽  
Rotary Wing ◽  
Air Vehicles

In this paper, a new design methodology is introduced to automate the configuration layout design and geometric sizing of rotary-wing micro air vehicles (MAV). The objective of this design-optimization problem is to organize a given set of components and payloads such that the resulting flight vehicle has the most compact overall size and still fulfils the given physical and control constraints. Genetic algorithm (GA) is chosen as the optimization engine because of its proven robust performance. A detailed discussion is presented to explain how the rotary-wing MAV design problem can be formulated as a GA optimization problem. From the case study performed, it is demonstrated that the proposed methodology is able to achieve the design goal.

Build strategies for rapid manufacturing of components of varying complexity

2015 ◽  
Vol 21 (3) ◽  
pp. 340-350 ◽  
Author(s):  
Suryakumar Simhambhatla ◽  
K.P. Karunakaran
Keyword(s):  
Manufacturing Process ◽  
Design Methodology ◽  
Layered Manufacturing ◽  
Rapid Manufacturing ◽  
Geometric Complexity ◽  
Content Type ◽  
Material Deposition ◽  
Fixed Axis ◽  
Deposition Processes ◽  
Deposition Direction

Purpose – This paper aims to develop build strategies for rapid manufacturing of components of varying complexity with the help of illustration. Design/methodology/approach – The build strategies are developed using a hybrid layered manufacturing (HLM) setup. HLM, an automatic layered manufacturing process for metallic objects, combines the best features of two well-known and economical processes, viz., arc weld-deposition and milling. Depending on the geometric complexity of the object, the deposition and/or finish machining may involve fixed (3-axis) or variable axis (5-axis) kinematics. Findings – Fixed axis (3-axis) kinematics is sufficient to produce components free of undercuts and overhanging features. Manufacture of components with undercuts can be categorized into three methods, viz., those that exploit the inherent overhanging ability, those that involve blinding of the undercuts in the material deposition stage and those that involve variable axis kinematics for aligning the overhang with the deposition direction. Research limitations/implications – Although developed using the HLM setup, these generic concepts can be used in a variety of metal deposition processes. Originality/value – This paper describes the methodology for realizing undercut features of varying complexity and also chalks out the procedure for their manufacture with the help of case studies for each approach.

Leveraging wafer-level manufacturing process limitations to increase large-scale fused silica microlens array uniformity

2019 ◽  
Author(s):  
Raoul Kirner ◽  
Jeremy Béguelin ◽  
Wilfried Noell ◽  
Martin Eisner ◽  
Toralf Scharf ◽  
...  
Keyword(s):  
Manufacturing Process ◽  
Large Scale ◽  
Microlens Array ◽  
Fused Silica ◽  
Wafer Level

DESIGN OPTIMIZATION OF VERTICAL NEEDLE GEOMETRY FOR BUMP WAFER-LEVEL PROBING

2017 ◽  
Vol 41 (2) ◽  
pp. 313-326
Author(s):  
Te-Ching Hsiao ◽  
Shyh-Chour Huang ◽  
Hao-Yuan Chang
Keyword(s):  
Taguchi Method ◽  
Design Optimization ◽  
Cross Section ◽  
Orthogonal Array ◽  
Area Ratio ◽  
The Body ◽  
Wafer Level ◽  
Probe Length ◽  
Vertical Probe ◽  
Better Than

The purpose of this paper is mainly to develop a method to use the Taguchi method with the L18 (21 × 37) orthogonal array to obtain an optimal geometrical design of the vertical probing needle and base on various criteria to minimize the stress on the probing needle during wafer-level probing test. Furthermore, importance of the factors on the probing mark area ratio was also ranked. The results shows that as probe length, offset, and lower die gap increase, stress on the probing decrease. On the contrary, vertical probe bends decrease, stress on the probe increase. Furthermore, the body of vertical probe with rectangle cross-section is better than square and circular sharp.

Design Methodology for Manufacturing Automation System Reconfiguration

2010 ◽  
Author(s):  
Muhamad Arfauz A. Rahman ◽  
John P. T. Mo
Keyword(s):  
System Design ◽  
Manufacturing Process ◽  
Design Methodology ◽  
Manufacturing System ◽  
Value Added ◽  
Automation System ◽  
User Requirements ◽  
Reconfigurable Manufacturing ◽  
Manufacturing Automation ◽  
Design Engineers

The fluctuating customer demand especially in product requirements and system specifications these days requires system design engineers to configure and reconfigure the manufacturing system regularly. This paper elaborates a configuration study of a manufacturing system as well as illustrating basic design methodology of capturing user requirements and specifications for flexible reconfiguration in manufacturing automation system. The configuration study was conducted to accumulate various design outcomes from a given manufacturing process. The manufacturing process chosen for the study describes a simple yet easy to understand process in which groups of system design engineers were required to produce potential design configurations suitable for the process. The outcomes are then utilized to formulate a general rules for the configuration and reconfiguration methodology. The methodology presented is based on the steps and work descriptions provided by the user requirements and specifications. In order to simplify the configuration and reconfiguration works, method of capturing user requirements and specifications is required. The later idea of undergoing this research is to find suitable method to capture and manipulate the user requirements and specifications and later provide an optimum solution for the design of flexible and reconfigurable manufacturing automation system. Once completed, the methodology can be a value added advantage to the future of configuration and reconfiguration framework for the manufacturing automation system. In addition to that, the industry will benefit from the outcomes of the research by having the ability to optimize the system and minimizing the risk of investment of new system at a faster pace.

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