Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces for High-Temperature Electronics

2009 ◽  
Author(s):  
Stephen L. Hodson ◽  
Thiruvelu Bhuvana ◽  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
G. U. Kulkarni ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Stability ◽  
Interface Temperature ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
High Temperature Electronics ◽  
Compliant Joint ◽  
Cnt Arrays ◽  
Interface Structures ◽  
Interface Materials

Carbon nanotube (CNT) arrays are attractive thermal interface materials with high compliance and conductance that can remain effective over a wide temperature range. Here we study CNT interface structures in which free CNT ends are bonded using palladium hexadecanethiolate Pd(SC16H35)2 to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium bonded interfaces achieved thermal resistances near 10 mm2K/W and 5 mm2K/W, respectively.

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

2011 ◽  
Vol 133 (2) ◽  
Author(s):  
Stephen L. Hodson ◽  
Thiruvelu Bhuvana ◽  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
G. U. Kulkarni ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Stability ◽  
Interface Temperature ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
High Compliance ◽  
Compliant Joint ◽  
Cnt Arrays ◽  
Interface Structures ◽  
Interface Materials

Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16H35)2, to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.

Aluminum Foil/Carbon Nanotube Thermal Interface Materials

2007 ◽  
Author(s):  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
Timothy S. Fisher
Keyword(s):  
Carbon Nanotube ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Aluminum Foil ◽  
Close Packing ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Small Height ◽  
Cnt Arrays ◽  
Interface Materials

Vertically oriented carbon nanotube (CNT) arrays have been simultaneously synthesized at relatively low growth temperatures (i.e., < 700°C) on both sides of aluminum foil via plasma enhanced chemical vapor deposition. The resulting CNT arrays were highly dense, and the average CNT diameter in the arrays was approximately 10 nm, much smaller than in previous work. Also, the CNT arrays were smaller in height than the arrays in previous work. At moderate pressures, the aluminum foil/CNT material achieves resistances as low as 10 mm2·K/W for relatively smooth and flat interfaces, similar to previous work. However, the aluminum foil/CNT material performs relatively poor for less ideal, rougher interfaces presumably due to the small height and very close packing of CNTs that decreases the materials ability to fill interfacial voids and conform to the geometry of the mating surfaces. It is also possible that the aluminum foil was slightly stiffened during CNT growth (through hydrogen embrittlement), which could further reduce the conformability of the aluminum foil/CNT material.

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

Coating-boosted interfacial thermal transport for carbon nanotube array nano-thermal interface materials

Carbon ◽  
2019 ◽  
Vol 145 ◽  
pp. 725-733 ◽  
Author(s):  
Lin Qiu ◽  
Pu Guo ◽  
Qinyu Kong ◽  
Chong Wei Tan ◽  
Kun Liang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Transport ◽  
Thermal Interface Materials ◽  
Nanotube Array ◽  
Thermal Interface ◽  
Carbon Nanotube Array ◽  
Interface Materials

Architecting Three-Dimensional Networks in Carbon Nanotube Buckypapers for Thermal Interface Materials

2012 ◽  
Vol 116 (6) ◽  
pp. 3903-3909 ◽  
Author(s):  
Hongyuan Chen ◽  
Minghai Chen ◽  
Jiangtao Di ◽  
Geng Xu ◽  
Hongbo Li ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Prolonged Exposure ◽  
Silicon Substrates ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Ir Microscopy ◽  
Vertically Aligned ◽  
Interface Materials

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

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