Architecting Three-Dimensional Networks in Carbon Nanotube Buckypapers for Thermal Interface Materials

2012 ◽  
Vol 116 (6) ◽  
pp. 3903-3909 ◽  
Author(s):  
Hongyuan Chen ◽  
Minghai Chen ◽  
Jiangtao Di ◽  
Geng Xu ◽  
Hongbo Li ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

scholarly journals Novel three-dimensional carbon nanotube networks as high performance thermal interface materials

Carbon ◽  
2018 ◽  
Vol 132 ◽  
pp. 359-369 ◽  
Author(s):  
Qinyu Kong ◽  
Laurence Bodelot ◽  
Bérengère Lebental ◽  
Yu Dian Lim ◽  
Li Lynn Shiau ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
High Performance ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials ◽  
Carbon Nanotube Networks

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

Coating-boosted interfacial thermal transport for carbon nanotube array nano-thermal interface materials

Carbon ◽  
2019 ◽  
Vol 145 ◽  
pp. 725-733 ◽  
Author(s):  
Lin Qiu ◽  
Pu Guo ◽  
Qinyu Kong ◽  
Chong Wei Tan ◽  
Kun Liang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Transport ◽  
Thermal Interface Materials ◽  
Nanotube Array ◽  
Thermal Interface ◽  
Carbon Nanotube Array ◽  
Interface Materials

Fabrication of oriented hBN scaffolds for thermal interface materials

RSC Advances ◽  
2016 ◽  
Vol 6 (20) ◽  
pp. 16489-16494 ◽  
Author(s):  
Heng Shen ◽  
Chao Cai ◽  
Jing Guo ◽  
Zhenchao Qian ◽  
Ning Zhao ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Templating Method ◽  
Vertically Aligned ◽  
Interface Materials ◽  
Ice Templating

Three dimensional scaffolds of hBN microplatelets prepared by ice templating method are used to fabricate hBN/PDMS composites with vertically aligned hBN for thermal interface materials.

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Prolonged Exposure ◽  
Silicon Substrates ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Ir Microscopy ◽  
Vertically Aligned ◽  
Interface Materials

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

Vertically Aligned Multi-Walled Carbon Nanotube Arrays as Thermal Interface Materials and Measurement Technique

2005 ◽  
Author(s):  
Tao Tong ◽  
Yang Zhao ◽  
Lance Delzeit ◽  
Ali Kashani ◽  
Arun Majumdar ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Glass Plate ◽  
Thermal Conductance ◽  
Thermal Interface Materials ◽  
Optical Pump ◽  
Thermal Interface ◽  
Multi Walled Carbon Nanotube ◽  
Vertically Aligned ◽  
The Difference ◽  
Interface Materials

State-of-the-art thermal interface materials are briefly reviewed with an emphasis on the emerging trend of using carbon nanotubes to increase interface thermal performance. Vertically aligned multi-walled carbon nanotube (MWCNT) arrays were grown and applied as thermal interfacial enhancing materials. It is expected that the highly thermally conductive channels directly bridging the mating surfaces would significantly enhance the interface thermal conductance. We extended the all-optical pump and probe phase sensitive transient thermo-reflectance (PSTTR) method and used it to measure the interfacial properties of a three-layer sample of a vertically aligned MWCNT array grown on silicon (Si) substrate dry adhered to a glass plate. The dominant thermal resistance is identified as the dry adhered MWCNT-glass interface with a thermal conductance of ~5.9 × 104 W/m2·K, compared with MWCNT-Si interface of almost two orders of magnitude higher. Tentative explanations on the difference in the two interfaces and ways for future improvements are provided. The PSTTR measurement principle and issues are also discussed in the context.

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