Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers

Author(s):  
Josef L. Miler ◽  
Roger Flynn ◽  
Gamal Refai-Ahmed ◽  
Maxat Touzelbaev ◽  
Milnes David ◽  
...  

Two-phase microfluidic heat sinks promise high heat flux cooling at reduced pumping power compared to pumped liquid microchannel heat sinks. However, flow instabilities caused by bubble nucleation and expansion severely reduce heat transfer performance of two-phase microfluidic heat sinks. This study probes the governing physics of bubble nucleation and expansion by comparing the effects of pulsed heating to steady-state heating in a single microchannel. Pulsed heating at 8 Hz causes an increase in the average hotspot temperature of as much as 8°C compared to steady-state heating. Upstream and downstream temperature response does not vary significantly between heating conditions. The results correspond well with thin-film evaporation models for bubble growth. This study provides insight for designing two-phase microfluidic cooling system subjected to transient hotspots.

Author(s):  
Rongliang Zhou ◽  
Juan Catano ◽  
Tiejun Zhang ◽  
John T. Wen ◽  
Greg J. Michna ◽  
...  

Steady-state modeling and analysis of a two-loop cooling system for high heat flux removal applications are studied. The system structure proposed consists of a primary pumped loop and a vapor compression cycle (VCC) as the secondary loop to which the pumped loop rejects heat. The pumped loop consists of evaporator, condenser, pump, and bladder liquid accumulator. The pumped loop evaporator has direct contact with the heat generating device and CHF must be higher than the imposed heat fluxes to prevent device burnout. The bladder liquid accumulator adjusts the pumped loop pressure level and, hence, the subcooling of the refrigerant to avoid pump cavitation and to achieve high critical heat flux (CHF) in the pumped loop evaporator. The vapor compression cycle of the two-loop cooling system consists of evaporator, liquid accumulator, compressor, condenser and electronic expansion valve. It is coupled with the pumped loop through a fluid-to-fluid heat exchanger that serves as both the vapor compression cycle evaporator and the pumped loop condenser. The liquid accumulator of the vapor compression cycle regulates the cycle active refrigerant charge and provides saturated vapor to the compressor at steady state. The heat exchangers are modeled with the mass, momentum, and energy balance equations. Due to the projected incorporation of microchannels in the pumped loop to enhance the heat transfer in heat sinks, the momentum equation, rarely seen in previous refrigeration system modeling efforts, is included to capture the expected significant microchannel pressure drop witnessed in previous experimental investigations. Electronic expansion valve, compressor, pump, and liquid accumulators are modeled as static components due to their much faster dynamics compared with heat exchangers. The steady-state model can be used for static system design that includes determining the total refrigerant charge in the vapor compression cycle and the pumped loop to accommodate the varying heat load, sizing of various components, and parametric studies to optimize the operating conditions for a given heat load. The effect of pumped loop pressure level, heat exchangers geometries, pumped loop refrigerant selection, and placement of the pump (upstream or downstream of the evaporator) are studied. The two-loop cooling system structure shows both improved coefficient of performance (COP) and CHF overthe single loop vapor compression cycle investigated earlier by authors for high heat flux removal.


Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.


2019 ◽  
Vol 163 ◽  
pp. 114338 ◽  
Author(s):  
Fengze Hou ◽  
Wenbo Wang ◽  
Hengyun Zhang ◽  
Cheng Chen ◽  
Chuan Chen ◽  
...  

1998 ◽  
Vol 120 (2) ◽  
pp. 365-370 ◽  
Author(s):  
K. H. Haddad ◽  
F. B. Cheung

Steady-state nucleate boiling heat transfer experiments in saturated and subcooled water were conducted. The heating surface was a 0.305 m hemispherical aluminum vessel heated from the inside with water boiling on the outside. It was found that subcooling had very little effect on the nucleate boiling curve in the high heat flux regime where latent heat transport dominated. On the other hand, a relatively large effect of subcooling was observed in the low-heat-flux regime where sensible heat transport was important. Photographic records of the boiling phenomenon and the bubble dynamics indicated that in the high-heat-flux regime, boiling in the bottom center region of the vessel was cyclic in nature with a liquid heating phase, a bubble nucleation and growth phase, a bubble coalescence phase, and a large vapor mass ejection phase. At the same heat flux level, the size of the vapor masses was found to decrease from the bottom center toward the upper edge of the vessel, which was consistent with the increase observed in the critical heat flux in the flow direction along the curved heating surface.


2015 ◽  
Vol 3 (4) ◽  
pp. 369-391 ◽  
Author(s):  
Nicolas Lamaison ◽  
Jackson Braz Marcinichen ◽  
S. Szczukiewicz ◽  
John R. Thome ◽  
P. Beucher

2016 ◽  
Vol 138 (4) ◽  
Author(s):  
Xuefei Han ◽  
Andrei Fedorov ◽  
Yogendra Joshi

In the first part of this paper, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps is presented. In the second part, complimentary to the literature review, new results of subcooled flow boiling of water through a micropin-fin array heat sink with outlet pressure below atmospheric are presented. A 200 μm high microgap device design was tested, with a longitudinal pin pitch of 225 μm, a transverse pitch of 135 μm, and a diameter of 90 μm, respectively. Tested mass fluxes ranged from 1351 to 1784  kg/m2s, and effective heat flux ranged from 198 to 444 W/cm2 based on the footprint surface area. The inlet temperature varied from 6 to 12 °C, and outlet pressure ranged from 24 to 36 kPa. The two-phase heat transfer coefficient showed a decreasing trend with increasing heat flux. High-speed visualizations of flow patterns revealed a triangular wake after bubble nucleation. Flow oscillations were seen and discussed.


Author(s):  
Matt Connors

Current blade processors need air cooling solutions that dissipate 100–300 watts with heat sinks that are less than 30 mm high. In order to cool these processors, the heat sink base has to grow in length and width to compensate for the lack of available height. As these dimensions grow, decreasing the base spreading of the heat sink becomes an important factor is decreasing the overall resistance of the heat sink. A vapor chamber used as a substitute to common copper or aluminum as the base of the heat sink can increase performance by 20–25%. A vapor chamber is a two phase heat transport system that significantly reduces the spreading resistance in applications where there is a high heat flux processor coupled with a large heat sink. In this paper, a CFD model will be constructed to predict the performance gains realized by using a vapor chamber base in lieu of a copper or aluminum base. These predictions will then be experimentally tested to confirm the modeling parameters and the actual measured thermal performance of the heat sink. By utilizing vapor chambers in heat sink design, thermal engineers will gain valuable heat sink performance within the constraints imposed by the blade system architecture.


Author(s):  
Farhad Saffaraval ◽  
Amir Jokar

The objective of this study is to experimentally explore thermodynamic performance of R245fa, as a low-pressure and environmentally-friendly refrigerant, in a microchannel heat exchanger. This heat exchanger is used in an electronics cooling application with high-power density. Due to the large amount of latent heat that is released during evaporation process, the two-phase microchannel coolers are able to remove much more energy compared to single-phase cooling systems. In this study, R245fa is used as the working fluid in a refrigeration pump loop that mainly includes an evaporator, a condenser, a refrigerant pump, and a pressure regulator valve. The goal is to obtain optimal mass flow rates and system pressures while the temperatures in evaporator and condenser are kept constant for specific conditions. The results obtained from this study are then compared to the results previously obtained for water as the working fluid in a similar cooling system. It is expected the evaporative cooling through the microchannel heat exchanger be a viable and effective solution, especially for higher heat flux applications.


2019 ◽  
Vol 196 ◽  
pp. 00021
Author(s):  
Karapet Eloyan ◽  
Alexey Kreta ◽  
Egor Tkachenko

One of the promising ways of removing large heat fluxes from the surface of heat-stressed elements of electronic devices is the use of evaporating thin layer of liquid film, moving under the action of the gas flow in a flat channel. In this work, a prototype of evaporative cooling system for high heat flux removal with forced circulation of liquid and gas coolants with controlled pulsation, capable to remove heat flux of up to 1,5 kW/cm2 and higher was presented. For the first time the regime with controlled pulsation is used. Due to pulsations, it is possible to achieve high values of critical heat flux due to a brief increase in the flow rate of the liquid, which allows to "wash off" large dry spots and prevent the occurrence of zones of flow and drying.


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