Enhancement of Condensation Heat Transfer in Micro Systems

2009 ◽  
Author(s):  
Atsushi Tokunaga ◽  
Gyoko Nagayama ◽  
Takaharu Tsuruta
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
High Performance ◽  
Cooling System ◽  
High Vacuum ◽  
Condensation Heat Transfer ◽  
Heat Diffusion ◽  
High Heat Flux ◽  
Dropwise Condensation ◽  
Micro Systems

Thermal management becomes a serious concern in computer system. CPU chips are placed into small spaces with difficulty in heat diffusion. This promotes many challenges in the field of thermal management of electronics to maintain the desirable operating temperature. In order to realize the enhancement of dissipation of high heat flux from electronic components, a lot of investigations have been carried out on new cooling technology using phase change phenomena. Since the micro condenser is required in the cooling system, we are directing our attention to the enhancement of condensation heat transfer in the micro system. This study focuses on high performance of dropwise condensation heat transfer due to its small conduction resistance. In the micro systems, the interface phenomena play an important role in heat transfer. We have done dropwise condensation experiments in a high vacuum chamber system to get precise information about the vapor-liquid interface transport phenomena. Surface temperature transients are measured directly with the thin film thermocouples fabricated on the condensing surface.

Dropwise Condensation on Carbon Steel Surface

2016 ◽  
Author(s):  
Fangyu Cao ◽  
Sean Hoenig ◽  
Chien-hua Chen
Keyword(s):  
Heat Transfer ◽  
Carbon Steel ◽  
Power Plants ◽  
Heat Dissipation ◽  
Low Cost ◽  
Condensation Heat Transfer ◽  
Working Fluid ◽  
High Heat Flux ◽  
Dropwise Condensation ◽  
Two Phase

The increasing demand of heat dissipation in power plants has pushed the limits of current two-phase thermal technologies such as heat pipes and vapor chambers. One of the most obvious areas for thermal improvement is centered on the high heat flux condensers including improved evaporators, thermal interfaces, etc, with low cost materials and surface treatment. Dropwise condensation has shown the ability to increase condensation heat transfer coefficient by an order of magnitude over conventional filmwise condensation. Current dropwise condensation research is focused on Cu and other special metals, the cost of which limits its application in the scale of commercial power plants. Presented here is a general use of self-assembled monolayer coatings to promote dropwise condensation on low-cost steel-based surfaces. Together with inhibitors in the working fluid, the surface of condenser is protected by hydrophobic coating, and the condensation heat transfer is promoted on carbon steel surfaces.

Spot Cooling Using Electrowetting-Controlled Thin Film Heat Transfer

2012 ◽  
Author(s):  
Jiangtao Cheng ◽  
Chung-Lung Chen
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Management ◽  
High Efficiency ◽  
Cooling System ◽  
Hot Spot ◽  
High Heat Flux ◽  
Electrowetting On Dielectric ◽  
Droplet Transport

We report an electrowetting-controlled cooling system with site-specific treatments on the heat source (evaporator or hot spot) surfaces. Electrowetting-on-dielectric (EWOD) has great potential in thermal management because EWOD-driven droplet transport has unique characteristics of prompt response, low power consumption and programmable paths without the need for any mechanical moving parts. Prompt and fast droplet transport is necessary for adaptive and active cooling of high heat flux targets. Using a multi-channel DC/AC control system, we carried out sequenced activation of AC voltages on coplanar electrodes and transmitted a droplet to the spot target along a programmable path. With high positioning accuracy at the chip level, we have successfully transmitted a water droplet of 15 μL at speeds as high as ∼10 cm/s. We further improved electrowetting cooling performance by coating a fine copper screen on the cooling targets. The capillarity associated with the copper screen facilitates the delivered droplets automatically spreading and clinging to the target surfaces. As a result, heat transfer is in the more efficient form of filmwise evaporation at the evaporator sites. To maintain a thin film with proper thickness on the hot spots, we implemented EWOD-assisted droplet splitting and merging to precisely control the droplet volume to avoid fluid flooding (accumulation) on the hot spot surfaces. Our investigation indicates that thin-film evaporation is a high-efficiency heat transfer mechanism on a hydrophilized hot spot surface. Based on EWOD technique with surface treatments, the superheat on a hot spot of 4mm × 4mm was maintained well below 30°C even when the heat flux reached as high as 80W/cm2. The closed loop of this novel thermal management system can potentially function as a wickless vapor chamber or heat pipe with enhanced heat dissipation capabilities.

scholarly journals Numerical Evaluation of a HVAC System Based on a High-Performance Heat Transfer Fluid

Energies ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3298
Author(s):  
Gianpiero Colangelo ◽  
Brenda Raho ◽  
Marco Milanese ◽  
Arturo de Risi
Keyword(s):  
Heat Transfer ◽  
High Performance ◽  
Cooling System ◽  
Electrical Energy ◽  
Simulation Software ◽  
Heat Transfer Fluid ◽  
Hvac System ◽  
Dynamic Simulations ◽  
Heating And Cooling ◽  
The University

Nanofluids have great potential to improve the heat transfer properties of liquids, as demonstrated by recent studies. This paper presents a novel idea of utilizing nanofluid. It analyzes the performance of a HVAC (Heating Ventilation Air Conditioning) system using a high-performance heat transfer fluid (water-glycol nanofluid with nanoparticles of Al2O3), in the university campus of Lecce, Italy. The work describes the dynamic model of the building and its heating and cooling system, realized through the simulation software TRNSYS 17. The use of heat transfer fluid inseminated by nanoparticles in a real HVAC system is an innovative application that is difficult to find in the scientific literature so far. This work focuses on comparing the efficiency of the system working with a traditional water-glycol mixture with the same system that uses Al2O3-nanofluid. The results obtained by means of the dynamic simulations have confirmed what theoretically assumed, indicating the working conditions of the HVAC system that lead to lower operating costs and higher COP and EER, guaranteeing the optimal conditions of thermo-hygrometric comfort inside the building. Finally, the results showed that the use of a nanofluid based on water-glycol mixture and alumina increases the efficiency about 10% and at the same time reduces the electrical energy consumption of the HVAC system.

A Heat Transfer Model of Dropwise Condensation Underneath a Horizontal Substrate

2011 ◽  
Vol 199-200 ◽  
pp. 1604-1608
Author(s):  
Yun Fu Chen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Contact Angle ◽  
Fractal Model ◽  
Condensation Heat Transfer ◽  
Droplet Growth ◽  
Transfer Model ◽  
Dropwise Condensation ◽  
Small Contact Angle ◽  
Horizontal Substrate

For finding influence of the condensing surface to dropwise condensation heat transfer, a fractal model for dropwise condensation heat transfer has been established based on the self-similarity characteristics of droplet growth at various magnifications on condensing surfaces with considering influence of contact angle to heat transfer. It has been shown based on the proposed fractal model that the area fraction of drops decreases with contact angle increase under the same sub-cooled temperature; Varying the contact angle changes the drop distribution; higher the contact angle, lower the departing droplet size and large number density of small droplets; dropwise condensation translates easily to the filmwise condensation at the small contact angle ;the heat flux increases with the sub-cooled temperature increases, and the greater of contact angle, the more heat flux increases slowly.

Development of Cooling System for a Large Area at High Heat Flux by Using Flow Boiling in Narrow Channels

2009 ◽  
Author(s):  
Shinichi Miura ◽  
Yukihiro Inada ◽  
Yasuhisa Shinmoto ◽  
Haruhiko Ohta
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Mass Velocity ◽  
Cooling System ◽  
Volumetric Flow Rate ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Heated Channel

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10−5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

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