A Capability to Model Crack Initiation and Growth in Solder Joints

2009 ◽  
Author(s):  
Mike Neilsen ◽  
Paul Vianco ◽  
Alice Kilgo ◽  
Elizabeth Holm
Keyword(s):  
Finite Elements ◽  
Crack Initiation ◽  
Solder Joints ◽  
Acceleration Factor ◽  
Element Analysis ◽  
Damage Evolution Equation ◽  
Thermal Mechanical Fatigue ◽  
Modeling Approach ◽  
Geometric Effects ◽  
Model Crack

A new capability to model both crack initiation and growth in eutectic Sn-Pb solder joints was developed and implemented into finite element analysis codes. Two significant developments were needed to create this new capability. First, an ability to accelerate the simulations such that the effects of hundreds or thousands of thermal cycles could be modeled in a reasonable amount of time was needed. This was accomplished by applying a user prescribed acceleration factor to specific terms in the solder model’s damage evolution equation; then, the damage generated by an acceleration factor of cycles could be captured by the numerical simulation of a single thermal cycle. Second, an ability to capture the geometric effects of crack initiation and growth was needed. This was accomplished by replacing material in finite elements that had met the cracking failure criterion with very flexible elastic material. This diffuse crack modeling approach with local finite elements is known to generate mesh-dependent solutions. However, mesh refinement studies revealed that for thermal mechanical fatigue simulations, the mesh dependency is small and has a small effect on predictions for cycles to generate an electrical open. The new crack modeling approach will be described. Finally, crack predictions are compared with experimental observations.

scholarly journals Unified Creep Plasticity Damage (UCPD) Model for Solder

2011 ◽  
Author(s):  
Michael Neilsen ◽  
Paul Vianco
Keyword(s):  
Finite Elements ◽  
Crack Initiation ◽  
Evolution Equation ◽  
Damage Evolution ◽  
Acceleration Factor ◽  
Element Analysis ◽  
Damage Evolution Equation ◽  
Thermal Mechanical Fatigue ◽  
Size Dependent ◽  
Element Size

A unified creep plasticity damage (UCPD) model for Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model’s damage evolution equation and an empirical Coffin-Manson relationship for solder fatigue. Next, two significant developments were needed to model crack initiation and growth in solder joints. First, an ability to accelerate the simulations such that the effects of hundreds or thousands of thermal cycles could be modeled in a reasonable amount of time was needed. This was accomplished by applying a user prescribed acceleration factor to the damage evolution; then, damage generated by an acceleration factor of cycles could be captured by the numerical simulation of a single thermal cycle. Second, an ability to capture the geometric effects of crack initiation and growth was needed. This was accomplished by replacing material in finite elements that had met the cracking failure criterion with very flexible elastic material. This diffuse crack modeling approach with local finite elements is known to generate mesh dependent solutions. However, introduction of an element size dependent term into the damage evolution equation was found to be effective in controlling mesh dependency. Finally, experimentally observed cracks in a typical solder joint subjected to thermal mechanical fatigue are compared with model predictions.

scholarly journals Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

2013 ◽  
Author(s):  
Michael Neilsen ◽  
Paul Vianco
Keyword(s):  
Finite Element ◽  
Solder Joints ◽  
Element Analysis ◽  
Damage Evolution Equation ◽  
Thermal Mechanical Fatigue ◽  
Model Predictions ◽  
Solder Fatigue ◽  
Solder Joint Fatigue ◽  
The Relationship ◽  
Model Crack

A unified creep plasticity damage (UCPD) model for Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model’s damage evolution equation and an empirical Coffin-Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries.

UCPD Model for Pb-Free Solder

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
Michael K. Neilsen ◽  
Paul T. Vianco
Keyword(s):  
Finite Element ◽  
Solder Joints ◽  
Element Analysis ◽  
Damage Evolution Equation ◽  
Thermal Mechanical Fatigue ◽  
Model Predictions ◽  
Solder Fatigue ◽  
Solder Joint Fatigue ◽  
Free Solder ◽  
The Relationship

A unified creep plasticity damage (UCPD) model for eutectic Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model's damage evolution equation and an empirical Coffin–Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries.

scholarly journals Low-Cycle Fatigue Crack Initiation Simulation and Life Prediction of Powder Superalloy Considering Inclusion-Matrix Interface Debonding

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4018
Author(s):  
Shuming Zhang ◽  
Yuanming Xu ◽  
Hao Fu ◽  
Yaowei Wen ◽  
Yibing Wang ◽  
...  
Keyword(s):  
Finite Element ◽  
Crack Initiation ◽  
Life Prediction ◽  
Damage Mechanics ◽  
Low Cycle Fatigue ◽  
Fatigue Crack Initiation ◽  
Fatigue Loading ◽  
Interface Debonding ◽  
Damage Evolution Equation ◽  
Finite Element Software

From the perspective of damage mechanics, the damage parameters were introduced as the characterizing quantity of the decrease in the mechanical properties of powder superalloy material FGH96 under fatigue loading. By deriving a damage evolution equation, a fatigue life prediction model of powder superalloy containing inclusions was constructed based on damage mechanics. The specimens containing elliptical subsurface inclusions and semielliptical surface inclusions were considered. The CONTA172 and TARGE169 elements of finite element software (ANSYS) were used to simulate the interfacial debonding between the inclusions and matrix, and the interface crack initiation life was calculated. Through finite element modeling, the stress field evolution during the interface debonding was traced by simulation. Finally, the effect of the position and shape size of inclusions on interface debonding was explored.

Plastic Slip and Early Stage of Fatigue Damage in Polycrystals: Comparison between Experiments and Crystal Plasticity Finite Elements Simulations

2014 ◽  
Vol 891-892 ◽  
pp. 1711-1716 ◽  
Author(s):  
Loic Signor ◽  
Emmanuel Lacoste ◽  
Patrick Villechaise ◽  
Thomas Ghidossi ◽  
Stephan Courtin
Keyword(s):  
Fatigue Crack ◽  
Finite Elements ◽  
Crack Initiation ◽  
Fatigue Damage ◽  
Crystal Plasticity ◽  
Early Stage ◽  
Low Cycle Fatigue ◽  
Fatigue Cracks ◽  
Fatigue Crack Initiation ◽  
Plastic Slip

For conventional materials with solid solution, fatigue damage is often related to microplasticity and is largely sensitive to microstructure at different scales concerning dislocations, grains and textures. The present study focuses on slip bands activity and fatigue crack initiation with special attention on the influence of the size, the morphology and the crystal orientation of grains and their neighbours. The local configurations which favour - or prevent - crack initiation are not completely identified. In this work, the identification and the analysis of several crack initiation sites are performed using Scanning Electron Microscopy and Electron Back-Scattered Diffraction. Crystal plasticity finite elements simulation is employed to evaluate local microplasticity at the scale of the grains. One of the originality of this work is the creation of 3D meshes of polycrystalline aggregates corresponding to zones where fatigue cracks have been observed. 3D data obtained by serial-sectioning are used to reconstruct actual microstructure. The role of the plastic slip activity as a driving force for fatigue crack initiation is discussed according to the comparison between experimental observations and simulations. The approach is applied to 316L type austenitic stainless steels under low-cycle fatigue loading.

Influence of Interference and Clamping on Fretting Fatigue in Single Rivet-Row Lap Joints

2000 ◽  
Vol 123 (4) ◽  
pp. 686-698 ◽  
Author(s):  
K. Iyer ◽  
C. A. Rubin ◽  
G. T. Hahn
Keyword(s):  
Crack Initiation ◽  
Three Dimensional ◽  
Fretting Fatigue ◽  
Cyclic Stress ◽  
Lap Joints ◽  
Element Analysis ◽  
Out Of Plane ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Fretting Damage

Primary fretting fatigue variables such as contact pressure, slip amplitude and bulk cyclic stresses, at and near the contact interface between the rivet shank and panel hole in a single rivet-row, 7075-T6 aluminum alloy lap joint are presented. Three-dimensional finite element analysis is applied to evaluate these and the effects of interference and clamping stresses on the values of the primary variables and other overall measures of fretting damage. Two rivet geometries, non-countersunk and countersunk, are considered. Comparison with previous evaluations of the fretting conditions in similar but two-dimensional connections indicates that out-of-plane movements and attending effects can have a significant impact on the fatigue life of riveted connections. Variations of the cyclic stress range and other proponents of crack initiation are found to peak at distinct locations along the hole-shank interface, making it possible to predict crack initiation locations and design for extended life.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

A Highly Accelerated Thermal Cycling (HATC) Test for Solder Reliability Assessment in BGA Packages

2007 ◽  
Author(s):  
X. Long ◽  
I. Dutta ◽  
R. Guduru ◽  
R. Prasanna ◽  
M. Pacheco
Keyword(s):  
Thermal Cycling ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Inelastic Strain ◽  
Fatigue Reliability ◽  
Element Analysis ◽  
Mechanical Cycling ◽  
Experimental Apparatus ◽  
Dependent Strain ◽  
Accelerated Thermal Cycling

A thermo-mechanical loading system, which can superimpose a temperature and location dependent strain on solder joints, is proposed in order to conduct highly accelerated thermal-mechanical cycling (HATC) tests to assess thermal fatigue reliability of Ball Grid Array (BGA) solder joints in microelectronics packages. The application of this temperature and position dependent strain produces generally similar loading modes (shear and tension) encountered by BGA solder joints during service, but substantially enhances the inelastic strain accumulated during thermal cycling over the same temperature range as conventional ATC (accelerated thermal cycling) tests, thereby leading to a substantial acceleration of low-cycle fatigue damage. Finite element analysis was conducted to aid the design of experimental apparatus and to predict the fatigue life of solder joints in HATC testing. Detailed analysis of the loading locations required to produce failure at the appropriate joint (next to the die-edge ball) under the appropriate tension/shear stress partition are presented. The simulations showed that the proposed HATC test constitutes a valid methodology for further accelerating conventional ATC tests. An experimental apparatus, capable of applying the requisite loads to a BGA package was constructed, and experiments were conducted under both HATC and ATC conditions. It is shown that HATC proffers much reduced cycling times compared to ATC.

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