Thermal Modeling of Memory Access Operations in Microprocessors

2016 ◽  
Author(s):  
Ratnesh Raj ◽  
Daipayan Sarkar ◽  
Ankur Jain
Keyword(s):  
Temperature Rise ◽  
Large Fraction ◽  
Single Layer ◽  
Memory Access ◽  
Electrical Performance ◽  
Transient Temperature ◽  
Memory Chip ◽  
Thermal Phenomenon ◽  
Transient Thermal ◽  
3D Memory

A large fraction of energy consumed in modern microelectronic devices and systems is taken up by memory access operations, which is expected to cause significant temperature rise. Since memory access operations are very short in duration, this is expected to inherently be a transient thermal phenomenon. Despite the critical importance of thermal management in microelectronics, not much work exists on understanding the nature of thermal transport during memory access operations. In this work, a mathematical model to predict the transient temperature rise within a 3D memory chip is presented. Most heat-generating memory access processes occur over a short timescale for which the thermal penetration depth is shorter than the die thickness. This enables the modeling of such processes independent of the nature of chip cooling by treating the chip as a semi-infinite medium. A semi-infinite Green’s function model is developed for one bank of memory on a single layer of a block of the memory chip. This model is validated against finite element simulation results. Validation is also carried out by comparison of the model against the analytical solution for a limiting case. The analytical model is used to analyze transient thermal effects of various memory access processes for multiple banks. These results will help develop an understanding of optimal layouts and processes for 3D memory chips, eventually leading to co-design tools that simultaneously improve thermal and electrical performance of 3D memory chips.

Multiscale Transient Thermal Analysis of Microelectronics

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Banafsheh Barabadi ◽  
Satish Kumar ◽  
Valeriy Sukharev ◽  
Yogendra K. Joshi
Keyword(s):  
Temperature Rise ◽  
Flip Chip ◽  
Computational Cost ◽  
Computational Effort ◽  
Heat Fluxes ◽  
Transient Temperature ◽  
Multiscale Approach ◽  
Fe Model ◽  
Power Sources ◽  
Transient Thermal

In a microelectronic device, thermal transport needs to be simulated on scales ranging from tens of nanometers to hundreds of millimeters. High accuracy multiscale models are required to develop engineering tools for predicting temperature distributions with sufficient accuracy in such devices. A computationally efficient and accurate multiscale reduced order transient thermal modeling methodology was developed using a combination of two different approaches: “progressive zoom-in” method and “proper orthogonal decomposition (POD)” technique. The capability of this approach in handling several decades of length scales from “package” to “chip components” at a considerably lower computational cost, while maintaining satisfactory accuracy was demonstrated. A flip chip ball grid array (FCBGA) package was considered for demonstration. The transient temperature and heat fluxes calculated on the top and bottom walls of the embedded chip at the package level simulations are employed as dynamic boundary conditions for the chip level simulation. The chip is divided into ten function blocks. Randomly generated dynamic power sources are applied in each of these blocks. The temperature rise in the different layers of the chip calculated from the multiscale model is compared with a finite element (FE) model. The close agreement between two models confirms that the multiscale approach can predict temperature rise accurately for scenarios corresponding to different power sources in functional blocks, without performing detailed FE simulations, which significantly reduces computational effort.

The Micro-Temperatures of the Peaks and Valleys of Sliding Rough Surfaces

2018 ◽  
Vol 883 ◽  
pp. 53-62 ◽  
Author(s):  
Shin Yuh Chern ◽  
Jeng Haur Horng ◽  
Cheng Han Tsai ◽  
Hung Jung Tsai
Keyword(s):  
Thermal Conductivity ◽  
Temperature Rise ◽  
Rough Surfaces ◽  
Chemical Processes ◽  
The Finite Element Method ◽  
Precision Control ◽  
Sliding Speed ◽  
Surface Failure ◽  
Contact Surfaces ◽  
Transient Thermal

The surface micro-temperature of sliding, rough bodies is an important factor affecting contact properties, such as chemical reactions of automatic injectors for medicine and chemical processes and surface failure of micro-and macro-devices. In this work, the Finite Element Method is used to analyze the micro-temperature of the peaks and valleys of multiplying asperity sliding contact surfaces. The affecting parameters include pressure, roughness, sliding speed, Peclet number, and thermal conductivity of rough surfaces. Analysis results showed that the effects of the studied parameters are different to those of peak and valley temperatures. While pressure increased, the increasing rate of the temperature rise parameter of valleys was larger than those of peaks. The temperature rise of peaks increased as roughness increased. On the contrary, the temperature rise of valleys decreased as roughness increased. Sliding speed and thermal conductivity played the most important roles in affecting the maximum micro-temperature rise. The temperature rise difference between peaks and valleys was almost proportional to thermal conductivity, and was inversely proportional to sliding speed for all cases. This transient thermal analysis enables precision control of interface micro-temperature for micro-moving devices.

Study on the transient temperature distribution of new conical friction plate under sliding friction

2021 ◽  
pp. 095440702110696
Author(s):  
Yanzhong Wang ◽  
Peng Liu
Keyword(s):  
Temperature Distribution ◽  
Temperature Gradient ◽  
Temperature Rise ◽  
Friction Surface ◽  
Sliding Friction ◽  
Conical Surface ◽  
Transient Temperature ◽  
Radial Temperature Gradient ◽  
Radial Temperature ◽  
Friction Plate

Conical friction surface is a novel configuration for friction plate in transmission. Numerical FEA models for transient heat transfer and distribution of conically grooved friction plate have been established to investigate the thermal behavior of the conical surface with different configurations. The finite element method is used to obtain the numerical solution, the temperature test data of conical surface are obtained by the friction test rig. In order to study and compare the temperature behavior of conically grooved friction plate, several three-dimensional transient temperature models are established. The heat generated on the friction interface during the continuous sliding process is calculated. Two different pressure conditions were defined to evaluate the influence of different load conditions on temperature rise and the effects of conical configuration parameters on surface temperature distribution are investigated. The results show that the radial temperature gradient on conical friction surface is obvious. The uniform pressure condition could be used when evaluating the temperature rise of conically grooved friction plate. The increase of the cone height could improve the radial temperature gradient of the conically grooved friction plate.

Thermal-Mechanical Contact of a Sphere on a Layered Surface

2010 ◽  
Author(s):  
Wenping Song ◽  
Andrey Ovcharenko ◽  
Guangyu Zhang ◽  
Frank E. Talke
Keyword(s):  
Layer Thickness ◽  
Coating Thickness ◽  
Temperature Rise ◽  
Material Properties ◽  
Mechanical Deformation ◽  
The Other ◽  
Mechanical Contact ◽  
Other Hand ◽  
Transient Thermal

The effect of coating thickness is investigated during transient thermal-mechanical contact between a sphere and a layered surface. The range of coating thicknesses studied was from 0.001≤t/R≤0.1, where t is the coating thickness and R is the radius of the contacting sphere. It was found that for the range of coating thickness and material properties investigated, the coating thickness has only a small effect on the mechanical deformation of the interface. On the other hand, the layer thickness has a large effect on the temperature rise of the interface.

The Transient Thermal Stress and Deflection of a Brake

2005 ◽  
Author(s):  
Yuan Mao Huang ◽  
Shih-Han Chen
Keyword(s):  
Thermal Stress ◽  
Thermal Gradient ◽  
Transient Temperature ◽  
Outer Diameter ◽  
The Finite Element Method ◽  
Dimensional Model ◽  
Uniform Temperature ◽  
Principal Stresses ◽  
Disk Brake ◽  
Transient Thermal

This study utilizes the finite element method with a two-dimensional model of a disk brake and investigates its distributions of the transient temperature, thermal gradient, heat flux, thermal stress and deflection due to friction. A specified initial uniform temperature of the disk is used to simulate heat transfer of the disk. Since the temperature of the disk brake inboard is higher than that of the disk brake outboard, the deflection of the disk brake inboard is larger than those at other locations. The maximum deflection of 0.4 mm occurs at the outer diameter of the disk inboard. The disk expands radial outward and bends from the disk brake inboard toward the disk brake outboard. The coning angle between the disk outboard surface and the original vertical disk outboard surface is 0.39°, which is comparable with the existing datum of 0.35°. The principal stresses at the lower mounting location are 184 MPa and 236 MPa. The calculated safety factor is 1.27 based on the modified Mohr theory used for brittle materials, and this disk brake is reliable.

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