scholarly journals Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package

2011 ◽  
Author(s):  
Nuwan Rodrigo ◽  
Saeed Ghalambor ◽  
Abdolhossein Haji-Sheikh ◽  
Dereje Agonafer
Keyword(s):  
Thermal Model ◽  
Three Dimensional ◽  
Conduction Model ◽  
Die Attach ◽  
Die Stacking ◽  
Solder Balls ◽  
Steady State Heat ◽  
The Cost ◽  
Analytical Thermal Model ◽  
3D Package

The need for more functions in a single device has led to die stacking architecture. Although the number of die increases further to accommodate package functionality, the overall package dimensions have not increased; they have stayed the same or decreased (roughly 1.4mm). If this trend continues, in order to keep the same package height, alternate stacking structures need to be investigated. One such opportunity is the spacerless die stacking architecture. Using dummy silicon spacers add to the cost of a package and do not increase the memory or functionality, although they serve as enablers for wire bonding of same size die. Spacerless architecture reduces the package height by eliminating spacers or dummy die. This allows for an increased number of active die to be stacked directly on one another without changing the overall package height, or in some cases reducing the package height. Previous work [1] has been done to develop a steady-state heat conduction model in a two-layer body. This analytical model will be extended to the current multi-layered generic spacerless three dimensional packages (3DP) enabling the computation of temperature for uniform or non-uniform powered die. The computation will account for the contact resistance created by the die attach and the solder balls. Finally validation of this analytically developed model will be carried out with a numerical model.

scholarly journals An analytical thermal model for three-dimensional integrated circuits with integrated micro-channel cooling

2017 ◽  
Vol 21 (4) ◽  
pp. 1601-1606 ◽  
Author(s):  
Kang-Jia Wang ◽  
Hong-Chang Sun ◽  
Zhong-Liang Pan
Keyword(s):  
Integrated Circuits ◽  
Thermal Model ◽  
Three Dimensional ◽  
Mathematical Software ◽  
Software Comparison ◽  
Proposed Model ◽  
Micro Channels ◽  
Computer Fluid Dynamics ◽  
Analytical Thermal Model ◽  
Maximal Relative Error

An analytical thermal model is developed for N-die stacked chips with integrated micro-channels cooling. The model is implemented with some mathematical software. Comparison of the temperature predicted by the proposed model with some computer fluid dynamics software numerical results show excellent agreement, and the maximal relative error is less than 4.0%.

Analytical Modeling of On-Chip Hotspot Cooling Using Silicon Thermoelectric Microcoolers

2006 ◽  
Author(s):  
Peng Wang ◽  
Avram Bar-Cohen ◽  
Bao Yang
Keyword(s):  
Thermal Management ◽  
Joule Heating ◽  
Thermal Model ◽  
Analytical Modeling ◽  
Three Dimensional ◽  
Chip Thickness ◽  
The Novel ◽  
Conventional Cooling ◽  
On Chip ◽  
Analytical Thermal Model

Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.

scholarly journals Simulation of Thermal and Electric Field Distribution in Packaged Sausages Heated in a Stationary Versus a Rotating Microwave Oven

Foods ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 1622
Author(s):  
Wipawee Tepnatim ◽  
Witchuda Daud ◽  
Pitiya Kamonpatana
Keyword(s):  
Temperature Distribution ◽  
Electric Field ◽  
Three Dimensional ◽  
Development Stage ◽  
Microwave Oven ◽  
Computational Time ◽  
Plastic Package ◽  
Heating Uniformity ◽  
The Cost ◽  
Good Agreement

The microwave oven has become a standard appliance to reheat or cook meals in households and convenience stores. However, the main problem of microwave heating is the non-uniform temperature distribution, which may affect food quality and health safety. A three-dimensional mathematical model was developed to simulate the temperature distribution of four ready-to-eat sausages in a plastic package in a stationary versus a rotating microwave oven, and the model was validated experimentally. COMSOL software was applied to predict sausage temperatures at different orientations for the stationary microwave model, whereas COMSOL and COMSOL in combination with MATLAB software were used for a rotating microwave model. A sausage orientation at 135° with the waveguide was similar to that using the rotating microwave model regarding uniform thermal and electric field distributions. Both rotating models provided good agreement between the predicted and actual values and had greater precision than the stationary model. In addition, the computational time using COMSOL in combination with MATLAB was reduced by 60% compared to COMSOL alone. Consequently, the models could assist food producers and associations in designing packaging materials to prevent leakage of the packaging compound, developing new products and applications to improve product heating uniformity, and reducing the cost and time of the research and development stage.

Application and Research of Digital Technology in Optimal Design of CNC Floor Boring and Milling Machine

2012 ◽  
Vol 429 ◽  
pp. 111-115
Author(s):  
Zhen Long Leng ◽  
Jin Feng Yang ◽  
Qun Ping Liu ◽  
Xun Deng
Keyword(s):  
Numerical Simulation ◽  
Optimal Design ◽  
Digital Technology ◽  
Three Dimensional ◽  
Milling Machine ◽  
Machine Model ◽  
Digital Modeling ◽  
Key Technologies ◽  
The Cost ◽  
Interference Checking

This paper focuses on application of the three-dimensional digital modeling, numerical analysis and optimization, digital control and other key technologies which provide technical support for the design and development in CNC floor boring and milling machine manufactruing. The three-dimensional digital modeling, digital assembly, interference checking help to eliminate some hidden trouble before processing and assembly. Numerical simulation reduces the cost and shortens the cycle of designand manufactruing in the optimal design of the machine. This technique has been successfully applied to a CNC Floor Boring and Milling Machine Model, which has been running for three years and achieved satisfactary economic result.

Entropy Generation Analysis in Supercapacitor Modules Based on a Three-Dimensional Coupled Thermal Model

2021 ◽  
Author(s):  
Haowen Li ◽  
huachao yang ◽  
Chenxuan Xu ◽  
Jianhua Yan ◽  
Kefa Cen ◽  
...  
Keyword(s):  
Entropy Generation ◽  
Thermal Model ◽  
Three Dimensional

scholarly journals A pseudo three-dimensional electrochemical-thermal model of a cylindrical LiFePO4/graphite battery

2019 ◽  
Vol 147 ◽  
pp. 450-463 ◽  
Author(s):  
J. Chiew ◽  
C.S. Chin ◽  
W.D. Toh ◽  
Z. Gao ◽  
J. Jia ◽  
...  
Keyword(s):  
Thermal Model ◽  
Three Dimensional
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