Integrated Hierarchical Durability Design Tool for Electronic Packaging

2007 ◽  
Author(s):  
Jung-Chuan Lee ◽  
David W. Twigg ◽  
Mostafa Rassaian
Keyword(s):  
Solder Joint ◽  
Acoustic Analysis ◽  
Fatigue Analysis ◽  
Design Tool ◽  
Analysis Tool ◽  
Durability Design ◽  
Order Of Magnitude ◽  
Solder Joint Fatigue ◽  
Free Solder ◽  
Level Analysis

Durability and reliability of solder joint interconnections between electronic parts and printed wiring assemblies (PWA) in a vibration environment is increasingly important since the introduction of lead-free solder, which is known to be an order of magnitude more susceptible to fatigue failure than its tin-lead counterpart. In this paper, an integrated hierarchical durability design tool is introduced to analyze the Line Replaceable Units (LRU) as a whole under a vibration environment. The results will be used for solder joint fatigue analysis. This paper describes the automation of box-, board-, and part-level analyses. The box-level analysis combines PWA’s and the mounting chassis in an automated fashion. The construction of PWA’s is also through this automated tool. NIKE3D-based acoustic analysis tool is conducted on the assembled model for vibration analysis. The results are exported to the automated part-level analysis for final solder joint fatigue analysis and to subsequent visualization display. This paper illustrates this detailed processes and presents a simple example will be presented.

Overview of Fatigue Failure of Pb-Free Solder Joints in CSP/BGA/Flip-Chip Applications

2009 ◽  
Vol 6 (3) ◽  
pp. 149-153 ◽  
Author(s):  
Sean M. Chinen ◽  
Matthew T. Siniawski
Keyword(s):  
Finite Element ◽  
Solder Joint ◽  
Finite Element Methods ◽  
Flip Chip ◽  
Snagcu Solder ◽  
Design Considerations ◽  
Mode Of Failure ◽  
Solder Joint Fatigue ◽  
Free Solder

The purpose of this paper is to provide an overview of SnAgCu solder joint fatigue in BGA/CSP/flip-chip applications and the concern of long-term reliability. The most common mode of failure is ductile fracture due to creep strain. Several methods of predicting the overall life of the solder joint are the Coffin-Manson approach, a constitutive fatigue law, and a damage based model using FEM (finite element methods). The effects of underfill and its processes as well as design considerations that will increase reliability will also be discussed.

“I Can See What You’re Saying”: Clinical Utility of Spectral Moment Analysis

2011 ◽  
Vol 21 (2) ◽  
pp. 44-54
Author(s):  
Kerry Callahan Mandulak
Keyword(s):  
Speech Production ◽  
Speech Signal ◽  
Clinical Utility ◽  
Acoustic Analysis ◽  
Moment Analysis ◽  
Analysis Tool ◽  
Spectral Moment ◽  
Clinical Measure ◽  
Perceptual Analysis ◽  
Disordered Speech

Spectral moment analysis (SMA) is an acoustic analysis tool that shows promise for enhancing our understanding of normal and disordered speech production. It can augment auditory-perceptual analysis used to investigate differences across speakers and groups and can provide unique information regarding specific aspects of the speech signal. The purpose of this paper is to illustrate the utility of SMA as a clinical measure for both clinical speech production assessment and research applications documenting speech outcome measurements. Although acoustic analysis has become more readily available and accessible, clinicians need training with, and exposure to, acoustic analysis methods in order to integrate them into traditional methods used to assess speech production.

scholarly journals Inspection planning by defect prediction models and inspection strategy maps

2021 ◽  
Author(s):  
Elisa Verna ◽  
Gianfranco Genta ◽  
Maurizio Galetto ◽  
Fiorenzo Franceschini
Keyword(s):  
Probabilistic Models ◽  
Prediction Models ◽  
Design Tool ◽  
General Interest ◽  
Manufacturing Processes ◽  
Analysis Tool ◽  
Manufacturing Companies ◽  
Inspection Planning ◽  
Inspection Strategy ◽  
Defect Prediction Models

AbstractDesigning appropriate quality-inspections in manufacturing processes has always been a challenge to maintain competitiveness in the market. Recent studies have been focused on the design of appropriate in-process inspection strategies for assembly processes based on probabilistic models. Despite this general interest, a practical tool allowing for the assessment of the adequacy of alternative inspection strategies is still lacking. This paper proposes a general framework to assess the effectiveness and cost of inspection strategies. In detail, defect probabilities obtained by prediction models and inspection variables are combined to define a pair of indicators for developing an inspection strategy map. Such a map acts as an analysis tool, enabling positioning assessment and benchmarking of the strategies adopted by manufacturing companies, but also as a design tool to achieve the desired targets. The approach can assist designers of manufacturing processes, and particularly low-volume productions, in the early stages of inspection planning.

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

2016 ◽  
Vol 46 (3) ◽  
pp. 1674-1682 ◽  
Author(s):  
Yan Li ◽  
Olen Hatch ◽  
Pilin Liu ◽  
Deepak Goyal
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Root Cause ◽  
Free Solder
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